Huawei officials have publicly announced the design idea of stacking chips with area for performance and stacking performance, and this news really makes everyone excited, because Huawei officially announced the existence of stacked chip technology, which means that Huawei is working hard to solve the problem of chip shortage. At the same time, Huawei's technical patents for stacked chips have also been exposed, and from the exposure of Huawei's stacked chip patents, it is completely different from Apple's design ideas.
Huawei's patent for stacking chips has been exposed, using the method of stacking up and down
The relevant content of Huawei's stacked chips has been exposed, and in the relevant patents applied by Huawei, it can be seen that Huawei's stacked chip design idea is to package the two chips in a top-down stacking method. At the same time, the two chips will retain one end of the interface and the outside world, from the relevant information of the patent, there are still many highlights, such as in the demand for limited power supply, the stacked chip can ensure good power consumption, thereby saving a higher amount of cost, so that the semiconductor chip per unit of power to produce higher performance.
The chip packaging idea of apple M1 Ultra is completely different
In fact, Huawei's stacking chip patent technology, Apple has achieved mass production in advance, such as Apple's current strongest processing Apple M1 Ultra, this processor is to package two Apple M1 Max chips. However, Huawei's idea of stacking chips is to connect the two chips up and down, while apple M1 Ultra is to splice two chips on the plane, the two ideas are completely different, and each has its own advantages and disadvantages.
Huawei's stacked chips are thicker than a single chip, and Apple's M1Ultra has twice the area of a single chip, so it is completely different in the environment used.
There are still two major tests
Although Huawei's patents for stacking chips have been exposed, there are still two major problems to be solved if they want to achieve mass production in the end. The first problem is the design of the space inside the phone. Judging from the information of Huawei's stacked chips, the stacked chips need to be superimposed by two chips, so they are thicker than the traditional single chip in terms of thickness. This has higher requirements for the narrow space inside the mobile phone, after all, the integrated design requirements inside the mobile phone are very high, and the thickness of the chip is doubled, which also poses a greater challenge to the industrial design capabilities of Huawei mobile phones.
The second is how to solve the heat dissipation after the increase in the thickness of Huawei's stacked chips and the increase in power consumption, which is the second problem. In the case of the same size of the mobile phone body, the thickness of the chip increases, and it is obviously impossible to place a complete heat dissipation material on the motherboard, which also poses a new challenge for the design of the heat dissipation material. Moreover, the increase in chip thickness also makes the original precious space of the mobile phone more precious, and at the same time, it also causes certain difficulties in the heat dissipation of the mobile phone, which is also the second problem that the stacked chip continues to solve.
Exclusive views
Although there are still many problems to be solved, but the exposure of Huawei's stacked chip patents, let us see hope, perhaps soon equipped with stacked chips Huawei's self-developed mobile phones will continue to meet with consumers, Huawei mobile phone catfish effect will make the mobile phone market shine a new light.