It's the end of March, and it's only a matter of time before the weather gets hot, but it's not just the weather that's hot, it's also the phone.
Back in the summer, the problem of mobile phone fever has affected the daily use of consumers, and manufacturers have even had to push updates to limit soC performance output to reduce the temperature. It is worth noting that mobile phone fever is a systematic problem, involving chips, performance scheduling, internal design, mobile phone positioning and other dimensions.
So how do you deal with it as an ordinary user? In addition to considering the following mobile phones that take into account power consumption and performance, we can actually reduce the temperature of the mobile phone through peripherals and manual adjustment of settings.
Sub-flagships are not a good choice
Snapdragon 8 is still the mainstream choice of this year's high-end flagship, this chip performance is very strong, but the power consumption is also not low, different mobile phone manufacturers will adjust the performance output through the performance scheduling strategy with their own styles, but from the perspective of marketing, manufacturers often call themselves "How to Train Your Dragon" to show their skills in chip tuning.
In essence, the manufacturer is nothing more than to choose between "frame number", "screen protection", and "temperature protection", ensuring that two of them are often difficult to take into account the third. For example, a Snapdragon 8 mobile phone may be able to run "Glory of the King" smoothly at high refresh rate and low temperature, but the picture is only 720P, for comparison, the 2020 Snapdragon 865 running "Glory of the King" can achieve 1080P picture quality, because the performance and power consumption of the chip at that time are far less exaggerated than today.
For manufacturers, this is a realistic choice, but for consumers who want to pay, it is a difficult reality to accept. In a sense, instead of tangling with the experience of high-end flagships, sub-flagships that can better balance performance and power consumption may be a more pragmatic choice.
These mobile phones are equipped with chips such as Snapdragon 870, Tianji 8100, Snapdragon 778G and the like, although the absolute performance is not as good as today's flagship chips such as Snapdragon 8 and Tianji 9000, but it is smooth and not stuck when running APP and games, and the power consumption and heat are relatively small. On top of that, these phones are now quite affordable.
OPPO Find X3
3499元（8GB+128GB）
Although this is a mobile phone released last year, the balanced Performance Snapdragon 870, excellent 2K screen and image specifications, coupled with a very real price, makes it still very competitive this year.
The OPPO Find X3 is in line with its Pro version in core specifications, and is also equipped with dual 50MP IMX766 lenses (main camera + ultra-wide), 13MP telephoto and 60x microscope lenses. In particular, this IMX766 with freeform lenses is ultra-wide angle, and it is used and cherished. This year, many flagship machines are "knife" into 50 million pixelSel JN1 ultra-wide angle, although the pixels are comparable, but in the hardware anti-distortion, clarity, hair color, specifications are not as good as the Find X3 this ultra-wide angle, belongs to the dimensionality reduction blow.
Compared with this year's OPPO Find X5, OPPO Find X3 is better than having a 2K screen and a more affordable price, and this phone has taken good photos after nearly a year of optimization, compared to other Snapdragon 870 models, the performance is more balanced, and the performance and images are taken care of.
Redmi K50
From 2399 RMB (8GB+128GB)
This phone is one of the popular models in March, and the highlight is that it is equipped with Tianji 8100, which returns to the 4+4 cluster architecture, and the advantage is that it has more stable performance under heavy loads.
Tianji 8100 itself has the same performance as the Snapdragon 888, and the Performance of Redmi K50 is radical, running "Original God" for 30 minutes continuously, with an average frame rate of 57.8 frames, and the fuselage can still be maintained at a relatively "cool" temperature of up to 45.7 °C.
If you pursue a mobile phone that takes into account both performance and power consumption, in addition to the Snapdragon 870, Tianji 8100 is also a choice worth paying attention to. However, because most of the optimization experience of manufacturers is based on the Snapdragon platform, the mobile phones currently equipped with Tianji 8100 and Tianji 9000 are not outstanding in terms of image performance, and they need to be optimized for a long time. If you care about images, it is still recommended to choose the version of the Snapdragon platform first.
Honor 60 Series
From 2499 RMB (8GB+128GB)
When you see this model may be strange, the series of Snapdragon 778G and 778G+, the performance of the Snapdragon 870 and Tianji 8100 is indeed not bright enough, but the series of chips in daily use of low power consumption and good image and network support, not to use will emit perceived heat, the operation is relatively calm.
Such an optimized model as the Honor 60 series really does not lose some flagship models when used. In the game, the Honor 60 series also supports 120 frames of "Glory of the King", with an average frame rate of 120.3 frames, and now many Snapdragon 8 flagship machines that want to balance power consumption may not be able to achieve this game experience.
For the Snapdragon 778G (+) does not have to be exaggerated, nor does it need to be demonized, if it is not concerned about the heavy load game of "Original God", it is also an object worth paying attention to.
It is worth noting that the same chip mobile phones that are not mentioned do not mean that they are not good, such as Xiaomi 10S, True Me GT Master Exploration Edition, Redmi K40, etc. are all good purchase options, and the above mentioned is only a representative model of the three chips.
There are also non-hot flagships
But if you want to pursue a flagship chip phone with a low temperature, there are not many options.
One is a gaming phone. Taking the Red Devil 7 series as an example, the series of mobile phones improves the utilization rate of the Snapdragon 8 super core, participates more in the operation of the mobile phone, and on the basis of the same Snapdragon 8, has a stronger performance than the conventional mobile phone, opening up a significant gap.
In addition, the Red Devil 7 series and the Savior Y90 both have built-in fans in the phone for active heat dissipation. Although it is not easy to say how much a fan the size of a fingernail can play in the heat dissipation of mobile phones. But from the final result, gaming phones with active cooling do have lower body temperatures.
For example, the Savior Y90 runs "Original God" for 1 hour continuously, with an average frame number of 56.8 frames, the maximum temperature of the fuselage is 42.9 ° C, and the temperature of the holding area of the Red Devils 7 Pro is only 39.4 ° C, which is already a relatively low temperature in the Snapdragon 8 mobile phone.
The other is the iPhone. Because the A15 bionic chip has a very high energy efficiency ratio, the temperature can be maintained relatively lower in daily use under the premise that the thermal configuration is far inferior to that of Android mobile phones. In this year's wave of Snapdragon 8 mobile phone boom, it highlights the advantages of A15 bionic, and the Kirin 9000 can not be outdated this year for similar reasons.
For users who buy other flagship mobile phones, if they care about the heat, they can reduce the heat generation of the mobile phone through some external forces.
A variety of means and methods of cooling
In addition to the phone itself, we can also reduce the temperature of the phone through some external forces.
Heat dissipation back clip This is now most users will choose the mobile phone cooling means, heat dissipation back clip using the Peltier effect of semiconductor materials to achieve cooling. Simply put, after the heat dissipation back clip is energized, it can achieve heat absorption at one end, heat dissipation at the other end, and finally achieve cooling operation, but the heat dissipation back clip also has its limitations.
Although the heat dissipation back clip can cool down, it has a high power consumption, about 7W, which is equivalent to the average power consumption of a Snapdragon 8 mobile phone to play 30 minutes of "Original God". Therefore, the heat dissipation back clip generally needs to be independently powered by a separate power supply, if there is a need for outdoor use, it is recommended to carry the charging treasure with you. In addition, the chip position, button layout, and camera module size of each mobile phone are different, so the heat dissipation back clip sometimes cannot cover the heat source, and the heat dissipation effect may not be so good at this time.
As for the purchase of heat dissipation back clips, it is recommended to buy more than 100 price points, such as the heat dissipation back clips launched by Black Shark and Red Devils, there are many suitable sizes to choose from. This kind of heat dissipation back clip on the one hand has a larger heat dissipation area and effect, on the other hand, there is better quality, the time is longer, although dozens of pieces are not unusable, but the workmanship is uneven, it is really difficult to compliment.
In addition to the heat dissipation back clip, there is also a heat dissipation peripheral that deserves attention, that is, mobile phone liquid cool heat dissipation. This heat dissipation method has a strong sense of ceremony, and its principle is the same as the water cooling heat dissipation of the computer chassis, by transmitting the water cooling liquid to the matching mobile phone case or fixture, and then dissipating the heat of the mobile phone.
One thing to say is that this heat dissipation method is really useful, which can effectively reduce the temperature of the mobile phone under heavy load games. It's just that it comes at the cost of mobility, which requires users to have a relatively fixed use environment, which is particularly practical for game streamers.
In addition to adding peripherals, there is also the ability to turn on the air conditioner. This is a relatively rustic way of dissipating heat, but it is probably also the most efficient, because turning on the air conditioner reduces the ambient temperature. In an air-conditioned room with a lower ambient temperature, the passive heat dissipation efficiency and body temperature of the mobile phone itself will be much better. As summer draws closer, this approach is highly feasible.
At the peripheral level, the current heat dissipation back clip is still the best choice. As for the heat dissipation phone case on the market, in addition to the OPPO Find X5 Pro, which has a patented heat dissipation shell, the others do not have to try, there is no obvious effect. If there is no condition, you can also use some "soil methods", such as wiping with wet paper towels, cooling stickers and other methods to reduce the temperature of the mobile phone.
In addition to purchasing mobile phones, peripherals, and adjusting the way to cool down the environment, users can also reduce the game's screen and refresh rate settings, reduce the load of the mobile phone to appropriately reduce the temperature of the mobile phone.
In the case of Glory of Kings, you can set the game resolution and frame rate to "High" and use the default "HD" quality, or for heavily loaded games like Original God, using the default medium quality or only increasing the frame count to 60. Appropriately lowering the game screen settings can greatly reduce the load of the game on the phone.
In general, there are many ways for ordinary users to reduce the temperature of mobile phones, although it is impossible to solve the systemic problem of excessive heating of mobile phones from the root cause, but in the end it can still be avoided or alleviated.
What exactly is the source of the fever
Faced with this problem, the first reaction is soC.
The SoC is the cornerstone of mobile phone operation, and naturally it is also the place where the heat on mobile phones is the largest, which is more evident on the flagship SoC with the strongest performance. At present, the mainstream flagship SoC has A15 bionic, Snapdragon 8, Tianji 9000, all using advanced processes such as 4nm or 5nm, why is the heat-related public opinion more concentrated on the Snapdragon 8? In fact, it is still due to the high power consumption of this chip.
At the CPU level, the Snapdragon 8 multi-core score is 3810 points, which is still far from the A15 bionic 4908, but its power consumption reaches 11.1W, and the energy efficiency ratio is not outstanding. Even compared with the CPU architecture of the basically the same Tianji 9000, multi-core 4474 points, Snapdragon 8 is also at a disadvantage in multi-core performance, energy efficiency ratio also does not reflect the advantages. In addition, the power consumption of the A15 bionic is not as low as everyone thinks, but it is better than the energy efficiency ratio.
At the GPU level, this part is the key upgrade of the Snapdragon 8, which only lags behind the A15 bionic in these chips, but does not open the gap with the Tianji 9000. But in contrast, the energy consumption of Snapdragon 8 reaches 11.2W.
No matter at what level, for mobile phones, the power consumption of Snapdragon 8 is indeed relatively high, especially the CPU part that supports the operation of mobile phones, so it is understandable why mobile phone manufacturers should pay so much energy to adjust this chip. But in fact, Snapdragon 8 can have today's performance has been quite good, compared to Samsung using a similar architecture of Exynos 2200, performance do not know how many knives have been slashed, may not be able to reach the level of Snapdragon 8.
In fact, in the Snapdragon 888 era, the problem of large heat generation and high power consumption already exists. From the final result, Snapdragon 8 is more like an improved version of Snapdragon 888, CPU performance growth is not obvious, GPU performance can finally break the wrist with Apple, although the heat has eased, but the power consumption is still maintained at a relatively high level.
I wonder if the X2 super core, A710, A510 core launched by ARM should come to the back of the Snapdragon 8 heating pot, but the chip architecture is basically the same as the Snapdragon 8 Tianji 9000, and it is not so exaggerated in terms of heat and power consumption, plus MediaTek has spent considerable energy on the internal design of the chip to catch up with the Snapdragon platform on this generation of flagship chips.
There is also a point of the process process, from the final chip performance and Apple, Huawei and other manufacturers' choices, TSMC process technology is stronger than the Samsung process, and the biggest advantage of Samsung FOUNDRy is to ensure that Qualcomm chips are delivered to manufacturers on time. If the problem is in the process process, then the reason may be that the multi-layer metal wire inside the Snapdragon 8 is not perfect due to the Samsung process, and the resistance of the electrons when passing is too large, which in turn leads to a large heat generation of the chip.
However, in contrast, if Qualcomm's chip design is insufficient, resulting in high power consumption, even if the TSMC process is replaced, the final effect may not be much better than it is now. As for how TSMC's version of Snapdragon 8 performs, it can only wait for the performance of the high-end Android flagship in the second half of the year.
It is worth noting that this is the result of horizontal comparison, and looking at each flagship chip alone, it is also possible to have a large problem of heat generation. For example, the iPhone 13 series that has flourished in the high-end market this year, the A15 bionic on it may also be too hot in daily use, and even when calling, the Mate40 series using the Kirin 9000 occasionally has a similar situation.
As mentioned above, mobile phone fever is a systemic problem, because mobile phones are not only consumer electronics that everyone has, but also a highly integrated communication tool. So now the mobile phone fever is larger, in fact, it is not entirely the problem of mobile phone SoC.
You can't blame the chip
Before we dive further, let's move on to a recently released phone, the iPhone SE. Although this phone looks a bit retro, its power consumption and heat generation are much better than the iPhone 13 equipped with the same A15 bionic. Because the iPhone SE only retains relatively simple hardware and functions due to its own positioning, it still uses a single-layer motherboard, rather than the double-layer motherboard of the iPhone 13, that is, a stacking board.
It is precisely because of the single-layer motherboard, but it is more conducive to mobile phone heat dissipation, coupled with A15 performance support, the daily use experience of iPhone SE may not be worse than the Android flagship, which is why some netizens jokingly call it "the strongest mobile phone within 7998 yuan (because the iPhone 13 Pro is from 7999 yuan)".
Therefore, the internal architecture of the mobile phone will also affect the heat dissipation of the mobile phone, which will become more and more obvious in the future. At present, the form of smart phones is still dominated by the straight board, in a long period of time will not change much, based on this premise, with the increase in mobile phone functions, it will inevitably cause an increase in internal hardware, so that the density of internal parts of the mobile phone is getting larger and larger, and the heat dissipation conditions are getting worse and worse, resulting in an inevitable increase in heat.
In addition, now smart phones, especially flagship phones, such as the iPhone 13 mentioned above, mostly use double-layer motherboards to support the rich functions and hardware of flagship mobile phones, which is equivalent to folding a single-layer motherboard into two layers, so that you can squeeze out space, place a larger battery, stronger image specifications, a larger area of the heat sink, etc., at the cost of squeezing the heat dissipation space of the motherboard to a certain extent.
So after so much effort, why is the heat dissipation performance still poor? On the one hand, the heat dissipation efficiency of double-layer motherboards is not as good as that of single-layer motherboards, just like the temperature perceived by human cover quilts and unlided quilts is completely different.
On the other hand, the heat dissipation measures such as VC vaporized version, graphite plate, copper foil and so on used in mobile phones do play a role, but the effect it plays is based on the power consumption within a certain range, if the actual power consumption exceeds the threshold, the excess part is converted into the "heat is large" in our cognition. Sometimes it is not that the heat dissipation measures of the mobile phone are not powerful, but the chip power consumption cannot be stretched.
Of course, the solution is not nothing.
In terms of form, this requires a breakthrough change in the form of mobile phones, and at present, only folding screen mobile phones are relatively close to this point, especially horizontal folding, and the larger internal space has a relatively good heat dissipation effect;
In terms of performance, limiting the performance output of chips, especially flagship SoCs, although some consumers do not like relatively conservative performance output, but for most users of daily use and light games, this will probably be a more pragmatic strategy;
Optimize power efficiency in terms of power consumption. iPhone is a typical example of this route, iPhone interior compact, high utilization, no space to place such as Android phones as luxurious cooling configuration, that is, by improving the energy efficiency of the chip, improve performance, reduce power consumption, so that the phone can run at a lower temperature in most cases;
In terms of materials, wait for a breakthrough in new materials. This requires a long period of energy, financial resources, and talent investment, which is a super-long-term test for domestic manufacturers in the mobile phone market.
Write at the end:
Mobile phone performance will improve every year, the relative power consumption will also increase, chip design level can only do as much as possible to reduce power consumption, improve energy efficiency ratio, but the general trend is still rising. Mobile phone fever is a problem to be faced sooner or later, but the flagship chip in the past two years has objectively advanced the timing of this problem.
But the problem of development can only be solved through development, but it takes time to precipitate. Because when Moore's Law grows to a certain point in time, it must slow down, and the breakthrough of the problem is not where we are thinking. But from another point of view, compared to the brilliant flash, waiting for the gradual quantitative change to trigger qualitative changes is worth looking forward to.
In order to compete for a larger market share, the relevant companies as participants will definitely use various ways to improve the performance and energy efficiency ratio of chips, even if they do not use new processes, and the recently released M1 Ultra is a phased proof of the industry's progress in the short term.
For consumers, these things sound somewhat illusory, and even better than giving the mobile phone a heat dissipation back clip, but when we are witnesses, witnessing the progress of the semiconductor industry, especially the mainland semiconductor industry, it is undoubtedly an exciting thing.