Qualcomm released a large number of new products at the MWC 2022 live broadcast event, and for the majority of consumers, the three most important products are undoubtedly the Snapdragon X70 modem, the Fastconnect 7800 connection subsystem, and the Qualcomm S5 and Qualcomm S3 low-power wireless audio platforms. According to Qualcomm, mobile device terminals equipped with the above new products are expected to enter the market in 2022.
Snapdragon X70 modem: The introduction of AI for the first time has greatly improved actual performance
Starting with the original Snapdragon X50 modem, each generation of Qualcomm's 5G modems has been constantly refreshing network speeds, and 10Gbps network rates have been provided in Snapdragon X65 modems. Higher network speed is certainly a criterion for technical strength, but from the actual network deployment level, this standard is a serious overdraft in performance, and ordinary consumers cannot reach this speed at all.
In the new generation of Snapdragon X70 modems, Qualcomm did not continue to increase the maximum network speed, maintained the maximum downstream rate of the previous generation of 10Gbps, through the introduction of AI technology and other new technologies, strengthen network band support, effectively increase the user's network experience, and assist network operators to flexibly deploy 5G networks.
Through Qualcomm's 5G AI suite, the Snapdragon X70 modem can improve transmission speed, network coverage, mobility, link robustness and energy efficiency performance, and reduce network latency. The addition of AI technology can monitor and feedback channel status information on the entire communication system in real time, and provide more accurate information feedback through prediction, thereby improving data throughput and other key performance indicators.
In the RF front end, AI technology can intelligently detect the position of the user's hand holding the terminal, and dynamically tune the antenna in real time; in the use of the millimeter wave band, the uncertain environment can be checked and predicted through AI, thereby helping to optimize the focus and direction of the millimeter wave beam. Combined with the 3rd generation of Qualcomm 5G PowerSave technology, the Snapdragon X70 will increase energy efficiency by 60%, coupled with Qualcomm envelope tracking technology support, can make mobile terminals very power-efficient in 5G communications.
In areas where the network frequency band covers very complex areas, AI can more intelligently select the corresponding network frequency band to avoid the risk of possible disconnection. This point has a great role in the domestic market, after all, the 5G/4G/3G/2G network is used at the same time in the domestic market, and it is more necessary to switch the network in time where there is a difference in signal coverage to ensure normal use.
In terms of network connection performance, the Snapdragon X70 modem provides sub-6GHz band downstream four-carrier aggregation support, and provides FDD and TDD joint carrier aggregation support, for example, four-carrier aggregation can be formed in 2 TDD bands and 2 FDD bands, enabling operators to have a more flexible way of networking. In terms of upstream rate, Snapdragon X70 provides a maximum uplink speed of 3.5Gbps, supports upstream carrier aggregation across FDD and TDD bands, and uses the continuous emission of FDD as a supplement to TDD, obtaining the effect of continuous transmission in the time domain, thereby maximizing the use of mobile phone transmission power.
In terms of band support, Snapdragon X70 still provides global 5G network band support, covering all 5G band support from 600Mhz to 41GHz. Millimeter Wave stand-alone networking support enables operators that only operate mmWave bands to quickly network. In the multi-SIM card technical support, dual-sim dual-pass support is provided, so that the two SIM cards do not interfere with each other.
Fastconnect 7800: The world's first Wi-Fi 7 solution
In the new generation of Snapdragon 8 mobile platform, the built-in Fastconnect 6900 connection subsystem, after all, the Wi-Fi network technology has not been upgraded, there is no new technology specifications to choose from. However, Qualcomm's solution for the new generation of Wi-Fi 7 technology is ready to go.
The Fastconnect 7800 connectivity subsystem is the world's first Wi-Fi 7 solution, supporting peak speeds of up to 5.8Gbps and latency of less than 2ms. On the Bluetooth connection, LE Audio and Bluetooth 5.3 are supported, which brings halved power consumption through Smart Dual Bluetooth, shortens device pairing time, and greatly increases the connection range. At the same time, the Snapdragon Sound Snapdragon Listening Technology is expanded into two channels, bringing CD-level lossless sound quality and enhanced audio sharing capabilities.
Although the Wi-Fi 7 standard has not been officially released, FastConnect 7800 has provided Wi-Fi 7 feature support, and can be certified after the corresponding standard is developed. In fact, some Wi-Fi 7 standards, Qualcomm has been pre-supported, such as in the 4K QAM modulation mode, Qualcomm has been supported in FastConnect 6900.
The FastConnect 7800 provides 320MHz channel bandwidth support, enabling network speeds to be doubled again. Even without a continuous 320MHz channel, 320MHz bandwidth can be achieved through 160MHz + 160MHz by using two Wi-Fi radios at the same time through high-frequency multi-connection concurrency, which can bring network speeds of up to 5.8Gbps, which we can understand as carrier aggregation in Wi-Fi networks. For the domestic market that does not have an open 6GHz band, the FastConnect 7800 can achieve 240MHz bandwidth in the 5G band through 160MHz +80MHz, and the network speed can be increased to 4.3Gbps.
FastConnect 7800 extends the 4-channel dual-band concurrent feature to the high frequency band, using this technology to allow mobile phones to connect and mirror through two 5GHz respectively, the two 5GHz links can work independently at the same time, do not interfere with each other, and the latency is very low. This can also allow the phone to completely release the 2.4GHz band, making it specially used to connect low-speed devices and reduce signal interference in this band.
Qualcomm S5/S3 Audio Platform: Snapdragon Sound Snapdragon Listening Technology Low-power CD lossless sound quality
Both the Qualcomm S5 Audio Platform (QCC517x) and the Qualcomm S3 Audio Platform (QCC307x) support Snapdragon Sound Snapdragon Listening Technology. Both platforms are optimized and support dual Bluetooth modes, combining classic Bluetooth wireless audio with the new LE Audio technology standard.
The Qualcomm S3 audio platform and Qualcomm S5 audio platform can achieve 2 times the computing performance of the previous generation SoC, with a 20% reduction in power consumption and a 25% reduction in latency. With Snapdragon Sound Snapdragon Listening Technology, Qualcomm has achieved end-to-end full-link system optimization and innovation in connectivity technology.
Adaptive to different music source file resolutions can be dynamically adjusted in different usage scenarios, supporting HD, Ultra HD and lossless audio. Supports immersive gaming for ultra-low end-to-end latency. It also provides dynamic adaptive active noise reduction.