Here comes Redmi's new year's masterpiece "K50 Esports Edition" today's official announcement. With the product oath of "full line", the hardcore Dream Phone specially created for K series users is looking forward to seeing you live at 19:00 on February 16!
Positioning the K series "performance peak" flagship, a number of new technology debuts, hardcore to the end, performance, there are a number of experience breakthroughs, K50 e-sports edition, will bring you an unreserved configuration upgrade.
Performance is full
Snapdragon 8 Cold-Blooded Flagship
K50 Esports Edition challenges the "Coldest Snapdragon 8" to unleash extreme performance. New process, new architecture, performance upgrades. Luxury stacked refactoring design, vowing to do technological innovation.
Probably the strongest graphics performance Android has ever had!
With the new generation of Adreno GPUs, performance is increased by 52% and power consumption is reduced by 1/4.
VRS variable resolution rendering technology for esports
Each frame can be rendered at different resolutions for characters and special effects. Improve game quality and significantly reduce power consumption.
Refactoring file read-write architectures challenges the extreme performance experience
Change traditional single-threaded reads and writes to multithreaded. Decompression speeds up by 100% and copy speeds up by 300%.
Frozen universe
Extreme heat dissipation Big challenge
Thanks to the strong performance of the Snapdragon 8, the K50 esports edition is bound to become a cold-blooded flagship that challenges the limit of heat dissipation. To this end, the K50 esports version has a domineering name: "Frozen Universe", if you use one word to summarize the K50 esports version of the strong heat dissipation, that is: too much force.
Full-link optimized heat dissipation
From the whole machine structure, to chip heat conduction, VC heat transfer, graphite thermal diffusion, Redmi heat dissipation expert group, for the entire thermal link to do 5 major material upgrades, the whole link without shortcomings, improve heat dissipation efficiency.
Dual VC double heat dissipation
Behind the K50 e-sports version of the dual VC, it is the mobile phone heat dissipation design and reconstruction. The heat source is distributed in a decentralized layout, and the dual areas are efficiently dissipated, just like a room, and two air conditioners are turned on at the same time. Heat dissipation efficiency is greatly improved.
4860mm Large VC area
The K50 esports edition may have the largest heat dissipation area in history of 4860mm. Adhering to the "can be expensive is expensive, can be big is big, can be new is new" this heat dissipation design guidelines, full of "pull full" spirit, in order to be in the love of the e-sports field cold-blooded town field, more frames smooth, less degrees of hot.
A new generation of stainless steel VC
The K50 Esports Edition uses a new generation of "ultra-thin stainless steel" VC to dissipate heat. 300 mesh ultra-dense capillary structure, thermal conductivity increased by 40%, challenging the VC heat dissipation limit, ultra-thin stainless steel, lighter and stronger.