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Redmi K50 Esports Edition Detail Exposure: Uses 3D micro-shrink technology

On February 10, 2022, the official Weibo of Redmi Mobile released the appearance details of the Redmi K50 e-sports version, showing a large number of design details on the back shell and sides of the phone.

Redmi K50 Esports Edition Detail Exposure: Uses 3D micro-shrink technology

Judging from the pictures, the K50 esports edition features an all-metal border and achieves a rounded and mechanical grip. According to The Redmi Mobile Phone, the Redmi K50 E-sports Edition has carried out more than 40 metal cuts and used 3D micro-shrinkage technology to achieve a perfect transition with the fuselage. As an embellishment on the metal frame, the K50 esports version of the button also uses three-dimensional cutting technology, and the CD texture is designed on the waist button, which ensures a beautiful look and feel while maintaining ease of use.

The redmi K50 esports edition is top-notch in configuration, using the top-of-the-line new Snapdragon 8 processor, and there is no doubt about the performance. In terms of heat dissipation, the dual VC design scheme is adopted, and two VC heating plates are used inside the fuselage, which can quickly export the heat from the main heat source, enabling the processor to continuously perform high-performance output.

Redmi K50 Esports Edition Detail Exposure: Uses 3D micro-shrink technology

The battery capacity is expected to be 4700mAh, using 120W fairy seconds charge, it is expected to be fully charged in about 17 minutes. This is also the top fast charging specification supported by the current Redmi mobile phone, which is different from the single-cell solution of Xiaomi 12 Pro, but follows the dual-cell fast charging scheme, which is more extreme in terms of charging speed.

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