This year, the gap rate of ABF carrier boards is still more than 20%.

Abstract: According to the Industry and Commerce Times, although the supply of IC carrier board industry is not news, but with the expansion of new applications, ABF carrier board specifications continue to upgrade, supply shortage is expected to continue, Fubon Investment Advisory estimates that the gap rate of ABF carrier board in 2022 is still more than 20%.

According to the Business Times, although the supply of IC carrier board industry is not news, but with the expansion of new applications, ABF carrier board specifications continue to upgrade, supply shortage is expected to continue, Fubon Investment Advisory estimates that the gap rate of ABF carrier board in 2022 is still more than 20%.

ABF carrier boards are mainly used in high-speed computing chips such as CPUs and GPUs, and in recent years, the demand has been rising under the impetus of emerging applications such as 5G, autonomous driving, cloud computing and AI. Fubon Investment Advisory estimates that the abf demand growth rate in 2022 is as high as 53%, while the capacity expansion of carrier board manufacturers is only about 30%, so supply and demand in 2022 are still tight.

The Goldman Sachs report identifies advanced packaging and continuous content upgrades as key factors driving demand. Goldman Sachs expects strong growth in the overall ABF market for advanced packaging solutions. In addition, the trend of upgrading key chips such as CPUs (central processing units), GPUs (graphic processors) and customized chips (ASICs) will accelerate, and the ABF carrier board community will be potential beneficiaries as part of the realization of faster computing power.

In addition, according to the report of Tianfeng International analyst Guo Mingxi, Apple's AR/MR equipment will be equipped with dual CPUs, respectively, 4nm and 5nm processes, which are exclusively developed by TSMC; the dual CPUs use ABF carrier boards, and the carrier board is exclusively developed by Xinxing. This also means that Apple's AR/MR devices will use dual ABF carrier boards, which is higher than the market and Tianfeng International previously estimated.