Jiwei network news, Tianfeng International Securities analyst Guo Mingji pointed out in the latest research report that Apple AR/MR equipment uses dual ABF carrier boards, and each headset device will be equipped with 4nm, 5nm dual chips, and all use ABF carrier plates. The CPU and ABF carrier boards are currently developed exclusively by TSMC and Shin Hing, respectively.
According to the survey, in order to provide Faster and more efficient charging of apple AR/MR headsets, this device uses a 96W charger supplied by Jabil and with the same specifications as the MacBook Pro. This charger specification proves that Apple AR/MR's hash rate of hashrate requirements as the MacBook Pro and is significantly higher than the iPhone.
Guo Mingxi predicts that Apple's headset devices will ship 3 million units, 8 million units and 15 million to 20 million units in 2023, 2024 and 2025, respectively. Because each Apple AR/MR headset uses two ABF carriers, apple AR/MR headsets will create 6 million, 16 million, 16 million, and 30 million ABF carriers in 2023, 2024, and 2025, respectively.
It is worth noting that the report said that apple's headset device hash rate is about 2-3 years ahead of competitors, and Qualcomm will launch a VR/AR chip with PC/Mac-level computing power at least until 2023-2024, when Xinxing will benefit from the needs of Apple and other competitors at the same time.
(Proofreading/Sharon)
![Tianfeng International: Apple AR/MR headset computing power is about 2 to 3 years ahead of Qualcomm[fig]](data:image/gif;base64,R0lGODlhAQABAIAAAP///wAAACwAAAAAAQABAAACAkQBADs=)