Pat Gelsinger, who began his first trip to Asia after taking over as Intel's CEO this week, has met with TSMC executives, but the negotiations between the two companies have not gone as Intel had hoped.

Judging from foreign media reports, Pat Kissinger held a closed-door meeting with TSMC executives on Tuesday local time to discuss the cooperation plan between the two companies.
For the cooperation between TSMC and Intel, the focus is on the foundry aspect of the 3nm process. Foreign media also mentioned in the report that representatives of the two companies discussed the OEM matters of the 3nm process.
Foreign media said in the report that Intel hopes to book a separate production line from TSMC to produce their CPUs and GPUs, just like the cooperation between TSMC and Apple.
However, foreign media said in the report that the cost of establishing a separate production line is high, even for Intel is not low, so TSMC hopes that Intel will pay an advance payment for booking a 3nm process production line, but this is not the result of the talks that Intel hopes.
In the report, foreign media also mentioned that Intel knows that TSMC's 3nm process will be very popular with customers in the future, and they also hope to obtain production capacity, but as for whether they can finally book a separate production line, it depends on whether Intel is willing to pay an advance payment.