The demand for power in all walks of life is growing, and how to develop power products that meet the requirements of system design in terms of power level, EMI, conversion efficiency, noise, accuracy, isolation, and cost has brought considerable challenges to power supply design engineers. Taking the server as an example, the size of the cabinet where the server is loaded in the current computer room remains unchanged, but with the gradual advancement of emerging technologies such as AI and the Internet of Things, the amount of data that a single server unit needs to process is several times that of the past, which means that the power demand of the corresponding server unit is also several times that of the past. At present, the most effective solution is to use the latest power management chips, coupled with advanced module packaging technology, to help engineers improve power conversion efficiency, increase power process density, and reduce the overall solution cost. Recently, TI launched its proprietary MagPack, a new magnetic packaging technology for power modules, and simultaneously released six new power module products using this packaging technology. Among them, the TPSM82866A, TPSM82866C, and TPSM82816 are ultra-small 6A power modules that can provide a current output capacity of 1A per square millimeter. The diagram below illustrates the specifics of these six products, such as the main difference between TPSM82866A and TPSM82866C is that the former uses a non-I²C interface, while the latter uses an I²C interface.
Figure | Six new power modules with magnetic packaging technology, courtesy of TI
"In addition to the powerful current output capability, compared with the previous generation of products, the power supply products equipped with TI's new magnetic packaging technology can reduce the size of the power solution by 50%, and the average power conversion efficiency of the power module is also increased by 2%, and the heat dissipation of the module is guaranteed," said Yao Yunruo, product line manager of Texas Instruments' step-up-boost switching regulators. For the TPSM82816, the efficiency performance is even more outstanding, with a 4% increase over the previous generation, a 17% reduction in thermal resistance, and a 10-degree increase in the safe operating temperature range, which is a very big leap. ”
Figure | A New Approach to Improving Power Modules: MagPack Integrated Magnetic Packaging Technology, Source: TI
So what is MagPack integrated magnetic packaging technology? Pioneered by R&D experts at Texas Instruments Kilby Labs, it uses TI's unique 3D package molding process and integrates an integrated inductor package technology made with a proprietary new design material that minimizes height, width, and depth while better conducting heat from within the chip to the PCB. At the same time, by adopting this type of power module, engineers can more easily obtain a power system design with high power density, low temperature, low EMI radiation, and high conversion efficiency. In this regard, Yao Yunruo revealed: "MagPack technology is a fully shielded magnetic packaging technology, which will effectively reduce the radiation level of the power module, and the EMI value can be reduced by up to 8dB. ”
Figure | TPSM81033EVM-035 evaluation board
It is worth mentioning that the six power supplies with MagPack technology for the first time will be mainly used in the industrial field, and are currently available for pre-production and can be purchased through TI.com. At the same time, in order to quickly introduce to the market, TI also offers four evaluation boards, TPSM81033EVM-035, TPSM82866AA0PEVM, TPSM82866CA3PEVM, and TPSM828303PEVM-058. In the future, MagPack technology will also be used in products such as isolated power supplies to enrich the diversity of TI's product lineage.