At the MediaTek Dimensity flagship chip launch event held in November last year, the Dimensity 9300 chip was officially released.
Now, as time progresses, news about the next generation of Dimensity 9400 chips has also emerged.
Digital blogger @DigiChatStation recently broke the news that the Dimensity 9400 will use ARM's latest codename BlackHawk CPU architecture, and the current test progress is good.
The blogger revealed that according to MediaTek's internal verification, the Cortex-X5 ultra-large core IPC>A17 Pro of the Dimensity 9400 > Qualcomm's self-developed Nuvia architecture.
It is reported that the full English name of IPC is "Instruction Per Clock", which translates to the number of instructions executed by the CPU in each clock cycle. At the same frequency, the higher the IPC, the stronger the overall performance of the CPU. Digital blogger @Digital Chat Station said: "It can be roughly understood that it is the bottom of the chip, and the bottom is one level bigger than crushing people."
The blogger also mentioned in the breaking news: "This year's Fa Ge flagship is still full of big cores, and the CPU foundation is very strong, and the plan is to open the book directly at the starting line." ”
A previous revelation by the blogger also showed that Dimensity 9400's "GPU may be called Immortalis G9xx, design performance GB6 single-core 2.7K multi-core 9.8K, Aztec 110fps, the previous generation 99fps, the improvement is still very large".
According to previous reports, the Dimensity 9400 chip will use TSMC's 3nm process, which will increase energy efficiency by 32%.
According to the data mentioned by MediaTek, TSMC's next-generation node (N5) can provide an 18% performance boost at the same power level compared to the N3 node, while reducing power consumption by 32% at the same frequency performance, while increasing the logic density by 60%.
Elsewhere, the Dimensity 9400 is expected to offer LPDDR5T memory support to meet the needs of local AI computing. The Dimensity 9400 will support larger AI models running on the device side, which is expected to surpass the Dimensity 9300's 33 billion parameter large language model.
For reference, the previous generation Dimensity 9300 chip uses TSMC's third-generation 4nm process and "all-large-core" CPU architecture, which contains 4 Cortex-X4 super-large cores with a maximum frequency of 3.25GHz and 4 Cortex-A720 large cores with a main frequency of 2.0GHz. The first to support LPDDR5T 9600Mbps memory.
The Dimensity 9300 integrates MediaTek's 790th generation AI processor APU 790, which supports devices to run AI large language models with 1 billion, 7 billion, 13 billion, and up to 33 billion parameters.
天玑9300率先采用新一代旗舰12核GPU Immortalis-G720，搭载MediaTek第二代硬件光线追踪引擎，支持60FPS高流畅度的光线追踪。
The Dimensity 9400 chip is expected to be released in October, so interested friends can stay tuned.
In addition, the Dimensity 9300+ chip will be released on May 7.
Also from the digital blogger @Digital Chat Station broke the news, Dimensity 9300+ Cortex-X4 ultra-large core frequency will be increased to 3.4GHz, Antutu running score of 2.3 million, Geekbench 6 single-core running score of 2300, multi-core running score of 7700.
For comparison, the Snapdragon 8 Gen3 has an Antutu score of around 2.2 million, the Geekbench 6 has a single-core score of 2200, and a multi-core score of 7200. Compared to the Dimensity 9300+, it is slightly lower in terms of running score.
At the same time, the blogger revealed that the Dimensity 9300+ will be launched by the vivo X100s series. Subsequently, Xiaomi will also launch a new phone equipped with this chip, which is expected to be the Redmi K70 Extreme Edition.