What is the computing power, storage power, and sealing power, today I will analyze it in detail for you

First, what is computing power, storage power, sealing power

1, computing power - CPO

Computing power is widely found in various hardware devices such as mobile phones, PCs, and supercomputers, and without computing power, these software and hardware cannot be used normally.

Computing power can be divided into three categories: the first type is high-performance computing, that is, "supercomputing". The second type of computing power is artificial intelligence computers, which are mainly used to deal with artificial intelligence application problems; The third category is data centers, which are more public services that provide computing power to everyone through cloud computing. Taken together, these three computing centers reflect the computing power of a country.

2, storage power - memory chip

A memory chip is an integrated circuit that stores and reads data. It is commonly used in computers, smartphones, IoT devices, and other electronic devices. There are many types of memory chips, including flash memory, RAM (random access memory), ROM (read-only memory), etc.

Among them, the most common type of memory chip is flash memory. Flash memory is a type of non-volatile memory, meaning that data remains in the event of a power loss or power loss. It is widely used in portable devices such as USB flash drives, solid-state drives (SSDs), and smartphones. Flash memory is characterized by large capacity, durability and reliability, and fast read and write speeds.

RAM (Random Access Memory) is a type of temporary memory that stores data and programs that are currently in use. Unlike flash memory, RAM is volatile memory where data is erased after a power outage. RAM is very fast to read and write, so it is used as the main memory of the computer.

ROM (Read Only Memory) is a memory chip that cannot be written to. It is commonly used to store solidified program code, fixed data, and device configuration information.

Memory chips play a vital role in artificial intelligence systems, providing the ability to store and access data, providing the necessary data support for the computation of machine learning models and algorithms.

3, Sealing power - advanced packaging

Advanced packaging is a key technology in integrated circuit manufacturing for packaging and interconnecting chips and other electronic components to build fully functional electronic devices.

Traditional packaging techniques typically use simpler methods to package chips, such as soldering the chip to a substrate. Advanced packaging technologies, on the other hand, can provide higher levels of integration, smaller size, higher performance, and lower power consumption by employing more advanced packaging processes and materials.

Advanced packaging technologies cover a variety of packaging options, some of the most common include:

1. System-in-Package (SiP): Combines multiple chips and other components into a single package to form a fully functional system.
2. 3D Packaging: Higher level of integration and shorter signal transmission distances are achieved by stacking multiple chip layers on top of each other, resulting in improved performance and space savings.
3. Wafer-Level Packaging (WLP): In the chip manufacturing process, the chip is directly packaged to form a very thin package to improve the performance and compactness of the chip.

Advanced packaging technology is important to drive the development and innovation of electronic devices. It can make devices smaller, faster, more energy-efficient, and open up more possibilities for a new generation of electronics.

Second, the world's leading company of computing power, storage power and sealing power

Hash power

1. Apple: Apple is a world-renowned technology company with its own designs and manufactures processors, such as Apple Silicon chips, leading the way in high-performance computing and mobile devices.

1. Intel: Intel is a leading global semiconductor company with processors used in PCs and servers. Intel's processors have always been one of the benchmarks in the industry when it comes to computing power and performance.

1. AMD (Advanced Micro Devices): AMD is a semiconductor company focused on the design and manufacture of processors and graphics processing units (GPUs). Their processor products are competitive in high-performance computing, workstations, and gaming.

1. NVIDIA: NVIDIA is a semiconductor company with graphics processors at its core. Their graphics processors are widely used in high-performance computing and artificial intelligence, especially in deep learning and machine learning.

These companies have strong computing power technologies and products in different fields and markets, and they drive the development of computing power through continuous research and development. However, the computing industry is highly competitive, other companies and emerging startups are constantly entering the market, and the competition for technological innovation is still ongoing.

Capacity

At present, the world's leading memory chip company is Samsung Electronics. Samsung Electronics is a leading global semiconductor manufacturing company headquartered in South Korea, and its memory chip business has always occupied the leading position in the global market.

Samsung Electronics has a rich product line in the field of memory chips, covering flash memory, DRAM (Dynamic Random Access Memory) and SSD (Solid State Drive) products. Its technology and market share in the field of flash memory occupy a leading position in the world, and it has become a leading enterprise in the global flash memory chip market. In addition, Samsung Electronics also has strong competitiveness in the DRAM field and has a wide range of product lines in the SSD market.

In addition to Samsung Electronics, other important companies in the field of memory chips include Micron Technology, SK Hynix, Intel and Toshiba. These companies have important market positions in the field of memory chips and compete in technology research and development and product innovation.

Sealing power

These companies are leaders in the global advanced packaging technology

1. ASE Group: UMC, a Taiwan-based packaging and test service provider, is one of the world's largest packaging and test companies. They have extensive experience and expertise in advanced packaging and offer packaging solutions for a variety of applications.
2. Amkor Technology: Hongli Semiconductor is a leading global provider of packaging and test services headquartered in the United States. They offer a variety of advanced packaging technologies, including system-in-package, stacked package, and ultra-thin package, providing complete packaging solutions to customers around the world.
3. ASE Technology Holding: VIA Electronics is a Taiwan-based packaging and test service provider and one of the leaders in the global packaging and test market. They have strong technical strength and expertise in advanced packaging and system-in-package areas.
4. VIA Technologies: VIA Technologies is a Taiwan-based semiconductor company focused on advanced packaging technology and system integration. They have extensive experience and technical capabilities in the field of packaging and system-in-package, and offer a variety of packaging solutions.

Third, the industrial logic of advanced packaging

1. Industry logic

Today, the Chiplet sector led the two markets, of which Yong Si Electronics and Kaiger Precision Machinery both 20CM up limit, Zhongfu Circuit, China Wafer Square Technology up limit, Shenkeda, Golden Dragon Electromechanical, Tongfu Micro Electric and other stocks rose first.

Analysts said that chiplet technology has gradually become one of the solutions to improve chip performance and computing power. Due to the AI center training/inference side chips and the edge end chips that are expected to be combined with hardware deployment on a large scale in the future, it is expected to drive future semiconductors into the next round of boom cycle.

Semiconductor packaging is the post-process of the semiconductor manufacturing process, which refers to the process of obtaining an independent chip through the processing of the tested wafer, that is, the process of putting the manufactured semiconductor device into a plastic, ceramic or metal shell with support and protection, and connecting it with external driving circuits and other electronic components.

2. Opportunities in the context of artificial intelligence

1. Advanced packaging is a definite industrial trend in the post-Moore era: advanced packaging is an inevitable choice for the semiconductor industry to surpass Moore's Law and improve system performance, bringing major increments to the packaging and testing market, and the application scenarios are mainly in high-performance computing, high-end servers and other fields, product technical barriers and value will be higher than traditional packaging, focusing on investment opportunities brought by the technological upgrading of traditional packaging manufacturers.

2. Chiplet is expected to become the mainstream packaging solution for high-end computing power chips, helping domestic chips "break the game": In the era of large computing power, the application scenarios of high-performance computing continue to expand, which puts forward higher requirements for the performance of computing power chips, which in turn drives the demand for advanced packaging and Chiplet technology; In addition, Chiplet reduces the cost and threshold of chip design, and its IP multiplexing characteristics improve the flexibility of design, in the environment of limited external conditions for the development of advanced processes in China, Chiplet is expected to become one of the "breakthrough" paths of domestic chips, focusing on leading manufacturers with leading Chiplet technology and mass production capabilities.

3. The vigorous development of the domestic advanced packaging industry will drive the demand for domestic equipment: in the advanced packaging process, the use of traditional packaging equipment and accuracy requirements have been improved, and at the same time, because the process extends to the front link, it brings increments to the front end equipment, increases the market demand for semiconductor equipment, and further promotes the domestic substitution process of semiconductor equipment, focusing on high-quality manufacturers of equipment in the layout of packaging links.

In summary, it is recommended to focus on leading manufacturers with leading advantages in advanced packaging technology and customer resource advantages under the wave of large computing power era, as well as upstream equipment manufacturers that benefit from domestic substitution and the development dividend of advanced packaging industry.

3. Today's A-share performance of the best advanced packaging target

4. The trend of advanced packaging sector

Parse:

This morning, Jingfang Technology, Yong Si electronic bidding grabbed, quickly pulled the board after the opening, driving the packaging concept and chip concept all the way stronger, the plate followed the trend up and down more than 10, but unexpectedly the strong did not start to cash in half an hour, after fear that the ticket began to explode the board down, Yong Si electronic afternoon opening board also fell back nearly 8 points.

Today's most bizarre is the memory chip, from more than 2 points to more than 1 point of minus, closed a long upper shadow of the amount of negative, that from the expected point of view, today's rush back down, tomorrow there is a high probability of a wave of repair rhythm, but this repair game cost performance is also very low, only suitable for the first hand to end out, tomorrow focus on the aspect of the encapsulated index (Chiplet) is now better than storage, then the focus can be on the packaging side, you can pay attention to the opportunity of pullback intervention.