In the first two years, Qualcomm overturned on the flagship chip one after another, giving MediaTek the opportunity to catch up, and MediaTek also seized the opportunity to launch Dimensity 9000 and Dimensity 9200 flagship chips, Dimensity 9000 because it faced the fire dragon Snapdragon 8 Gen1, gained a good reputation, but Qualcomm subsequently returned to TSMC technology, Dimensity 9200 did not take advantage of the Snapdragon 8 Gen2.
But in terms of the actual performance of the product, Dimensity 9200 is significantly improved compared to Dimensity 9000, just because the Snapdragon 8 Gen2 has been improved too sharply this time, making Dimensity 9200 not so good, but as long as MediaTek's products can continue to improve, its future performance is worth looking forward to, and the recent iteration of Dimensity 9200 has also come to news.
According to the blogger digital chat station, the previous code DX3 product is Dimensity 9300, which uses TSMC N4P process, CPU part for 8-core design, but is 4 super large cores + 4 large core design, if this operation is true, it can only be said that the operation of Brother Fa this time is quite explosive, it is indeed a big iteration.
Compared with the relevant revelations of Snapdragon 8 Gen3, its process is also TSMC N4P process, and the CPU is also an 8-core design, but it is 1 X4 super large core + 5 A7XX large core + 2 A5XX small cores, that is, 1+5+2 collocation, but there are also reports that there is a 2+4+2 design.
Judging from the relevant revelations of Dimensity 9300 and Snapdragon 8 Gen3, both have chosen to cut the operation of small cores, which can further improve the performance of the processor, but Dimensity 9300 is more radical this time, directly canceling the small core, for this operation can only say that the small core on the Android side is indeed a chicken rib, and the attitude of Brother Fa daring to be the first is worthy of recognition.
However, some netizens think that Dimensity 9300 uses 4 super large cores, will it lead to the area of the chip can not stand it, in fact, the area of the super core is not as large as many people think, the picture below is Dimensity 9000, the purple part is X2 super large core, and the other 3 red boxes are A710 large cores.
It can be seen that the area of the super large core is really not large, and the area of 4 super large cores + 4 large cores will not be a problem, of course, this does not mean that this combination does not have any, which will definitely have higher requirements for product yield and related design, and how to adjust the relevant scheduling mechanism at that time is also a problem to consider.
And for MediaTek, the CPU part and Qualcomm are not a big gap, the key is the gap in GPU, this time Snapdragon 8 Gen2 can steadily suppress Dimensity 9200, excellent GPU energy efficiency performance is indispensable, Dimensity 9300 How to improve GPU energy efficiency performance is a more critical problem.
In general, if the revelation of Dimensity 9300 is true, its CPU performance running score Snapdragon 8 Gen3 problem should not be big, but the CPU has advantages are not enough, GPU, ISP and other parts are also very important, especially the GPU part is very critical, if you can do GPU and the other party is not much different, Dimensity 9300 should be no pressure to stand in the high-end performance machine market.