According to the news, Intel will officially release the 13th generation of CPUs in the second half of the year, and it can be seen from an internal document that the new generation of platforms still uses the pins of LGA 1700, which is the same as the current 12th generation, and the specifications of the 700 series motherboards have also been exposed.
In the latest leaked official documents, it can be known that the changes in the 700 series are very small, mainly the adjustment of the PCIe bus and USB interface.
The Z790 PCIe 4.0 bus was increased from 12 to 20, and PCIe 3.0 was halved from 16 to 8, allowing for more, higher speed SSDs and expanded peripherals. Z790 USB 3.2 Gen2x2 20Gbps from 4 to 5.
H770 PCIe 4.0 and PCIe 3.0 were 16 and 8, respectively, B760 PCIe 4.0 6 increased to 10, and PCIe 3.0 8 halved to 4.
Overall, there is not much change.
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