preface
When analyzing the market situation of hot-selling audio products in the first half of 2024, I love audio network has conducted a detailed dismantling and analysis of 112 products, covering 12 categories: TWS earphones, OWS earphones, headphones, erection/rear earphones, wireless microphones, smart audio glasses, speakers, smart watches, smart bracelets, anti-lost devices, educational products and children's audio toys. This news will focus on headset data sharing, I love audio network through the headset product disassembly, to understand the application of the main control chip manufacturers in different headset products, the details are as follows.
If you want to view the [2024 Semi-Annual Audio Product Teardown Summary Report], you can click here
Data analysis of 112 products in 12 categories|2024 semi-annual dismantling summary
2024 semi-annual hot-selling headset product information summary
In the first half of 2024, the dismantling of the brand of I love audio network headphones is shown in the following figure:
Among the 9 hot-selling headphones disassembled by My Love Audio Network, there are 9 brands including 1MORE, adidas, Bose, KEF, KOREAN AIR, PHIATON, Philippine Airlines, Soundcore, and YAMAHA.
The market share of the main control chip of headphones is exposed
Among the 9 hot-selling headphones dismantled by I love audio network in the first half of the year, the use of the main control chips of 2 manufacturers is shown in the figure below:
According to the figure, among the 9 hot-selling headphones dismantled by I Love Audio Network in the first half of 2024, Qualcomm main control chips are used the most, with 4 products used, accounting for 44.44%; Among them, 2 products use Hengxuan Technology chips, accounting for 22.22%.
According to the teardown and analysis of I Love Audio Network, among the 9 hot-selling headphones in the 2024 semi-annual mainstream hot-selling headphones, a total of 6 main control chips are used, including the following hot-selling chip models:
恒玄 热销蓝牙音频芯片型号:BES2300YP、BES2700L
高通 热销蓝牙音频芯片型号：QCC3004、QCC5181、QCC3034、QCC5144
Among the 6 chips, 1 hot-selling headset is used, and each chip accounts for 11.11%.
I love the audio network summary
The audio chip is one of the core components of headphones and plays a vital role in providing a high-quality audio experience. Qualcomm and Hengxuan Technology's competitive performance in this field is eye-catching, showing their outstanding advantages in technological innovation and product performance. Today's consumers are demanding more and more attention to detail and smart features in sound quality. To meet these needs, audio chips are constantly improving their technology to make it more intelligent and personalized. With the continuous breakthrough of chip technology, it is expected that future headphones will be lighter, smarter, and provide a richer and more customized audio experience to meet consumers' pursuit of high-quality life.
Tips: The above information is for reference only and is not intended as a suggestion to enter the market; Investment is risky, and you need to be cautious when entering the market.
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Data analysis of 112 products in 12 categories|2024 semi-annual dismantling summary