The vivo X100s has upgraded the processor but reduced the fast charging power??? The protagonist of this teardown video is the just-released vivo X100s (hereinafter referred to as X100s). At this press conference, a total of three new machines were unveiled, the reason why I chose X100s, is to see through the standard version, to see how high the lower limit of this wave of new machines is, as a standard version of it, the quality of workmanship materials and details, and what kind of level. Below, let's find out by dismantling.
X100sMy first impression is simple、Clean、Quality,Although it is the same door,And they all belong to the same large series,But from the perspective of appearance,X100s compared with the X100 released last year,There is no matryoshka situation,But a new design and mold are adopted,The so-called continuation is just godlike,The most intuitive changes come from the screen and the middle frame,X100s is equipped with a straight screen,The middle frame has also been changed to the popular right-angle small vertical edge,The position of the connection with the screen and the back cover, It has been relatively rounded and transitioned, with a four-curved micro-arc back cover, and there is no obvious awkward feel when held. Personally, I prefer the feel of the back cover, which is silky and does not stick to fingerprints.
Let's start dismantling, after shutting down, take out the SIM card tray, double nano stacked design, metal frame and bezel + plastic frame, with blue dustproof and waterproof rubber ring.
The lens of the X100s still has a certain protrusion, so when opening the back cover, it should be heated twice, starting from the flat middle and lower part, the temperature is still 100 degrees, and the heating is 3 minutes. Because the curvature around the back cover is not very large, it is easy to open the breakthrough with a thin metal warp, there is no difficulty in the process of removing the glue, only the lens is slightly sluggish around it, and there are no obstacles elsewhere, if there is a suction cup to cooperate, the back cover can be easily opened, which is also a flagship machine that has been disassembled recently, the difficulty is relatively low.
The back cover is made of glass, and the AG matte is comfortable to the touch. The DECO frame is made of metal with a fine vertical texture similar to that of a glass ring. There are 3 large openings on the lens, corresponding to the rear three cameras, and 2 relatively small round holes below, corresponding to the laser focusing module. The oval bar in the upper right corner corresponds to the flash.
There is a circle of adhesive around the inside of the back cover, the right side is slightly wider, and the remaining three sides are close to the width. There are four reinforcing dispensing points at the four corners of the outer edge of the lens, and the small resistance when opening the back cover comes from them. There is a nearly circular black plastic lining on the inside of DECO, which is fixed by a combination of screws + adhesive, and there are 3 small limit posts to assist in fixing, and 80% of its edges are slightly larger than the notch in the lens area, forming a laminated reinforcement effect with the DECO frame. The rear triple camera all has a cushioned foam ring, while the laser focus module and flash are not, and the elliptical strip of the latter is not completely transparent, with some of the middle obscured. There is no large cushioning foam in the middle of the back cover, mainly because the internal space is too tight, and there are 3 heat dissipation films on the bottom edge, corresponding to the sub-board area.
Some adhesive residues can also be seen around the middle frame of the phone, mainly near the motherboard area. The cover is made of plastic and metal, and many exposed metal plates can be seen on the surface. There is only 1 type of fixing screw, a total of 12 screws. There is an LDS laser antenna in the upper left corner, next to which is the NFC coil, which is positioned relatively high, just encircling the ultra-wide-angle lens inside. The flash is located in the upper right corner and has a dual-LED configuration, with a small black square in the middle, which is the rear ambient light sensor, and the laser focus module is connected to them on the same yellow FPC, under the telephoto lens. There are 2 heat dissipation films on the battery, one large one extends upwards to cover the interface area of the motherboard, and the other small one extends downwards to cover the middle area of the sound cavity and subboard, and one heat dissipation film inside the NFC coil. The cover of the sub board is mostly made of metal, and a white FPC passes through it.
Unscrew all the fixing screws of the cover and pry it up to remove the cover. As on the outside, a large number of metal plates can be seen on the inside of the cover. The special-shaped foam ring in the upper left corner and the 2 small long foam pads inside correspond to the top speaker, after the cover plate is fixed, the foam ring surrounds the speaker in it, which can avoid sound leakage, improve sound quality, and also play a certain role in buffering and protection. The U-shaped foam in the middle of the top corresponds to the front lens, the two contacts next to it correspond to the NFC coil, and in the upper right corner, you can also see the traces of some LDS laser antennas extending inward. There is a heat dissipation film underneath, which corresponds to the metal shield on the A side of the motherboard. The main BTB is equipped with a cushioned foam pad, and the yellow BTB below corresponds to the flash FPC. There are two foam pads at the bottom, one long and one short, corresponding to the BTB under the A side of the motherboard.
In the gap in the upper left corner of the motherboard, the infrared figure is faintly visible, and the top noise-canceling microphone is next to it. The front camera and BTB are covered with a heat dissipation film, and there is also a gray conductive cloth underneath. There are two coaxial cables on the right edge, one blue and one white, and the upper left side is pasted with a copper foil shield, which corresponds to the heat dissipation film on the inside of the cover, and the motherboard fixing screw is at the bottom right of the shield. The telephoto lens is placed side by side with the main camera, and a heat dissipation film is attached to it.
After disconnecting the BTB of the battery, disconnect the remaining BTB on the A side of the motherboard in turn, as well as the coaxial cable, and all 4 lenses can be removed except for the main camera. Unscrew the motherboard fixing screws, pry up and remove the motherboard, the main camera is glued to the frame, and pry it up and remove it with tweezers. At this time, the front and rear four cameras of the X100s are all together. 50 million pixel super-sensitive bionic main camera, Sony IMX920 sensor, area 1/1.49 inch, support OIS optical image stabilization, aperture f/1.57, equivalent focal length 23mm, support AI shooting, VCS bionic spectrum. 64 million pixel telephoto macro lens, OmniVision OV64B sensor, area 1/2 inch, support OIS optical image stabilization, aperture f/2.57, equivalent focal length 70mm, up to 100x digital zoom. 50-megapixel ultra-wide-angle lens with Samsung JN1 sensor, 1/2.76-inch area, f/2.0 aperture, 15mm-equivalent focal length. 32-megapixel front lens, Samsung S5KGD2 sensor, area 1/2.8", aperture f/2.0.
The PCB of the motherboard is thin and has a single-layer design, which is good for heat dissipation and control of the body thickness. In order to accommodate the rear three cameras, their corresponding PCBs are hollowed out, plus the front lens, the shape of the connection reminds me of Tetris, and there is a vacancy next to it, which corresponds to the speaker. If you look at it this way, the hollow takes up about 40% of the motherboard's area. What is confusing is that all BTB bases on the A side do not have foam rings or rubber rings, and the surrounding capacitors and small parts are not dispensed, which is very rare in vivo's mid-to-high-end mobile phones in the past, after all, comprehensive protection measures for the motherboard have always been a fine tradition of the blue factory.
The logo of "COMPEQ" is printed on the upper right side of the A side, indicating that the PCB supplier is Huatong Computer. The round hole on the upper right side of the B side corresponds to the noise-canceling microphone, the infrared emitter on the right, and the front ambient light sensor on the left. The two weak spots in the middle of the PCB are reinforced with metal sheets, which are about the same as the PCB above the top speaker in terms of width, and I don't know why the latter is not reinforced with metal plates. Of the 4 metal shields, 3 are covered with copper foil, and the remaining shield is removable and coated with silicone grease to assist in heat dissipation. As with side A, there are no dispensing marks on the small parts on side B.
Pry up and remove the shield, there is a layer of heat dissipation material underneath, and even a layer of silicone grease is glued to the inside of the shield, which is the core, and by the way, tear off the remaining copper foil. The black chip at the bottom left of the B side of the motherboard is the LPDDR5X running memory from Hynix. Underneath is a slightly larger green chip, which is a Dimensity 9300+ processor from MediaTek. The smaller one on the left is vivo's self-developed blueprint image chip V2. The big chip in the shield next door is UFS4.0 flash memory from Micron. The slightly smaller chip next to it is the SC8571 charge pump fast charging IC from Nanxin Semiconductor. The one in the upper right corner is the MT6639 RF transceiver from MediaTek.
The vacant frame area, the foam ring in the upper left corner corresponds to the noise-canceling microphone, there is a black heat dissipation film and conductive cloth underneath, and the copper foil on the inside of the screen can also be seen in the circular hollow. The rectangular opening on the right corresponds to the front-facing ambient light sensor, and there is also an H-shaped foam pad inside. There is a ring of foam glue at the front lens position, which is both a kind of fixation and a kind of protection. The outer ring of the speaker is the same shape and function as the inner ring of the cover, ensuring sound quality and cushioning. The speaker is from AAC Technologies, and is a 1012 specification, connected to the motherboard through 2 contacts, and there is a ring of black foam underneath to fix it. The rear three cameras are all designed with limits, in which the telephoto lens corresponds to the frame directly penetrated, forming a rectangular hollow, and the lens can directly touch the VC vapor chamber. There is a conductive cloth corresponding to the BTB of the main camera, and the 4 contacts next to it correspond to the power button and volume button. In the lower right corner, there is a polished rounded rectangular area coated with silicone grease, corresponding to the core area of the motherboard's B-side. There is a circle of copper dots around the middle frame, which is responsible for signal overflow.
Tear off the heat dissipation film at the bottom of the battery, unscrew all the fixing screws in the sub plate area, pry the cover plate up at a certain angle, take out a small plate next to the speaker, and disconnect the white coaxial cable. The bottom speaker is from Goertek Acoustics, using 1116 specifications, and is connected to the sub-board through 2 contacts, and it also has a heat dissipation film and foam pad on the inside. The small foam pad next to it corresponds to the fingerprint recognition module.
Disconnect all BTB and coaxial cables in the sub plate area in turn, and pry up and take out the sub board. Like the motherboard, its BTB base is also unprotected, but some of the surrounding capacitors are used as dispensing processors. The microphone is in the lower middle position, with a metal cover on the outside, and a red dustproof and waterproof rubber ring on the outer edge of the USB port. The vibrating unit is glued to the frame, it comes from AAC Technologies, model ELA9595. Then pry up and take out the fingerprint recognition module, which is fixed to the frame by adhesive and limit posts, and the X100s still uses a short-throw lens solution.
On the frame, the speaker vent is equipped with a red dust-proof rubber ring. Next to the exposed chip is the touch IC of the X100s screen, which comes from Goodix, model number GT9916R. The foam ring in the middle corresponds to the microphone, and the sound receiving hole is designed to be fool-proof, so that the needle insertion will not damage the microphone.
The battery is fixed by the easy-to-pull glue on both sides, tear off the adhesive tape according to the diagram, and lift it up firmly to remove the battery. It adopts a dual-cell single-interface scheme, X100s supports 100W wired fast charging, the total battery equivalent capacity is 5100mAh, the manufacturer is Dongguan Xinnengde, and the battery cells are from ATL. There is a large area hollowed out in the middle of the frame under the battery, which is directly in contact with the VC vapor chamber to dissipate heat for the battery and the FPC of the main and auxiliary boards.
At this point, the disassembly of the vivo X100s is basically completed.
Compared with the X100 released last year, the "change and change" of this year's X100s are very obvious. "Change" is mainly reflected in the appearance level, from the screen to the middle frame, to the back cover, it is different from before, and it has completely changed a style. "Unchanged" is mainly reflected in the interior,Through disassembly, it can be found,X100sThe image system configuration is the same as X100,The front and rear four camera models and parameters have not changed,It is also equipped with a self-developed image chipV2。 The rest includes the position of the flash, the number of lamp beads, the FPC cable routing method, the specifications and standards of RAM and ROM, the charge pump fast charging IC, the brand and specifications of the stereo double Yang, the screen touch IC, the fingerprint recognition solution, the vibration motor, and even the shape of the motherboard hollowout. X100sThe source of the lack of BTB protection measures on the main and secondary boards has also been found, which is not its own reason, and it is not an isolated case, because this was also the case on the X100 before, but the Pro protection measures of the higher level are very complete. To be honest, I don't understand why this discrepancy is happening. Of course, as an enhanced product with the suffix "s", the X100s also has a number of improvements, such as the body thickness is controlled at 7.8mm, the processor is upgraded to Dimensity 9300+, the battery capacity is increased to 5100mAh, and the RF transceiver is upgraded to MediaTek's MT6639. In addition, there are two regressions, one is that wired fast charging has been reduced from 120W to 100W, and the other is the lack of the top version of LPDDR5T quad-channel RAM. Based on the above, X100s is barely enough to be strengthened or improved positioning, and the upgrade range is also in line with the identity of the standard version, after all, the real major upgrade will be left to the version iteration product at the end of the year.