Abstract:In recent years, with the popularization and upgrading of electronic products, as well as the rapid development of 5G, Internet of Things, artificial intelligence and other technologies, the demand for copper clad laminates and copper foil materials, as key materials in the field of electronic manufacturing, continues to grow. The data shows that from 2018 to 2023, the production and sales of mainland copper clad laminates have achieved significant growth. This growth trend not only reflects the strong market demand, but also highlights the continuous improvement of technological innovation and production capacity scale of the mainland copper clad laminate industry.
1. Definitions and Classification
Copper clad laminate, also known as copper clad laminate (CCL), is a basic material used in the manufacture of electronic circuits and is an important part of the electronic information industry. This material plays a key role in conduction, insulation, and support in the manufacture of electronic circuits, and has an important impact on the performance of signals in circuits, such as transmission speed, energy loss, and characteristic impedance. According to the different application fields and mechanical rigidity, copper clad laminates can be divided into single-sided copper clad laminates, double-sided copper clad laminates, multi-layer copper clad laminates, rigid copper clad laminates and flexible copper clad laminates. Copper foil material is one of the main raw materials of copper clad laminate, which is a conductive material widely used in the manufacture of electronic circuits.
Second, industry policies
The electronic information industry is a strategic, basic, and leading pillar industry that the mainland focuses on developing, and is an important cornerstone for ensuring national defense construction and national information security. In this context, copper clad laminates and copper foil materials, as indispensable key components in the electronic information industry, are strongly supported by the national industrial policy. In recent years, a series of policies have been introduced at the national level, which have pointed out the direction for the development of copper clad laminate and copper foil material industry. For example, in January 2022, the State Council issued the "14th Five-Year Plan for the Development of the Digital Economy", which clearly pointed out that efforts should be made to improve the supply level of basic software and hardware, core electronic components, key basic materials and production equipment. This plan not only provides macro guidance for the development of the copper clad laminate and copper foil material industry, but also gives a clear positioning for its role and status in the era of digital economy. In August 2023, the Ministry of Industry and Information Technology issued the "Action Plan for Steady Growth of Electronic Information Manufacturing Industry from 2023 to 2024", which further refines the development goals, proposing to promote the technical research of electronic materials, electronic special equipment and electronic measuring instruments in key areas such as personal computing, new displays, VR/AR, 5G communications, and intelligent networked vehicles. These specific measures have pointed out the direction for technological innovation and product upgrading in the copper clad laminate and copper foil material industry.
Third, the development process
The development process of China's copper clad laminate and copper foil material industry has gone through many stages, showing a transformation process from start-up to innovation, from development to industrial upgrading. In the 50s and 70s of the 20th century, the industry was in its infancy. During this period, some forward-looking scientific research institutions and far-sighted entrepreneurs in China began to get involved in the research and development and production of copper clad laminates and copper foil materials, but the production scale and technical level were relatively low. In the 80s of the 20th century, China's copper-clad laminate and copper foil material industry ushered in an important turning point. During this period, domestic enterprises began to actively introduce foreign advanced technology and equipment, which not only greatly improved production efficiency and product quality, but also brought new development opportunities for enterprises. In the 90s of the 20th century, with the continuous expansion of the domestic market and the gradual development of foreign markets, the production scale of China's copper-clad laminate and copper foil material industry began to expand rapidly, and the industry began to enter the stage of large-scale production. In the 21st century, with the rapid development of the electronic information industry and the rapid development of technology, China's copper clad laminate and copper foil material industry has ushered in a critical period of industrial upgrading. During this period, domestic enterprises began to pay more attention to technology research and development and innovation, and constantly launched high-performance and high-quality products to meet the escalating market demand. At the same time, the company has also increased investment in environmental protection, energy conservation and emission reduction to achieve sustainable development. At present, China's copper clad laminate and copper foil material industry is moving to a higher level and a wider field.
Fourth, industry barriers
1. Technical barriers
As one of the basic materials of the electronics industry, copper clad laminates must meet the comprehensive performance requirements of printed circuit board processing, component installation and product operation. In order to achieve the above product performance indicators, it is necessary to master a comprehensive production process and methods, and enterprises are required to accumulate continuous innovation capabilities in resin modification, lamination process, interface treatment, product testing and testing in long-term R&D and production.
2. Capital barriers
The scale of investment in fixed assets in the copper clad laminate industry is large, and the working capital required for production and operation is more. At the same time, with the continuous change of downstream market demand, the adjustment and upgrading of product structure is accelerated, and the ability to develop high-performance new products is related to the long-term sustainable development of enterprises, which requires copper clad laminate manufacturers to carry out continuous research and development, and upgrade production equipment. Therefore, the development and growth of copper clad laminate manufacturers need a lot of financial support, and the capital threshold of the industry is high.
3. Talent barriers
Copper clad laminate manufacturing is a multidisciplinary comprehensive technology, product quality is stable and reliable, the company requires a research and development team including experts in electrical and electronics, chemical industry, materials, machinery, physics and other fields and a stable team of skilled workers. A stable team of skilled workers is the foundation for the survival of the enterprise, and a multidisciplinary R&D team is the premise for the sustainable development and growth of the copper clad laminate enterprise. As the basic material of the electronic industry, the technical sales service also puts forward high professional requirements for the sales staff, so a stable and professional sales team is also one of the necessary conditions for the development and growth of the copper clad laminate production enterprises.
Fifth, the industrial chain
1. Analysis of the industry chain
The upstream of the industrial chain of the copper clad laminate industry is mainly raw material suppliers, including electronic copper foil, glass fiber cloth, resin, wood pulp paper, etc. The midstream is the manufacturing link of copper clad laminates, which mainly includes the production of various types of copper clad laminates. The downstream is mainly printed circuit board (PCB) manufacturers and further downstream terminal application fields, such as the communication industry, consumer electronics industry, automotive industry, etc.
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