33 bigwigs, supporting 3.6 trillion yuan chip giants

After experiencing a high-end financial report with revenue of more than 500 billion yuan in 2022, TSMC's development will also usher in new challenges in 2023.

The 2023 Q3 financial report released not long ago showed that TSMC's net revenue in the third quarter was NT$546.73 billion (about RMB 124.65 billion), a year-on-year decrease of 10.8% and a month-on-month increase of 13.7%.

In addition to the unsatisfactory financial report, TSMC is also becoming the target of the world's leading semiconductor countries and regions, and plans to build wafer factories in the United States, Japan and Europe and other places, which requires huge funds and human resources.

TSMC's future development has been tested, and the performance of the leadership team behind it is particularly important in the face of challenges. As of the close of the U.S. stock market on December 1, 2023, TSMC's latest market capitalization reached US$511.1 billion (about RMB 3,649.2 billion), which can be called a commercial "giant ship" and is not easy to control. Since Zhang Zhongmou announced his retirement in June 2018, how has the TSMC leadership team performed, whether it has the energy to lead TSMC through the wind and rain area, and what are the capable players in the latest leadership team layout?

TSMC leaders handed over the baton for five years

As early as 2018, when Zhang Zhongmou announced his retirement, the media expressed concern that "for TSMC, losing Zhang Zhongmou's leadership is like losing his soul".

TSMC's performance in the five years since Zhang Zhongmou's retirement has basically judged that what the media is worried about has not happened, at least from the financial report data, in the "post-Zhang Zhongmou era", TSMC still handed over a beautiful answer to market investors.

Data source: TSMC official website

Drafting: Master Xin

In the first five years of Zhang Zhongmou's retirement, between 2013 and 2017, TSMC grew at an average annual rate of 9.1%, and in 2017, his last year at the helm of TSMC, TSMC's annual revenue reached 222.8 billion yuan.

Data source: TSMC official website

Drafting: Master Xin

In the post-Zhang Zhongmou era, from 2018 to 2022, TSMC's annual revenue has been rising, breaking through a record high, and reaching 515.9 billion yuan in 2022, doubling from five years ago. In five years, it has also grown at a staggering compound growth rate of 17.5%.

Data source: TSMC official website

Drafting: Master Xin

It is worth noting that TSMC's gross profit margin has been maintained at about 50%, and with TSMC's leading position in process technology, TSMC's profit margin will even be close to 60% in 2022. In contrast, the gross profit margin of mainland wafer foundry peers hovers between 20% and 30%. High performance and ultra-high gross profit margin, this is TSMC's "face" in recent years.

Why is TSMC's performance so strong?

Zhang Zhongmou once publicly said that TSMC has three major advantages: leading technology, superior manufacturing, and customer trust. Zhang Zhongmou said: "As long as we lose one of our advantages, it is not the TSMC we want." ”

The development status of TSMC shows that TSMC still retains the advantages of the Zhang Zhongmou era - TSMC said at the 2022 financial report that its main achievements for the year include:

1. Wafer shipments reached 15.3 million pieces of 12-inch wafers equivalent (refers to the method of determining the value of inventory according to its actual quantity or weight and the unit cost of individual varieties when accounting for the inventory of enterprises), and in 2021, it will be about 14.2 million pieces of 12-inch wafer equivalent.

2. The sales value of advanced process technology (advanced process of 7nm and below) accounted for 53% of the overall wafer sales value, up from 50% in 2021.

3. Provide 288 different process technologies and produce 12,698 different products for 532 customers.

Overall, TSMC accounts for 30% of global semiconductor (excluding memory) output, up from 26% in 2021.

The TSMC war group under the leadership of the "dual chief mechanism".

Since Zhang Zhongmou's retirement, TSMC's future development has once caused market concerns, and now that the market environment is becoming increasingly complex, what kind of leadership will TSMC use to deal with it?

In 2017, Zhang Zhongmou issued a "Letter to Shareholders" for the last time as "chairman"

Source: TSMC official website

After Zhang Zhongmou announced his retirement in mid-2018, TSMC's board of directors completed the re-election of directors and passed the newly revised articles of association, the most important change is that TSMC's core management power has changed from Zhang Zhongmou at the helm alone to a "dual-head mechanism" coordinated by Liu Deyin and Wei Zhejia.

Since 2018, TSMC's annual "Letter to Shareholders" has been jointly issued by Liu Deyin and Wei Zhejia

Source: TSMC official website

Among them, the Chinese title of "CEO" used in the past was changed to "president", and the board of directors of TSMC elected Liu Deyin as the chairman of the board of directors, as the highest decision-making representative of the enterprise, and Wei Zhejia as the president and vice chairman, who must report to the chairman and the board of directors.

This management model is more common in overseas and Taiwanese tech circles, and ASUS and MediaTek have adopted similar dual-track governance models. TSMC's subsequent performance and management stability have shown that this governance model is effective.

Master Xin inquired about public reports, TSMC has seen a number of new executives in its high-level leadership team in recent years, many of whom have been promoted internally, but no important executives have left, and only a few senior executives have left TSMC due to retirement in public reports. This part of the management change is more inclined to "internal change", and there is no obvious change.

On the other hand, TSMC, as a global foundry leader, has been particularly active in capacity expansion in recent years, and it is also actively introducing external talents to maintain the company's innovation.

According to the latest information on TSMC's official website, TSMC currently has a total of 33 senior managers in its main management team and subsidiaries. How do the 33 executives perform their duties to drive the operation of this "giant wheel" with an annual income of more than 500 billion yuan, Master Xin has sorted out the TSMC leadership group as follows for the industry to spy on TSMC's organizational structure and the resumes of its main cadres.

Note: The following information comes from TSMC's official website, in the expression: nanometer = nanometer, inch = inch, TSMC = TSMC.

Liu Deyin

Chairman

Degree:

Ph.D. in Electrical Engineering and Computer Information from the University of California, Berkeley

Dr. Deyin Liu is the Chairman of TSMC. Prior to that, he served as General Manager and Co-Executive Officer of TSMC from 2013 to 2018, where he led cutting-edge technology development, and from 2012 to 2013, he served as Co-Operating Officer. Dr. Deyin Liu joined TSMC in 1993 as Deputy Director of Engineering to establish TSMC's first 8-inch wafer fab, and has since held a number of key positions, including Senior Vice President of Operations and Senior Vice President of Advanced Technology Business, where he created TSMC's first 12-inch wafer fab and pioneered the operation of a super-large fab. Prior to the merger of Shida IC Manufacturing Corporation and TSMC, he also served as the company's general manager.

Prior to joining TSMC, Dr. Liu worked at AT&T Bell Laboratories in New Jersey from 1987 to 1993 as a research manager for the high-speed electronics research laboratory, developing optical communication systems, and from 1983 to 1987, he was a process integration manager for CMOS technology development at Intel, Inc., where he developed microprocessor process technology.

Wei Zhejia

president

Degree:

Ph.D. in Electrical Engineering, Yale University, USA

Dr. Zhejia Wei is the president of TSMC. Prior to that, Dr. Wei served as the general manager and co-chief executive officer from November 2013 to June 2018, the executive vice president and co-chief operating officer from March 2012 to November 2013, and the senior vice president of business development from 2009 to 2012. Dr. Wei Zhejia has extensive practical experience in the field of technology business and operation management, and has also served as the senior deputy general manager of mainstream technology business and the deputy general manager of operation of the south plant.

Prior to joining TSMC in 1998, Dr. Wei served as Senior Vice President of Technology at Chartered Semiconductors in Singapore and Senior Manager of Logic and SRAM Technology Development at STMicroelectronics in Texas. Prior to that, Dr. Wei worked in the technical research and development department of Texas Instruments.

He Limei

Senior Deputy General Manager of Human Resources

Degree:

Master of Commerce, National Taiwan University

Ms. Ho is the Senior Vice President of Human Resources at TSMC. Ms. Ho joined TSMC in 1999 and served as Chief Accountant from 1999 to 2003, Chief Financial Officer and Spokesperson from 2003 to 2019, Senior Vice President of Eurasia from 2019 to 2022, and Chairman of the Corporate Sustainability (ESG) Committee since 2011.

Luo Weiren

Senior Vice President of Research and Development

Degree:

Ph.D. in Solid State Physics and Surface Chemistry from the University of California, Berkeley

Dr. Weiren Lo is the Senior Vice President of Research and Development at TSMC. Dr. Luo joined TSMC in 2004 as Vice President of Operations and served as Vice President of Research and Development from 2006 to 2009, and was subsequently promoted to Vice President of Advanced Technology Business and Manufacturing Technology of Operations Organization.

For more than 15 years, Dr. Lo has been committed to providing customers with more comprehensive and innovative solutions to meet tough technical challenges at TSMC. As of today, Dr. Luo has led the team to obtain more than 1,500 patents worldwide, including approximately 1,000 U.S. patents.

Rick Cassidy

Senior Vice President of Corporate Strategy Office, Overseas Operations Office/Chairman of TSMC Arizona

Degree:

Bachelor of Engineering from West Point

Rick Cassidy is the Senior Vice President of TSMC's Corporate Strategy Office and Overseas Operations Office, responsible for corporate strategic planning and execution, and co-leads the Overseas Operations Office, responsible for the organizational effectiveness of overseas operations. He joined TSMC's North American subsidiary in 1997 as Vice President of Account Management and was promoted to General Manager and CEO of TSMC's North American subsidiary in 2005. In 2008, he served as TSMC's vice president in charge of North America, and has since been promoted to senior vice president. Rick Cassidy has been with TSMC for more than two decades.

Prior to entering the semiconductor industry, Rick Cassidy served as an officer in the U.S. Army. He holds a bachelor's degree in engineering from West Point and currently serves on the Board of Directors of the Global Semiconductor Alliance (GSA), an organization dedicated to advancing the global semiconductor industry.

Qin Yongpei

Senior Deputy General Manager of Operations and Overseas Operations Office

Degree:

Master of Electrical Engineering, National Cheng Kung University (Taiwan).

Mr. Qin Yongpei is the Senior Vice President of TSMC's Operations and Overseas Operations Office, responsible for the operational management of all manufacturing sites in Taiwan and overseas, and co-leads the Overseas Operations Office, responsible for the organizational effectiveness of overseas operations. Mr. Chin joined TSMC in 1987 when the company was founded. Prior to his promotion to Senior Vice President in 2016, he was Deputy General Manager of Product Development for the Operations Organization. Prior to that, he served as Vice President of TSMC's Advanced Technology Business Unit, where he was co-responsible for TSMC's advanced technology and 12-inch wafer fab operations.

During his career, Mr. Qin has made significant contributions to TSMC's product development. From 1997 to 1998, he served as Fab 1 Director and has continued to support all next-generation advanced technologies, including yield improvements for 28nm, 16nm, and 7nm processes. Mr. Qin is also responsible for the research and development of 22nm and 12nm process technologies, as well as special process technologies such as RF process, high-voltage process and image sensor, and pioneered the development of TSMC's Golden Spice Modeling and manufacturing design solutions.

Prior to joining TSMC, Mr. Qin worked at the Institute of Electronics of the Industrial Technology Research Institute.

Mi Yujie

Senior Vice President of Research and Development

Degree:

Ph.D. in Electrical Engineering, University of California, Los Angeles

Dr. Yujie Mi is the Senior Vice President of TSMC's Research and Development Organization. Dr. Mi joined TSMC in 1994 as Plant 3 Manager, joined the R&D organization in 2001, served as Vice President of R&D in 2011, and was promoted to Senior Vice President of Technology Development of R&D Organization in November 2016.

Dr. Mi has served at TSMC for more than 20 years and has contributed to the development and manufacturing of advanced complementary metal-oxide-semiconductor (CMOS) technologies. Dr. Mi successfully developed 90nm, 40nm, and 28nm technologies, and later led the team to develop 16nm, 7nm, 5nm, and more advanced technologies.

Lin Jinkun

Senior Vice President, Information Technology, Materials & Risk Management / Chief Information Security Officer

Degree:

Bachelor's degree in Industrial Education and Technology, Changhua Normal University (Taiwan).

As TSMC's Senior Vice President of Information Technology and Materials & Risk Management, Mr. Lin is responsible for driving information security, digital transformation, and expanding the application of artificial intelligence technologies to bring machine learning into smart manufacturing, R&D, and productivity improvement. Mr. Lim believes in the importance of responsible sourcing and is committed to building a sustainable supply chain. Prior to taking charge of his current unit, Mr. Lin was the deputy general manager of TSMC's 6-inch and 8-inch factories and manufacturing technology center.

Mr. Lin was one of the first employees to transfer from ITRI to TSMC when TSMC was founded in 1987, starting as a grassroots equipment engineer and holding various management positions in Fab 1 and Fab 2. Mr. Lin was also responsible for the establishment of Fab 3 and later served as the director of Fab 3, Fab 4 and Fab 7, as well as the senior director of Fab 6 and Fab 12 and the chief director of the advanced technology business.

Hou Yongqing

Senior Vice President, Eurasian Business, R&D / Technology Research

Degree:

Ph.D. in Electrical and Computer Engineering from Syracuse University, New York, USA

Dr. Hou Yongqing is Senior Vice President of Eurasia Business and Technology Research at TSMC. Dr. Hou joined TSMC in 1997 and was primarily responsible for the company's design technology and design ecosystem development, serving as Vice President of Design and Technology Platform from August 2011 to July 2018 and Vice President of Technology Development of the Research and Development Organization from August 2018 to May 2020.

From 1997 to 2007, Dr. Hou established TSMC's technology design kit and reference flow development organization, and over the past decade, he has led the team to build TSMC's Open Innovation Platform (OIP) design ecosystem.

Zhang Xiaoqiang

Senior Deputy General Manager of Business Development and Overseas Operations Office

Degree:

Ph.D. in Electrical Engineering, Duke University, USA

Dr. Zhang currently serves as the Senior Vice President of TSMC's Business Development and Overseas Operations Office, responsible for the company's business strategy, including technology roadmaps, customer communications and engagement, and co-leads the Overseas Operations Office, responsible for the organizational effectiveness of its overseas operations. Dr. Xiaoqiang Zhang joined TSMC in 2016 as Vice President of Design and Technology Platforms, responsible for the development of advanced silicon intellectual property, and in 2017, he served as Vice President of Business Development.

Prior to joining TSMC, Dr. Zhang was Vice President of Technology and Manufacturing and Director of Circuit Technology at Intel Corporation, where he was responsible for key processes, design aids, data files, co-definition, and optimization of Intel products. He successfully led LinkedIn Tel to develop embedded memory technology from 90nm to 10nm.

Fang Shuhua

Deputy General Manager of Legal Affairs and Chief Legal Officer / Head of Corporate Governance

Degree:

Master of Comparative Law, University of Iowa, USA

Ms. Fong joined TSMC in 1995 as the Director of Corporate Legal Affairs, where she was responsible for handling a number of high-profile corporate transactions, as well as precedent-setting intellectual property and trade secret litigation cases, as well as advocating for significant legal changes and revolutionizing corporate governance. Ms. Fang has served as TSMC's Deputy General Counsel since February 2014 and has been promoted to Vice President of Legal and General Counsel since August 2014. Ms. Fang was also appointed by the Board of Directors as the Head of Corporate Governance and Secretary of the Board of Directors of TSMC, responsible for handling the related business of the Board of Directors, Audit Committee, Remuneration Committee and Shareholders' Meeting.

In 2015, Ms. Fang promoted and co-founded the Taiwan Trade Secret Protection Promotion Association, and served as the first and second chairman of the Taiwan Trade Secret Protection Promotion Association, helping to promote the reform of Taiwan's Trade Secret Law.

Wang Yinglang

Deputy General Manager of Operations/Fab Operations

Degree:

Ph.D. in Electronic Engineering, Chiao Tung University, Taiwan

Dr. Yinglang Wang is currently the Vice President of Fab Operations (I) of TSMC. Dr. Wang joined TSMC in 1992 and has held various production-related management positions and was appointed Vice President of Technology Development at TSMC in October 2015.

Dr. Wang has served at TSMC for more than 20 years and has made significant contributions to the mass production of TSMC's 0.35nm, 0.25nm, 0.18μm, 0.13μm, 90nm, 65nm, 40nm, 20nm, and 16nm process technologies, significantly increasing wafer productivity and improving defect density. Dr. Wang has also invested in the research and development of more advanced 10nm, 7nm and 5nm process technologies, and has successfully introduced these technologies into production.

Dr. Wang has an excellent patent record, with 283 patents worldwide, including 136 U.S. patents.

Yu Zhenhua

TSMC Distinguished Technology Fellow, Vice President of Pathfinding for System Integration

Degree:

Ph.D. in Materials Engineering, Georgia Institute of Technology, USA

Dr. Zhenhua Yu is Vice President of Pathfinding for System Integration at TSMC. Dr. Yu joined TSMC in 1994 and was responsible for various businesses related to back-end R&D and successfully developed key process technologies for the 0.13-micron copper process. Dr. Yu is also a pioneer in the introduction of TSMC's wafer-level system integration technologies, including CoWoS®, integrated fan-out (InFO) packaging technology, and TSMC's system-integrated chips (SoICs™) and related technologies. Prior to 2016, Dr. Yu was the Senior Director of Integrated Interconnect & Packaging.

Prior to joining TSMC, Dr. Yu was a researcher and project leader at AT&T Bell Labs. From 1987 to 1994, Dr. Yu devoted himself to the research and development of submicron processes, components and integrated technologies.

Zhang Zongsheng

Fellow of TSMC Technology, Vice President of Operations/Advanced Technology & Reticle Engineering

Degree:

Ph.D. in Electrical Engineering, Tsinghua University, Taiwan

Dr. Zongsheng Chang is Vice President of Advanced Technology and Mask Engineering at TSMC. Dr. Zhang joined TSMC in 1995 and served as a senior director of Fab 12B. With more than 20 years of practical experience in operating organizations, he has participated in the technology development and manufacturing of Fabs 1, Fab4, Fab8, Fab 12 and Fab 14, and is a key figure in successfully leading TSMC's advanced technology to mass production.

Dr. Zongsheng Zhang was elected a TSMC Fellow in 2013 in recognition of his achievements in innovation and engineering excellence. Dr. Zhang holds 52 patents worldwide, half of which are U.S. patents.

Wu Xianyang

Deputy General Manager of R&D / Platform R&D

Degree:

Ph.D. in Electrical Engineering, University of Wisconsin-Madison

Dr. Hsien Yang Wu is the Vice President of R&D Technology Development at TSMC and is currently responsible for 3nm technology development and TSMC's Technology Development Efficiency Promotion Office. Dr. Wu joined TSMC's R&D unit in 1996 and has been involved in the development of advanced complementary metal-oxide semiconductor (CMOS) technologies at 0.13nm, 90nm, 65nm to 28nm, making significant contributions to the successful development of 16nm and 7nm technologies.

Cao Min

Vice President of Research & Development / Pathfinding

Degree:

Ph.D. in Physics, Stanford University, USA

Dr. Cao Min has served as the Vice President of Technology Development Pathfinding at TSMC since February 2018. Prior to that, Dr. Cao served as the Senior Director of the Pathfinding Division since 2016. Dr. Cao joined TSMC in 2002 and has successfully assisted in the development of a number of advanced complementary metal-oxide-semiconductor (CMOS) process technologies, including 90nm, 65nm, 40nm, 28nm, 20nm, and 10nm.

From 2006 to 2008, Dr. Cao led the development of the 40nm general-purpose process technology, which is TSMC's first nano-process to utilize ultra-density scaling. In 2009, he successfully led the development of a 28nm high-efficiency process using the first high-dielectric constant metal gate (HKMG) technology. Dr. Cao also led the R&D team to develop 20nm and 10nm process technologies.

Liao Yonghao

Second Deputy General Manager of Operations/Fab Operations

Degree:

M.S. in Chemical Engineering, Tsinghua University, Taiwan

Mr. Liao Yonghao is currently the Vice President of Fab Operations (II) of TSMC. Since joining TSMC in 1988, Mr. Liao has held a number of engineering and manufacturing-related positions, including as the director of TSMC's Fab 5, Fab 8, Fab 15A, and Fab 15B, and has 30 years of practical experience in semiconductor manufacturing operations management.

During his tenure as Fab 15A, Mr. Liao led the team to successfully mass produce 28nm process technology and carried out cross-organizational innovations, including the establishment of the "Central Setup Team" to help Fab 15 set the record for TSMC's fastest installation speed and capacity ramp-up, and the "Super Manufacturing" platform Platform) to enable technology transfer from R&D to manufacturing at one time.

Zhang Yuanming

Deputy General Manager of R&D / Advanced Equipment & Module Development

Degree:

Ph.D. in Materials Science and Engineering, Massachusetts Institute of Technology

Dr. Xunming Chang is the Vice President of Advanced Equipment and Module Development in TSMC's R&D/Technology Development Organization. Dr. Zhang joined TSMC in 1993 and is responsible for managing the technology development of key advanced modules for semiconductor manufacturing, including the evaluation and selection of equipment and materials.

Dr. Zhang's R&D career at TSMC includes a wide range of module technologies, including the division of advanced etching, back-end process modules, and platform modules, and led the advanced module team to continuously develop key modules for major process technologies such as 28/20/16/10/7/5 nm. Dr. Zhang is also one of the key contributors to breakthroughs in self-alignment contact etching, fin-effect transistors, and advanced wire fabrication. Dr. Zhang holds more than 320 U.S. patents and has published 147 papers in the field of semiconductor technology.

Huang Ren-hsien

Deputy General Manager for Finance and Chief Financial Officer and Spokesperson

Degree:

Master of Business Administration, Cornell University, USA

Mr. Huang joined TSMC in 1999 and has been responsible for a number of significant corporate finance projects, including the merger of Deqi Semiconductor and Shida Integrated Circuits, the release of Philips' shares, and a series of bond issuances from 2010 to 2013. For more than 20 years, Mr. Huang was appointed Deputy Chief Financial Officer after managing various businesses in TSMC's Finance Division, including investment management, financial planning, stock affairs, customer credit, foreign exchange management, financial risk management, and capital scheduling.

Prior to joining TSMC, Mr. Huang worked for ING Barings Bank, Chase Manhattan Bank, Bankers Trust, Chemical Bank, and Boston Bank, where he had more than 30 years of experience in the professional finance industry.

Tour Akiyama

Deputy General Manager of R&D / Special Technologies

Degree:

Ph.D. in Chemical Engineering from Worcester Polytechnic Institute, USA

Dr. Yau Qiushan is the Vice President of TSMC's Special Technology Organization. Prior to that, Dr. Yau served as the Senior Director of Strategic Account Programs at TSMC since May 2019. Since joining TSMC in 1988, Dr. Yau has held a number of manufacturing and R&D-related positions, including 1991 to 1995 as SRAM technology development project manager, where he successfully developed and mass-produced 0.65 μm, 0.55 μm, 0.5 μm, 0.45 μm, and 0.35 μm technologies, and introduced triple poly technology at 0.35 μm to dramatically increase the number of grains per wafer. Dr. Yau was subsequently promoted to Deputy Director of SRAM/DRAM and Embedded DRAM Development Division.

In 1996, Dr. Akiyama Yu successfully developed 0.35 micron DRAM and introduced it into mass production. In 1997, he was transferred to the Electron Beam Operations Division, where Dr. You led the team to complete the on-line production of reticles from 0.18 microns to 5 nanometers. In 2016, Dr. Yau developed a customized robot and automated particle detection system to enhance production automation.

He Jun

Vice President, Quality & Reliability, Operations / Advanced Packaging Technology & Services

Degree:

Ph.D. in Materials Science from the University of California, Santa Barbara

Dr. Jun He is the Vice President of Quality & Reliability Organization and Advanced Packaging Technology & Services at TSMC, responsible for TSMC's ecosystem of professional IC manufacturing services, including raw material verification, reliability and verification of new process technologies and design IP cores, manufacturing quality, and assisting customers in ensuring excellent product quality and reliability for smooth mass production, as well as back-end technology and operations and wafer packaging integration services.

Dr. Jun He joined TSMC in 2017 as Senior Director of Advanced Technology Quality and Reliability, where he led the team to develop and innovate analytical and test methods to effectively detect reliability defects and intercept defective products, helping TSMC successfully accelerate the launch and mass production of 7nm and 5nm technologies.

In addition, in 2019, Dr. He established a more complete TSMC raw material quality management system and strengthened the company's partnerships with major material suppliers. Dr. He holds 36 global patents, 28 of which are U.S. patents, and has published more than 50 papers in international conferences and peer-reviewed technical journals.

Ye Zhuhui

Deputy General Manager of R&D / Platform R&D

Degree:

Ph.D. in Electrical & Computer Engineering, University of Texas-Austin, U.S.A.

Ye Zhuhui has served in Qualcomm, Motorola and other units. He has made significant contributions to CMOS technology in the past at Motorola, providing solutions for technology cost optimization and process simplification.

Lin Hongda

Deputy General Manager of Corporate Information Technology and Chief Information Officer

Degree:

Ph.D. in Electrical Engineering and Computer Science from the University of California, Berkeley

Dr. Hongda Lin is the Vice President and Chief Information Officer of TSMC's Enterprise Information Technology Group, responsible for TSMC's IT-related businesses, including smart manufacturing services, high-performance computing, digital supply chain, e-commerce, team collaboration, modern offices, and IT infrastructure.

Dr. Lin joined TSMC in 2021 as the Chief Information Officer of the Enterprise Information Technology organization, where he led the team dedicated to TSMC's digital transformation, using new technologies such as artificial intelligence (AI) and machine learning (ML) to optimize business processes and enhance manufacturing capabilities.

Lee Jun Hyun

Deputy General Manager of the Enterprise Planning Organization

Degree:

Master of Business Administration, City University of New York, Beruk, USA

Mr. Li Junxian is the Vice President of the Corporate Planning Organization of TSMC, responsible for the company's operational resource planning and strategic planning. Since joining TSMC in 2007, Mr. Li has held a number of financial strategic planning positions, including the head of finance for mainstream technology business, advanced technology business, and research and development organization from 2007 to 2010, where he led the team to complete a number of major business development and investment projects, including the business focusing on special process technologies and the expansion of TSMC's 8-inch wafer fab capacity in Shanghai.

In February 2012, he was promoted to Senior Director of Finance and Business Development Division, and assisted TSMC in successfully completing a number of strategic projects for capacity expansion, including the establishment of TSMC's Nanjing 12-inch wafer fab in 2017, TSMC's Arizona 12-inch wafer fab in 2020, and TSMC's 3DIC R&D center in Japan in 2021. In May 2021, Mr. Li was appointed Senior Director of the Strategic Planning Division of TSMC.

Sho Ziju

Deputy General Manager of Operations/Plant Affairs

Degree:

Ph.D. in Civil Engineering, National Taiwan University

Dr. Zhuang Zishou is currently the Vice President of Plant Affairs of TSMC, responsible for the planning, design, construction and maintenance of the new plant, as well as the operation and upgrading of the existing plant facilities. Dr. Zhuang joined TSMC in 1989 as an equipment engineer and moved to the plant industry, where he has been dedicated to plant operations for more than 25 years. Dr. Zhuang led the Fab Management to successfully complete the construction of Fab 15B, Fab Nanjing and Fab 18A under the tight construction schedule, while also continuing to work on the improvement and integration of Fab systems.

Dr. Zhuang actively promotes TSMC's green manufacturing-related projects, including climate change and energy management, water management, waste management, and air pollution control, to achieve TSMC's ESG goals.

Lu Lizhong

Academician of TSMC Technology, Vice President of Research and Development/Design & Technology Platform

Degree:

Ph.D. in Information Engineering, Yale University, USA

Dr. Lizhong Lu is currently the Vice President of Research and Development/Design & Technology Platform of TSMC and a Fellow of TSMC Technology, where he is responsible for supporting the customized design requirements of different customers. Dr. Lu has been the head of the design and technology platform organization since 2018.

Since joining TSMC in 2000, Dr. Lu has held a number of management positions related to design services. Dr. Lu collaborates with R&D organizations to innovate design and technology co-optimization (DTCO) to improve the speed, power, and density of new process technologies. Through TSMC's Open Innovation Platform ® (OIP), he works closely with design ecosystem partners to deliver high-density, high-performance, automotive, RF, 2.5D and 3D comprehensive design solutions and IP to meet the diverse application needs of customers.

Xu Guojin

研究发展/ Integrated Interconnect & Packaging 副总经理

Degree:

Master of Science and Technology Management, Chiao Tung University, Taiwan

Mr. Xu Guojin is the Vice President of Integrated Interconnect & Packaging at TSMC, responsible for the development of TSMC's 3D integrated circuit (3D IC) and advanced packaging system integration technologies.

Prior to joining TSMC, Mr. Hsu served as Chairman of Micron Taiwan, where he was responsible for Micron's overall manufacturing operations in Taiwan. Mr. Hsu also served as the General Manager of TSMC's first U.S. fab, WaferTech, where he successfully improved performance to the company's average level. He has more than 30 years of experience in the semiconductor industry and has a proven track record of technology transfer and optimization, yield improvement, and ramp-up of new fab capacity.

Zhuang Ruiping

Deputy General Manager of Operations/Fab Operations

Degree:

M.S. in Materials Science and Engineering/Engineering Economic Systems, Stanford University, USA

Mr. Zhuang Ruiping is the Vice President of TSMC's Fab Operations (I) Organization. Since joining TSMC in 1997, Mr. Zhuang has held a number of manufacturing and manufacturing roles and made significant contributions to the mass production of TSMC's 90nm, 65nm, 40nm, 20nm, 16nm, 10nm, 7nm, and 5nm family of process technologies. Among them, Mr. Zhuang Ruiping has served as the senior director of Wafer Fab 18A since 2020, leading the team to successfully mass produce the industry-leading N5 process technology, and successfully mass produce the N4 process technology in 2022, helping TSMC become the world's first company to mass-produce 5nm family process technology, providing customers with the most advanced and complete technology and services.

Mr. Zhuang has over 30 years of practical experience in semiconductor manufacturing operations management and holds 52 global patents, including 30 U.S. patents.

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Senior management of subsidiaries

David Keller

General Manager and Chief Executive Officer of TSMC's North American subsidiary

Degree:

Master of Business Administration, University of St. Thomas, USA

David Keller is the General Manager and Chief Executive Officer of TSMC's North American subsidiary, a 100% owned subsidiary of TSMC. Prior to that, he was General Manager of TSMC's North American subsidiary. David Keller has more than 30 years of experience in the semiconductor industry and joined TSMC in 1997 as Chief of Account Management for its North American subsidiary. Over the past two decades, David Keller has made significant contributions to the customer service business in North America.

Maria Marced

General Manager of TSMC Europe

Degree:

Ph.D. in Telecommunications Engineering, Polytechnic University of Madrid, Spain

Dr. Maria Marced is the General Manager of TSMC's European subsidiary, responsible for driving TSMC's projects in Europe.

Prior to joining TSMC, Dr. Maria Marced was Senior Vice President and General Manager of Marketing at Philips Semiconductors/NXP Semiconductors and General Manager of Philips' Connected Multimedia Solutions business. Dr. Maria Marced spent 19 years at Intel Corporation, where she held the position of Vice President and General Manager of EMEA.

Paul de Bot

General Manager of TSMC Europe

Degree:

Master of Electronic Engineering and Ph.D. in Telecommunications from Eindhoven University of Technology, Netherlands

Paul de Bot is the General Manager of TSMC's European subsidiary. Paul de Bot joined TSMC in 2015 and was appointed General Manager EMEA in 2022 after taking on a customer management role, responsible for TSMC's operations in Europe and Israel. Paul de Bot began his career in video technology at Philips as Chief Strategy Officer for Philips' Digital TV Systems division. In 2003, he joined Philips Semiconductors (later NXP Semiconductors) as vice president of strategy and business development for its consumer, automotive and identification businesses, respectively. Prior to joining TSMC, Mr. Paul de Bot held executive positions in the software industry and corporate finance.

小野寺诚 (Makoto Onodera)

General Manager of TSMC Japan

Degree:

Master of Business Administration, Willamette University, USA

Mr. Onodera joined TSMC's Japan subsidiary in 1997 as Director and General Manager of TSMC's Japan subsidiary, a 100% owned subsidiary of TSMC.

Prior to joining TSMC, Mr. Onodera was a Senior Marketing Engineer at Applied Materials' Japanese subsidiary, where he was responsible for the marketing of various advanced dielectric chemical vapor deposition systems.

Luo Zhenqiu

Head of TSMC China (Mainland) Business Area / General Manager of TSMC (China) Co., Ltd. / General Manager of TSMC (Nanjing) Co., Ltd

Degree:

Master of Business Administration, Peking University

Mr. Luo Zhenqiu is the general manager of TSMC (Chinese mainland) and TSMC (Nanjing) subsidiary, which are 100% owned subsidiaries of TSMC. Responsible for business development in China and the operation of TSMC (Chinese mainland) subsidiaries and TSMC (Nanjing) subsidiaries.

Mr. Luo joined TSMC in 1994 and has served as Business Manager for the Asia Pacific region, Head of Operations for TSMC's European subsidiaries, and Head of the China Business Area since 2003. Mr. Luo Zhenqiu has served as the general manager of TSMC (Nanjing) since 2016 and the general manager of TSMC (Chinese mainland) since 2020. Mr. Luo is responsible for TSMC's corporate operations and business development in China, as well as supporting the long-term business development needs of customers and partners in the semiconductor industry.

Prior to joining TSMC, Mr. Luo worked at the Institute of Electronics of the Industrial Technology Research Institute of Taiwan and Lunfei Computer Corporation for 10 years as the head of integrated circuit design engineering, and has accumulated more than 35 years of experience in various fields of integrated circuits. 

Resources:

1. TSMC's 2022 "Report to Shareholders"

2. "TSMC Launches the Second Wave of Personnel "Big Change" after the New Year, and the "Post-Zhang Zhongmou Era" Mesozoic Succession Plan Makes Another Effort

Ask Voice

3. "In the post-Zhang Zhongmou era, 500 days of TSMC's iron-fisted president Wei Zhejia"

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