In recent years, the United States has painstakingly wanted to kick China's semiconductor industry out of the global industrial chain, and the semiconductor field can be roughly divided into three links, namely IC design, wafer manufacturing and packaging and testing, and the United States has also implemented all restrictive measures in this regard, forcing the mainland to embark on the road of independent core manufacturing.
But can the United States really suppress the emergence of Chinese chips all the time? Microsoft founder Bill Gates has said that the US approach will only make China spend time and money to make its own chips, but it will not prevent China from having powerful chips. Now China Core has made an "epic" breakthrough, breaking through the blockade of the old United States to varying degrees from three links, American media: too fast.
First of all, in terms of IC design, mainly chip architecture and EDA industrial software, which have basically been monopolized by ARM and the three major US EDA software giants, Huawei's self-developed Kirin chip has just risen, and it has been forced to stop production by US sanctions.
But domestic manufacturers have not been idle in recent years, in the chip architecture, Loongson Zhongke has officially launched the independent research and development of LoongArch architecture, whether it is design ideas, or instruction sets are all independent research and development, completely breaking through the monopoly of ARM architecture.
Alibaba has been independently developing RISC-V architecture since 2018, and currently has 8 RISC-V architecture chips, which have not only been commercially available, but also up to now, Alibaba has invested more than 10 billion RISC-V architecture chips in the global market.
As for EDA industrial software, Huawei also came with good news some time ago, saying that it has jointly developed a 14nm design version with domestic EDA companies, which is expected to complete verification in April 2023 and then put into use.
Secondly, in terms of wafer manufacturing, TSMC and Intel have the most say, because TSMC has advanced 3nm process chip manufacturing technology and can already be mass-produced, while Intel's process level has reached 2nm and is currently in the tape-out stage.
Relatively speaking, the mainland started late in chip manufacturing, the technical advantages are not obvious, SMIC because of the restrictions of the United States and difficult to obtain advanced EUV lithography machine, so it is understandable that it cannot achieve advanced process technology, but SMIC also has the technology to manufacture 7nm process chips.
In terms of mature chips, SMIC has no pressure, 14nm process, 28nm process chips can be mass-produced, at the same time, SMIC has also built 4 wafer fabs in Shanghai, Shenzhen and other places, the purpose is to expand the production of mature chips, further improve the self-sufficiency rate of domestic chips.
In addition, in terms of semiconductor equipment, Shanghai Microelectronics' research and development of 28nm process lithography machine has entered the end; The coating of Xinyuan Micro to support the mass production of 28nm process chips has also been successfully delivered, which shows that China's semiconductor industry chain is about to fully enter the 28nm process field.
Finally, in terms of packaging and testing, this field is the strength of Chinese enterprises, because the packaging and testing equipment used by many chip companies can be independently supplied by Shanghai Microelectronics, and the packaging and testing process has reached the top level.
At present, Changjian Technology has realized the packaging and testing technology of 4nm process chips, and the 3nm process is also under development. From the estimated ranking of the top ten global packaging and testing in 2022, the share occupied by Changjian Technology is second only to ASE and Amkor, if you add the fourth and sixth ranked Tongfu Micro Power and Huatian Technology, the share of the four major packaging and testing companies in the Chinese mainland is close to ASE, which shows that the strength of Chinese enterprises in the field of packaging and testing cannot be underestimated.
On the whole, the mainland's breakthrough in the semiconductor field is still considerable, if you want to say "epic" breakthroughs, you must also look at quantum chips and photonic chips.
As a stepping stone to the new era, Continental has also made great achievements in the field of photonic chips and quantum chips, the quantum chip production line has been officially put into production, and domestic non-destructive probes, quantum chip refrigerators and other products are the products of the quantum chip production line. The emergence of these products has also made Continental the third largest country in the world to support the delivery of quantum computers.
This series of breakthroughs not only proves that the US sanctions against China have not only not achieved results, but have promoted the mainland's independent research and development process in the field of semiconductors, which will only make the United States work in vain, and US companies will also suffer, and the gains are not worth the losses!
This article is reproduced from Step Boy