Recently, a new Huawei chip - Kirin KC10 was exposed for the first time, and its performance was comparable to that of Qualcomm Snapdragon 8 Gen 2.
The initial exposure of the information came from a picture, according to the image information displayed on the picture, it seems that this is the system interface of the Huawei Mate50 Pro engineering machine. In the processor column of the system interface clearly shows the specific model "KC10", combined with the senior blogger's revelation that KC10 chip is an iterative product of Kirin 9000, if it can be mass-produced, the official naming probability will use "Kirin 9010". Although it is only a revelation, it has not yet been officially put on the market, but from the paper data, the strength of this chip cannot be underestimated.
In terms of running scores, the KC10 chip's regular mode running score reached about 1.2 million points, and the performance in performance mode was more aggressive to reach 1.3 million points, which is comparable to the industry's current recognized Android camp's strongest chip Qualcomm Snapdragon 8 Gen 2. In addition, another chip with the model number KC20 was exposed.
It can be seen that although Huawei has long been unable to achieve the mass production of Kirin chips due to external force majeure factors such as sanctions and bans, and Kirin chips have been out of gear for more than two years, Huawei has never given up the exploration of independent chips, and continues to maintain and devote itself to the research and development and design of high-end independent chips. Once the external factors in the later stage are solved and the restrictions can be lifted, Huawei's technical reserves and the KC10 and KC20 chips developed during the previous gap period can also be put into mass production, and at the same time, the chip work continuously developed during this period can also accumulate more experience itself.
As we all know, HiSilicon Kirin chips have completely become a swan song due to the continuous increase in restrictions imposed by US sanctions and bans.
Chip production and supply foundry channels were completely blocked, resulting in Huawei mobile phones losing the core differentiated competitiveness at the hardware level, at the same time, the difficult production dilemma of independent HiSilicon Kirin chips is directly related to and affects the lifeblood of Huawei's mobile phone business, and the market share of Huawei mobile phones continues to decline sharply, from the former domestic mobile phone brother to be forced to withdraw from the first echelon.
Different from the regular market competition of other brands, Huawei's special encounter is more pathotic. At this stage, relying on the 4G chips supplied by Qualcomm, it is difficult to continue to survive for the mobile phone business, which is not a long-term solution after all. Huawei's Kirin chip, which has high hopes, can be reborn from the ashes and get out of the predicament as soon as possible also affects the hearts of many Chinese people, and facts have proved that despite the limitations and influences of many external factors, Huawei has not given up the exploration of independent chips.
A red heart is prepared with two hands, and Huawei's chip supply chain is limited under the dilemma of obviously not having the conditions for independent chip mass production. At present, as for 2023, Huawei's mobile phone product line will still be dominated by the use of Qualcomm Snapdragon 4G chips.
At present, it seems that Huawei chip breakthrough still needs time, from the actual performance of previous generations of products and consumer market feedback is not difficult to conclude that technical reserves and product precipitation is one aspect, but whether Huawei can break through is still not optimistic, not only Huawei's own efforts, but also the joint efforts of domestic semiconductors and related industrial chains, after all, with Huawei's R&D capabilities to independently design first-class independent high-end Soc, there are almost no problems at the technical level, and how to put into mass production is the most difficult problem. Domestic chip foundries and related semiconductor industry chains are the key.