In recent years, the concept of wearable devices has continued to be popular, and this portable device is not only used as hardware, but also can achieve powerful functions through software support, data interaction, and cloud interaction. Nowadays, wearable devices are getting smaller and smaller, and they have changed from a very unrealistic concept to a daily routine that we are exposed to every day. Unconsciously, our food, clothing, housing and transportation are "embedded" by smart wearable devices.
Even the just-concluded Winter Olympics have adopted "wearable motion sensors" in the arena to collect a large amount of basic data on short-track speed skaters. The display stage of smart wearable devices can be seen everywhere.
Recently, FORESEE, the industry-class storage brand under Jiangbolong, closely follows the market "trend" and launches ePOP3, an embedded "fashion darling", to jointly promote the deep integration of intelligence and application market with industry customers from the "source".
（FORESEE ePOP3）
Cutting-edge performance and design
ePOP3 integrates eMMC and LPDDR in the same package, and currently provides the mainstream 8GB+8Gb and 8GB+4Gb capacity combinations in the market, the maximum thickness is controlled within 0.9mm, and with a low-power mode (compared to normal mode, power consumption can be reduced by up to 30%), effectively improving the endurance of the terminal equipment. Among them, NAND Flash uses high-performance flash memory chips with DRAM rates up to 1600Mbps, which balances performance, durability and stability just right to achieve the effect of 1+1 greater than 2.
(Main parameters)
Born for smart wearables
ePOP3 meets the needs of devices for storage and caching of data, can be easily faced with devices with high integration, and is more suitable for terminal applications with higher requirements for miniaturization and low power consumption such as smart wear and educational electronics.
(Main applications)
Save PCB space in end devices by 40%~60%
With the user's requirements for the appearance, volume, weight, performance and other requirements of intelligent equipment gradually improved, terminal manufacturers need to improve the level and quality of raw materials on the one hand, and on the other hand, they need to maximize the utilization of each PCB board space. The ePOP3 "two-in-one" packaging technology integrates RAM and ROM, and can be mounted on top of compatible host CPUs, optimizing the PCB board trace design, greatly saving the internal space of the device, so that intelligent terminals do not have to worry about insufficient internal component space while having multitasking.
（2 in 1）
Optimize the purchase BOM for end customers
The ePOP3 uses TFBGA stacking packaging technology to simplify the procurement of materials from embedded multimedia chips and dynamic random access memory (DRAM) to single material procurement, streamlining the supply chain of components, and reducing costs while controlling the supply cycle.
(All-in-one package)
Preferential resources ensure long-term stable quality and supply
FORESEE ePOP3 adopts original factory resources, all granules from access to finished products, each step has been verified by Jiangbolong's comprehensive quality management system, through the customer demand, product development, material selection and production delivery and other aspects of management, strengthen stocking and backup, to ensure long-term stable supply demand.
1/ The Flash with this product has great advantages in life and stability compared to conventional TLC Flash.
2/ DRAM uses a new generation of 20nm process, compared with the previous generation of the old 30nm process, under the premise of controllable cost, the performance has been further improved.
A comprehensive software and hardware test solution brings about a "qualitative" leap
FORESEE ePOP3 adopts the SLT chip test scheme independently developed by Jiang Bolong, innovatively achieves large-scale testing of eMMC (FT, RDT) and LPDDR at high frequency in the same product, realizes batch automatic test machines, and independently develops test procedures, with the number of tests up to 256 and can be expanded, can achieve eMMC testing, DRAM speed testing, functional testing, power consumption testing and other test capabilities in the same product, escorting product quality.
(Automated Test Machine)
prospect
Since its establishment 11 years ago, Jiangbolong Embedded Storage Product Line has had considerable experience in smart wearables, IOTs, smartphones and other applications, and has the ability to deliver in line with various customer requirements. With the gradual maturity and popularization of technologies such as AI/VR/AR, smart wearable devices will become important nodes in the field of artificial intelligence. This year, the embedded storage product line will continue to upgrade and expand the existing product specifications and selections, ePOP4x, eMMC, eMCP and UFS and other major products are all listed, more capacity combinations and performance combinations fully cover intelligent terminal applications, providing customers with a variety of choices.