Once considered an innovative high-density non-volatile memory technology capable of creating new applications, 3D XPoint has never really reached its potential in the market. While there is still a lot of value to Intel and the storage industry, its development and production costs may still be too high to continue technologically.
According to Blocks & Files, information about Intel's development of fourth-generation Optane products at its R&D center in New Mexico recently revealed that Intel was already working on it in April 2020. The project manager responsible for the fourth generation of Optane product development is Darren Denardis, who served as a seminar organizer for Intel's 2010 Society for Materials Research Spring Meetings and holds various patents.
Intel launched the second generation of Optane products in December 2020, and the public Optane technology roadmap shows that the third and fourth generation Optane products based on Optane technology will be launched next. However, a growing amount of information recently suggests that it seems unlikely to see third- and fourth-generation Optane products on the market.
Some time ago, in a memorandum of understanding of Intel's data center and AI business, some media found that Alper Ilkbahar, head of Optane's business, left Intel on February 11. In addition, it was found that Intel's Optane business was seriously loss-making. Intel's technology partner Micron had earlier announced the suspension of further development of all 3D XPoint technology-based products and sold its 3D XPoint flash memory chip factory in Lehi, Utah, to Texas Instruments for $1.5 billion. Previously, Micron was the only manufacturer to produce 3D XPoint flash memory chips, and after its abandonment, Intel's Optane business prospects became bleak.
Blocks & Files has written to Intel for information, but has not received a reply.