Last night, the domestic chip manufacturer Tsinghua Tsinghua Unigroup Held the "People's 5G" Exhibition Sharp Online Conference, and officially released two 5G chips of Tanggula T770 and Tanggula T760, to simply take a look at it
In terms of specifications, Tanggula T770 and Tanggula T760 are based on 6nm process, the CPU is A76+A55 eight-core architecture (there is a difference in the number of specific large, medium, and small cores), Mali G57 GPU. Specific Tanggula T770 supports 4K60 frames, up to 108MP, quad-core ISP, supports LPDDR4X, AI computing power of 4.8TOPS; Tanggula T760 supports 4K30 frames, up to 64 million pixel cameras, quad-core ISP, AI hash rate of 2.4TOPS.
Officially, Tanggula T770 and Tanggula T760 positioning experience upgrades are up to 100% higher than the performance of the previous generation, the integration is increased by more than 100%, the overall power consumption is reduced by about 37%, the endurance is increased by 30%, and the 5G R16, 5G network slicing and other technologies are supported, and the 5G speed is increased by more than 30%.
Looking at the paper parameters alone, the Tsinghua Unigroup Tanggula T770 5G SoC has been flat or even partially ahead of the Snapdragon 765G, compared with the T710 we tested before, the progress is very large, in the current situation that Kirin can not produce, the force in the low-end market, is a good choice.
Specific mass production time, the official announcement of China Telecom Tianyi No. 1 2022 new machine will be the world's first Unigroup Exhibition T770 5G chip in the spring of 2022; ZTE, Hisense's new generation of 5G mobile phones will be equipped with Tanggula T760 5G chip, Hisense also has a three-proof explosion-proof vehicle tablet will also be equipped with Tanggula T760.
The actual performance is equivalent to the new machine listing experience~
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