On October 26, experts and scholars in the field of integrated circuits from all over the country and responsible persons of well-known enterprises gathered in Jinpu New District to discuss and exchange the future development trend of integrated circuits, and to carry out project and technical docking with integrated circuit enterprises in Jinpu New District. Attracting so many national high-level integrated circuit experts into Dalian is inseparable from the fruitful results of the rapid development of the integrated circuit industry in Jinpu New Area in recent years. According to statistics, in the past three years, the integrated circuit industry in Jinpu New Area has grown by more than 40%. Last year, the 13 integrated circuit enterprises in Jinpu New Area achieved an industrial output value of 31.5 billion yuan, and have initially formed a relatively complete industrial chain integrating manufacturing, equipment, materials and packaging.
Marked by the settlement of the Intel project in 2007, the integrated circuit industry in Jinpu New Area has grown from scratch, from small to large, from foreign-funded enterprises such as Roma Electronics and Sanken Electric to attracting world-renowned semiconductor supporting and service enterprises such as Mosses Lake Chemical and Air Liquide Group of france, and at the same time cultivating domestic first-class private enterprises such as Jiafeng Electronics, Collid Chemical Technology, hengkun new materials, etc. The industry has made major breakthroughs and has now become an important growth pole of China's Bohai Bay semiconductor industry.
At present, the industrial foundation of the integrated circuit industry in Jinpu New Area has basically taken shape. A relatively complete industrial chain of chip manufacturing, special materials, special equipment, packaging, etc. has initially taken shape. Intel, Rohm Electronics, Dali Kaipu, Yishengda, Sanken Electric, Winbond Chemical, Taiyuan Precision and other nearly 30 integrated circuit enterprises, the business covers integrated circuit manufacturing and related equipment and materials and other fields. Among them, the field of integrated circuit manufacturing mainly includes Intel, Rohm Electronics, Optoelectronics and other enterprises, the main products are non-volatile memory chips, gallium nitride epitaxial wafers and power devices. There are nearly 16 enterprises in the field of integrated circuit equipment and materials, and the main products are integrated circuit precursor materials, high-purity electronic gases, special gases, gas purification equipment, packaging molds, etc.
The industry has outstanding characteristics and the market share of key products has been continuously improved. Represented by Intel Semiconductor (Dalian) Co., Ltd., the integrated circuit industry in Jinpu New Area has formed characteristics in the field of non-volatile memory, the technical level is leading the world, and the output value scale is also in the forefront of China. At the same time, Jinpu New Area wide bandgap semiconductors and laser module devices are at the leading level in China.
Integrated circuit equipment material technology leading, successfully into the international supply chain. First, integrated circuit equipment enterprises monopolize the domestic market segment, Dalian Jiafeng Electronics' automatic viscosity machine and chip binding machine to fill the domestic gap, Dalian Huabang Technology's gas purification equipment is sold to INTEL, Hynix, SMIC and other leading enterprises at home and abroad; the second is that integrated circuit materials into the international supply chain, Dalian Kelide has been encouraged and supported by the state, and its high-purity special gases are widely used in the fields of integrated circuits and LED manufacturing at home and abroad. Dalian Hengkun independently developed precursor material TEOS (ethyl orthosilicate) is widely used in vapor deposition process, and the technical level has reached the international leading level.
According to the relevant leaders of Jinpu New District, in the next step, Jinpu New District will adhere to the strategy of "revitalizing stocks, introducing increments, leading driving, and cluster development", with innovation-driven, quality improvement and efficiency improvement as the core, and strive to introduce a new integrated circuit chip manufacturing production line to make the integrated circuit chip manufacturing industry in Jinpu New Area more open and more diversified. Gradually develop the equipment and materials industry, in the field of integrated circuit special equipment, focus on the development of etching machines, PVD, cleaning machines, wire machines, tablet loading machines, oxidation and heat treatment equipment, gas purification equipment, testing instruments and other semiconductor key equipment and spare parts manufacturing that can be applied to local integrated circuit manufacturing enterprises. In the field of key materials for integrated circuits, the focus is on the development of key materials such as high-purity electronic gases, photoresists, cleaning fluids, lead frames, and encapsulation resins. And through the activities of the National High-level Integrated Circuit Expert Group in Dalian, an industrial chain, supply chain, value chain and innovation chain suitable for the development of integrated circuits in Jinpu New Area will be established, and a new model and mechanism for "four chains" collaboration will be established. Vigorously promote the localization of the supply chain, improve the security level of the industrial chain, and form an integrated circuit industry chain pattern with complete categories, excellent production capacity and full chain security. Strengthen the construction of common technology platforms for key links, fields, and products, form a comprehensive development model based on innovation chain sharing, supply chain collaboration, data chain linkage, and industrial chain collaboration, and promote the high-end of the integrated circuit industry chain and value chain. Under the industrial Internet architecture, the new generation of information technology such as artificial intelligence, big data, cloud computing, and the Internet of Things will be deeply integrated with the integrated circuit industry. Increase the capacity of non-volatile memory. Relying on the existing Intel (Dalian) non-volatile memory manufacturing base, we will continue to promote the release of project production capacity, increase the support for the research and development and industrialization of new storage, further promote the continuous expansion of the non-volatile memory phase III project, and consolidate the dominant position of the regional industry in the field of non-volatile memory.