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Reading guide:It's a complete showdown! TSMC reached an agreement with the United States, foreign media: the routine is too deep!
In the great changes in the global semiconductor industry pattern, the cooperation and game between TSMC and the United States has undoubtedly become a major attraction in this industrial transformation. In order to consolidate its leading position in the global semiconductor field, the United States has tried to attract and control the world's top semiconductor companies through a series of policy measures. TSMC, as the world's leading semiconductor manufacturer, every step of its decision affects the nerves of the entire industry, and now the United States and TSMC have begun a complete showdown.
1. The U.S. chip strategy and TSMC's challenges
In recent years, in order to maintain its technological hegemony, the United States has continuously strengthened its control over the semiconductor industry. After Biden took office, he listed the semiconductor industry as a core area of "security", and restricted the development of semiconductor companies in other countries by issuing and modifying chip bans. At the same time, the United States has also passed a chip subsidy plan of up to $52 billion, intending to attract the world's top semiconductor companies to invest and build factories in the United States.
However, the implementation of this plan has suffered setbacks. Although the United States has given a large amount of subsidies to local semiconductor companies such as Intel, Nvidia, and Qualcomm, it has been slow to fulfill its promises for foreign companies such as TSMC and Samsung. This led to the stagnation of TSMC and Samsung's investment plans in the United States, and even delayed the construction of factories.
Second, TSMC's strategic adjustment and the temptation of U.S. subsidies
In the face of pressure and challenges from the United States, TSMC had to revisit its investment plans in the United States. After careful consideration, TSMC decided to adopt a series of strategic adjustments to cope with the current predicament.
First, TSMC decided to expand its investment in Japan to diversify its investment in the United States. This strategy will not only help alleviate the pressure brought by the United States, but also further strengthen TSMC's position in the global semiconductor market.
Second, while TSMC adheres to its own development strategy, it has also begun to conduct in-depth communication and consultation with the United States. After several rounds of negotiations, TSMC finally reached an agreement with the U.S. side, receiving $6.6 billion in subsidies and $5 billion in low-interest loans. This agreement not only solves TSMC's funding problem for building a factory in the United States, but also provides strong support for its future development.
However, this agreement has not come without a cost. The U.S. side demanded that TSMC must expand its investment in the U.S. and build a third 2nm wafer fab. This means that TSMC will have to devote more resources and energy to meet the requirements of the US side. But from another perspective, it is also an important opportunity for TSMC to further expand its global market share and consolidate its leading position in the industry.
3. The "routine" in the eyes of foreign media and the truth behind it
Regarding the agreement reached between TSMC and the United States, foreign media have said that "there are so many routines". However, behind this, there are actually more complex industrial logic and strategic considerations.
First of all, from the perspective of industrial logic, the semiconductor industry is a field that is highly dependent on technological innovation and capital investment. In this field, only enterprises with sufficient technical strength and capital support can survive. Therefore, for a company like TSMC, receiving subsidies and loans from the United States is undoubtedly a huge support. This will not only help solve the problem of funding for the construction of a factory in the United States, but also provide more possibilities for its future development.
Secondly, from the perspective of strategic considerations, TSMC and the United States reached this agreement for many reasons. On the one hand, by expanding its investment in the United States, TSMC can further strengthen its position in the global semiconductor market and form closer cooperation with other competitors. On the other hand, by building a third 2nm wafer fab, TSMC can further enhance its technical strength and production capacity, laying a more solid foundation for future market competition.
Of course, this agreement is not without its risks. The U.S. side requires TSMC to meet its specific conditions and requirements, which may bring certain pressure and challenges to TSMC. But overall, this agreement is still an option that has more advantages than disadvantages for TSMC.
IV. Conclusion
In the great changes in the global semiconductor industry pattern, the cooperation and game between TSMC and the United States will continue to be staged. Whether the United States is trying to control the hegemony of the global semiconductor industry through means, or TSMC is responding to challenges and seeking development through strategic adjustment, it will have a far-reaching impact on the future of the global semiconductor industry. In this era full of opportunities and challenges, we look forward to more innovations and breakthroughs from domestic technology enterprises, which can promote the sustainable development of the entire industry.