Huawei Pura 70 Pro teardown: 90% of the internal components are domestic!
Xinzhixun
2024-05-18 10:18Published on the official account of Guangdong Xinzhixun
On April 18 this year, the Huawei Pura70 series (formerly the P70 series) was officially launched without a product launch conference, and the mobile phone equipped with Huawei's latest Kirin 9010 processor also triggered a rush of domestic netizens.
Recently, iFixit, a foreign dismantling agency, and its partner TechSearch International, disassembled the Pura 70 Pro and analyzed the relevant components on its motherboard.
Let's start with the motherboard on the side of the SoC processor, and like many modern phone processors and DRAM packages, the Kirin 9010 processor is stacked underneath the 12GB SK Hynix DRAM chip.
After removing the SK Hynix DRAM chip, we see the main component numbers on the motherboard as follows:
△红色：海思 Hi36A0 GFCV121（Kirin 9010）
橙色：3GC10D95FV0YG 1 TB NAND Flash
Yellow: Richtek RT9471D 3 A single-cell switching battery charge management IC
Green: The Southchip SC8565 may be a switched-capacitor power converter
Sky blue: Awinic AW86927 tactile driver
蓝色：力芯微（ETEK Microelectronics） ET7303 USB Type-C 供电控制器
紫色：圣邦微（SG Micro）SGM6611C 7A同步升压转换器
△ Red: Lixin Micro ET2095 load switch
Orange: Aiwei AW32905 overvoltage protection load switch
Yellow: Shengbang Micro SGM2578AAD load switch
Green: HiSilicon Hi1105 GFCV120 WiFi 6, Bluetooth, GNSS, FM, and IR controllers
A closer look at the Kirin 9010 chip shows that the markings on the outside of the chip appear to be similar to those of the older Kirin 9000S. An industry expert at iFixit noted that the chip logo is unusual because new chips often have their own model number, and the Kirin 9010 (model HI36A0 revision GFCV121) and Kirin 9000S (model HI36A0 revision GFCV120) share the same model number.
Previously, TechInsights reported that the Kirin9010 appears to use the same process as the Kirin9000s. The general perception is that the core of the Kirin 9010 is based on a modification of the design of the Kirin 9000S, designed to increase production. However, these improvements may not be limited to production – early benchmarks have shown that the Kirin 9010 also offers a bit of a performance improvement over the Kirin 9000S.
Comparing the benchmarks between the Kirin 9000S, Kirin 9010, and Qualcomm Snapdragon 8 Gen 3, it can be seen that the Kirin 9010 does improve its performance by a single-digit percentage percentage over the Kirin 9000S, but it is far lower than the Qualcomm Snapdragon 8 Gen 3 manufactured by TSMC N4P.
To achieve these single-digit percentage performance gains, the Kirin 9010's 12-core SoC uses six ARM Cortex-A510 efficiency cores running at 1.55GHz, paired with four Taishan v121 cores running at 2.18GHz and two Taishan v121 cores running at 2.3GHz.
The teardown report also shows that the Huawei Pura 70 Pro is equipped with 1TB of NAND Flash memory inside. According to TechSearch's analysis based on X-ray photos, there are eight NAND Flash dies on top of the flash memory controller chip connected to the flip chip, that is, the 1TB NAND Flash flash memory is composed of 8 NAND Flash chips stacked with the flash controller.
TechSearch believes that Huawei HiSilicon may have designed a supporting flash memory controller and tested and packaged the purchased NAND Flash chips, but the storage controller itself lacks marking, so it is impossible to determine this judgment.
△1TB NAND Flash芯片中封装的闪存控制器
As for the supplier of the NAND Flash chip, it is uncertain because there is no marking on the chip package to clearly identify the manufacturer, but it is likely that it was designed and manufactured by a local Chinese manufacturer.
Moving on to the other side of the motherboard:
△Red: HiSilicon Hi6421 GFCV950 power management IC
橙色：海思 Hi6423 GFCV250 电源管理IC
Yellow: Probably the VIP Innovation (WPInno) WP5701GC wireless charging controller
Green: Goodix TFA9874C audio amplifier
Sky blue: AW3642 LED flash driver
蓝色:OmniVision WL2868C摄像头电源管理
Purple: Shengbang Micro SGM66055 Boost Converter
Black: Possibly a HiSilicon RTQQ0Q0BB front-end module
白色:Bosch Sensortec BMI270加速度计和陀螺仪
Let's take a look at the RF daughter board:
△红色:可能是海思 VTQQ7Q0U6 射频收发器
Orange: Probably a HiSilicon RTQQ0Q0BB front-end module
黄色:昂瑞微(OnMicro)OM9902-11相5N多模多频段功放模块
Also, according to the latest report from Techinsights, three of the four image sensors in the Huawei Pura 70 Pro are from Omnivision (the other is Sony's CIS), and two of them are made in China.
Brief summary:
According to the internal component analysis of Huawei Pura 70 Pro after disassembly, 26 of the 29 components listed above are supplied by Chinese manufacturers (including Taiwanese company Rich), accounting for 90% of the domestic production, and it seems that 8 of them are self-developed chips from Huawei HiSilicon. This also reflects that the domestic component supply chain has basically been able to cover all kinds of components required by domestic high-end smartphones.
Editor: Xinzhixun-Rogue Sword
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Huawei Pura 70 Pro teardown: 90% of the internal components are domestic! -
Huawei Pura 70 Pro teardown: 90% of the internal components are domestic! -
Huawei Pura 70 Pro teardown: 90% of the internal components are domestic! -
Huawei Pura 70 Pro teardown: 90% of the internal components are domestic! -
Huawei Pura 70 Pro teardown: 90% of the internal components are domestic! -
Huawei Pura 70 Pro teardown: 90% of the internal components are domestic! -
Huawei Pura 70 Pro teardown: 90% of the internal components are domestic! -
Huawei Pura 70 Pro teardown: 90% of the internal components are domestic! -
Huawei Pura 70 Pro teardown: 90% of the internal components are domestic! -
Huawei Pura 70 Pro teardown: 90% of the internal components are domestic! -
Huawei Pura 70 Pro teardown: 90% of the internal components are domestic! -
Huawei Pura 70 Pro teardown: 90% of the internal components are domestic!