Preface
In order to further play the role of the wide bandgap alliance as a bridge, highlight the professional and industrial advantages in the field of wide bandgap semiconductors, strengthen the effect of technology empowerment, promote innovation and cooperation between enterprises in the wide bandgap semiconductor industry chain, and build a docking and communication platform between enterprises and users, Zhongguancun Trina Wide Bandgap Semiconductor Technology Innovation Alliance Wide Bandgap and Semi-Wide Bandgap Semiconductor Industry Technology Roadshow.
This event will discuss the application and innovation of advanced technology in the industrial chain with representatives of well-known entrepreneurs in the industry, exchange and share experience and insights on the development of the industry, find effective ways to promote the coordinated development of all links in the industrial chain, and promote the overall improvement and optimization of the wide bandgap semiconductor industry chain in mainland China.
1. Event information
Time: 15:00-17:15, June 5, 2024
Venue: Conference Room 1, 4th Floor, Grand Skylight Hotel, Beijing
Organizers:
Zhongguancun Trina Wide Bandgap Semiconductor Technology Innovation Alliance
Zhongguancun Industrial Technology Alliance Federation
2. Audience registration
1. Representatives of universities, research institutes, enterprises, financial institutions, and industry alliances are welcome to sign up and participate in the event;
2. Due to the need to register to enter the venue, all participants should scan the QR code below to fill in the registration information.
Please scan the QR code to complete the registration
3. Introduction to the roadshow project
01Anxin Investment Management Co., Ltd
Speaker: Wang Yonggang, Chairman of Anxin Investment Management Co., Ltd
Speech Title: Technology Capital Helps Build a Compound Semiconductor Industry Ecology
02Wuhu Yuqin Semiconductor Technology Co., Ltd
Publisher: Yao Tai, Chairman of Wuhu Yuqin Semiconductor Technology Co., Ltd
Roadshow project name: 6-8 inch high-quality silicon carbide monocrystalline industrialization project for high-power devices
03Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences
Publisher: Yi Allen, Associate Researcher, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences
Roadshow Project Name: Silicon Carbide Composite Substrate - 8-inch Silicon Carbide Low-Cost Solution
04 Zhangjiagang Anchu Technology Co., Ltd
Publisher: Li Zhihao, General Manager of Zhangjiagang Anchu Technology Co., Ltd
Roadshow Project Name: High-performance silicon carbide polishing and cleaning integrated solution
05Youai Zhihe Robot Technology Co., Ltd
Publisher: Jiang Xubin, Deputy General Manager of Youai Zhihe Robot Technology Co., Ltd
Roadshow Project Name: Application of AMHS in Silicon Carbide Substrate Processing Scenarios
06Beijing Qinglian Technology Co., Ltd
Publisher: Jia Qiang, Chairman of Beijing Qinglian Technology Co., Ltd
Roadshow Project Name: High-Performance Power Device Packaging Solutions
07Jiangsu Junge Zhicheng Technology Co., Ltd
Publisher: Zhou Shezhu, General Manager of Jiangsu Junge Zhicheng Technology Co., Ltd
Roadshow Project Title: Research on Carbon Material Purification Technology and Its Industrialization
08 Shanghai Dahua - Qianye Instrument Co., Ltd
Publisher: Keno Hiroshima, General Manager and Director of Shanghai Dahua-Chino Instrument Co., Ltd
Roadshow Project Title: Application of Infrared Radiation Temperature in the Semiconductor Industry
09 Wuchuang Xinyan Technology (Wuhan) Co., Ltd
Publisher: Zhang Shi, CEO of Wuchuang Xinyan Technology (Wuhan) Co., Ltd
Roadshow Project Name: Semiconductor Process and Reliability Industrial Software Development and Services
Fourth, the contact person
Teacher Hou / 13811837211
Email: [email protected]
Please scan the QR code to complete the registration
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