Leading semiconductor companies gathered at SEMiBAY to showcase the ecological grandeur of China's entire semiconductor industry chain

SHENZHEN, China, May 11, 2024 /PRNewswire/ --

SEMiBAY Bay Core Exhibition

Driven by the strong drive of the Greater Bay Area, "China's largest incremental market", this professional exhibition of Chinese semiconductors has quickly gathered the attention of the global semiconductor industry in just over two months with its unique charm, and has successfully won the enthusiastic response and in-depth cooperation commitment of more than 200 leading brands in the semiconductor industry at home and abroad. This powerful group lineup covers the front-line forces of the upstream and downstream of the industrial chain, and they work together to support the first event built by the Shenzhen Municipal Government

"Semiconductor Industry Chain Ecological Expo"

Jointly open a new chapter in the semiconductor industry, witness and promote the innovation, integration and development of the semiconductor ecosystem in China and the world.

Guided by the Shenzhen Municipal People's Government, hosted by the Shenzhen Municipal Development and Reform Commission and the Shenzhen Semiconductor and Integrated Circuit Industry Alliance (Shenzhen Chip Alliance), SEMiBAY aims to implement the decision-making and deployment of "one cluster, one exhibition" in Shenzhen's "20+8" industry, and focuses on high-quality resources such as major industrial project clusters led by Shenzhen Heavy Investment

Semiconductor equipment, materials, wafer fabrication, packaging and testing, design and application

and other focus areas.

Well-known domestic and foreign enterprises that have clearly participated in the exhibition and participated in the conference (in no particular order)

• 全球Top 10半导体设备厂商：应用材料(Applied Materials)、阿斯麦(ASML)、泛林(Lam Research)、科磊(KLA)、TEL、迪恩士(SCREEN)；
• 国产Top 10半导体设备厂商:北方华创(NAURA)、中微半导体(AMEC)、盛美半导体(ACM)、拓荆科技(Piotech)、华海清科(HWATSING)、芯源微(KINGSEMI)、中科飞测(SKYVERSE);
• Other leading manufacturers of equipment and materials: EDWARDS, Tokyo Precision Electronics (ACCRETECH), Shanghai Microelectronics (SMEE), Anji Technology (ANJI), Huafeng Measurement and Control (ACCOTEST), Han's Semiconductor (HSET), Tianke Heda (Tankeblue), Zhonghuan Leading (ZHONGHUAN), China Electronics Technology (CETC), etc.;
• Wafer foundries and manufacturers: SMIC, China Resources Micro, Founder Micro, Pengxin Micro, Sunway, Pengxinxu, etc.

The mission of SEMiBAY is to promote win-win cooperation in the semiconductor industry chain.

From four dimensions: industrial ecology, technology ecology, capital ecology and talent ecology

Build a healthy development ecosystem for China's semiconductors, and build an exchange and cooperation platform that can promote the deep integration of the semiconductor industry chain, supply chain and value chain at home and abroad.

The first SEMiBAY will be held at:

September 9-11, 2024 at Shenzhen Convention and Exhibition Center (Futian)

held, this exhibition will be:

"Major Semiconductor Project Clusters and Largest Incremental Markets"

On the basis, invite the upstream and downstream of the semiconductor industry chain from the Bay Area, the whole country and the world

800

A number of enterprises and organizations participated in the exhibition. The fair is expected to attract domestic and international semiconductor industry leaders, professionals, procurement and supply chain management decision-makers from semiconductor and electronics manufacturers, as well as high-tech industry executives, marketers and technicians

More than 30,000

Key buyers and professional visitors to participate in the three-day exhibition, summit, thematic forum and various conference activities.

SEMiBAY/Bay Core Exhibition and Conference Event Arrangement

• Five exhibition zones: wafer fabrication, packaging and testing, compound semiconductors, automotive semiconductors, EDA/IP and IC design
• Bay Area Semiconductor Conference: Opening Ceremony and Summit Forum, Technology Forum, Dean Forum

• 20+ professional forums: topics related to technology and application innovation in the fields of wafer manufacturing process, packaging and test, materials technology, chiplet and advanced packaging, EDA/IP, as well as the challenges and opportunities of emerging applications such as AI, 5G, Internet of Things, automotive electronics, third-generation semiconductors and new energy to the semiconductor industry.
• Procurement matchmaking meeting: Semiconductor equipment and material manufacturers are invited to communicate and negotiate directly with representatives of wafer and packaging and testing plants.
• The list of the six major semiconductors was released: IC design, EDA/IP/Chiplet, packaging and testing (OSAT), wafer foundry and IDM, semiconductor equipment, and semiconductor materials
• Semiconductor industry analysis report release: Relying on the elite industry analyst team, it provides comprehensive and in-depth semiconductor industry analysis reports for government organizations, investment institutions, semiconductor industry chain enterprises and related application industry organizations.
• Award Ceremony and Exchange Dinner: Government leaders, industry experts, scholars and business representatives will be invited to participate in the award ceremony and recognition of enterprises, teams and individuals with outstanding achievements in various segments of the semiconductor industry chain international and domestic manufacturers, and select technologies, products and solutions with unique innovation and significant influence.