What is still the big thing that scared Japan, the mainland photoresist technology has made a historic breakthrough! What is going on?
It is important to know that photoresist technology has always been one of the core technologies in the field of semiconductor manufacturing, and Japan has long occupied a dominant position in this field.
However, in recent years, the mainland has made great progress in scientific and technological innovation, and finally made great progress in this key area, which has put tremendous pressure on Japan.
Photoresist technology is actually one of the key links in the semiconductor manufacturing process, mainly used for chip pattern manufacturing.
To put it simply, the photoresist is applied to the surface of the silicon wafer, and the pattern on the template is finally projected onto the photoresist through ultraviolet irradiation, and finally the pattern is formed, which will then be used as a mask for subsequent process steps such as etching and deposition, and finally complete the manufacture of the chip.
The key lies in the selection of photosensitive materials and the control of processing technology.
Photoresist must have good resolution, high sensitivity to ultraviolet rays and chemical resistance to ensure the quality and performance of the final manufactured chip, so the research and development and production of photoresist has always been one of the important research directions in the semiconductor industry.
Speaking of which, we also need to understand, where is the difficulty of photoresist technology?
As one of the important links in the field of semiconductor manufacturing, photoresist technology is mainly reflected in the high resolution requirements, the selection and preparation of photosensitive materials, and the control of process parameters.
First of all, one of the difficult breakthroughs in photoresist technology is the high resolution requirements. Especially with the continuous progress of semiconductor technology, the line width and spacing requirements on the chip will become smaller and smaller, even reaching tens of nanometers or even smaller scales.
The resolution of the photoresist determines the line width and spacing of the final chip, so it must be able to meet extremely high resolution requirements. Traditional lithography technology can no longer meet this demand, so it is necessary to introduce more advanced technologies and materials to improve resolution, such as multiple beams, extreme ultraviolet lithography and other technologies.
Secondly, the selection and preparation of photoresist photoresist materials is also one of the key problems that photoresist technology is difficult to break through. Photoresists must be highly photosensitive, able to cure quickly upon UV exposure to form the desired pattern.
However, it is not easy to achieve a high degree of photosensitivity and requires a balance between the chemical and physical properties of the material, as well as process controllability. In addition, the preparation process of photoresist also needs to be strictly controlled to ensure its performance stability and consistency, which also has high requirements for the production process.
Finally, the control of process parameters is another important factor that is difficult to break through in photoresist technology. Process parameters such as coating, exposure, and development of the photoresist have a significant impact on the quality of the final chip.
For example, the control of coating thickness directly affects the resolution of the photoresist and the quality of the pattern, the stability of the exposure light source and the uniformity of the light intensity distribution directly affect the clarity and consistency of the pattern, and the control of the development process directly affects the formation of the pattern and the quality of the edge, so it is necessary to accurately control and optimize these process parameters to ensure the manufacture of high-quality chips.
Although the difficulties of photoresist technology are multifaceted, and these difficulties not only need to be broken in theory, but also need to be effectively solved in actual production in order to promote its further development and application.
So, how exactly did the mainland break through these difficulties? Even Japan felt scared.
The first aspect. Support for scientific research: The mainland government has long attached great importance to scientific and technological innovation, and has continuously increased its support and investment in scientific research. Through the establishment of special funds, support for scientific research projects, etc., encourage scientific researchers to conduct in-depth research in the field of photoresist technology.
The second aspect. Personnel training and introduction: The mainland has also made remarkable progress in personnel training and introduction. By building a first-class scientific research team and introducing world-class scientists and technicians, we will continuously improve the research and development level and technical strength of the mainland in the field of photoresist technology.
The third aspect. Innovation-driven development strategy: The mainland has also put forward an innovation-driven development strategy, so that scientific and technological innovation can be used as the core driving force for economic development. Under the guidance of this strategy, Continental has also made a series of major breakthroughs in the field of photoresist technology, and promoted the rapid development of China's semiconductor industry.
In general, the success of the historic breakthrough in photoresist technology in mainland China is also the result of the joint efforts of the government, enterprises and scientific research institutions, and is the embodiment of the combination of production, education and research and international cooperation.
This breakthrough not only means that the strength and status of the mainland in the field of semiconductor manufacturing have been further consolidated and improved, but also lays a solid foundation for the continuous improvement of the mainland's scientific and technological innovation capabilities.
In the future, Continental will continue to increase R&D investment in key areas such as photoresist technology, strengthen exchanges and cooperation with international cooperation, and promote the semiconductor industry in mainland China to a more brilliant future.