Preface
On February 25~29, 2024, the Applied Power Electronics Conference (APEC) was held as scheduled at the Long Beach Pavilion in California. Jointly organized by the IEEE-Industrial Applications Society (IAS), the Power Electronics Society (PELS), and the American Society of Power Manufacturers (PSMA), the exhibition will bring together the world's leading power electronics companies to showcase the latest technological progress and R&D achievements in the field of power electronics and systems.
APEC is a global event focusing on power electronics business cooperation and applications, and is considered the largest power electronics show in the United States. The APEC exhibition attracted more than 5,000 professional engineers and more than 280 exhibiting companies from all over the world to carry out a five-day technical exchange, product demonstration, strategic planning and business cooperation.
At this conference, a number of power device companies showed their latest technological achievements in the APEC2024 exhibition, and then the charging head network will take you to see these solutions and explain them in detail.
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As a resident exhibitor at APEC, AOS will present its new products and application technologies at booth #1345, mainly for computer and data center related applications, power supply and renewable energy applications, automotive and electric vehicle related applications, motor drives and home appliances related solutions.
Computing & Data Center
The AOS power IC product line has a long history of experience in computing and data center applications, and is committed to providing one-stop solutions, including the industry's lowest quiescent power notebook multi-phase VR controller, providing Intel, AMD, and NVIDIA with complete CPU/GPU power solutions. The product range covers applications from PCs to data centers, from 4-phase single-rail to multi-rail converters with up to 16 phases. Combined with our high-efficiency and high-reliability DrMOS/Smart Power Stage (SPS) modules, the AOS controller provides a complete Vcore power solution to power the next generation of SoCs using state-of-the-art semiconductor processes.
In recent years, the AOS EZBuck™ family has continued to expand to cover specific power applications for Intel and AMD platforms. The newly released AOZ22559QI provides the highest power density solution for Intel Meteor Lake and Arrow Lake CPU VNN_AON power supplies. In addition, AOS offers a comprehensive range of product solutions for DC/DC, hot-swap and load switching applications. It is worth mentioning that AOS recently released the 40V XSPairFET™ AONZ66412, which is especially suitable for the 28V Type C EPR specification buck-boost application scenario.
Power & Renewable Energy
The aMOS5 FRD series and the innovative double-sided cooling DFN5x6 package are products that have attracted a lot of attention in response to market hotspots. Electronic Design, EETimes, EEPower and other media outlets have carried out analysis and promotion. FRD MOSFETs are based on AOS's proprietary aMOS5 superjunction high-voltage technology platform, specifically designed for ease of use and robustness to meet the needs of power-intensive applications operating at high switching speeds. AOK095A60FD and AOTF125A60FDL will also be the industry-leading solution for bidirectional DC/DC and inverter/PFC applications.
AOS's new open-top DFN5x6 double-sided thermal package, AONA66916, is a 100V AlphaSGT™ MOSFET that delivers industry-leading thermal performance, enabling engineers to develop more efficient and robust designs for industrial applications that operate in harsh conditions for long periods of time.
On-board and new energy vehicles
The AOS TOLL package is designed to optimize power semiconductor devices as an important component in the development of electric vehicles, especially in applications such as two- and three-wheelers and other light-duty vehicles. Two recently introduced AEC-Q101 qualified 80V (AOTL66810Q) and 100V (AOTL66912Q) MOSFETs for EV applications are available in clip packaging technology for more reliable performance. With its combination of low on-resistance and high current capability, it helps meet higher power density requirements and enhances the robustness and reliability of the device, making it particularly suitable for automotive BLDC motors and EV battery management applications.
Motor drive
Recently, AOS introduced a range of best-in-class 60V and 100V driver IC solutions for power tools, outdoor garden equipment, and electric vehicle related applications. The AOZ32101DV (100V half-bridge), AOZ32103MQV (100V three-phase), and AOZ32063MQV (60V three-phase) all offer high-side 100% duty cycle operation with multiple protection support, and support the operation of two parallel MOSFETs. Provides fast switching, high efficiency and advanced protection. At the exhibition, AOS also exhibited application boards using AOS motor drivers and MOSFETs to provide cost-effective and highly integrated PCB solutions.
Silicon carbide MOSFETs
In response to the growing demand for third-generation power semiconductor SiC devices in recent years, AOS has continued to optimize and expand its portfolio of SiC MOSFETs to introduce AEC-Q101 qualified 650V / 750V / 1200V SiC MOSFETs for industrial and automotive applications, including TO247-3L/4L, D2PAK-7L, and GTPAK packages, providing industry-leading RDS(ON) Range (15mohm to 500mohm) to demonstrate superior switching performance and efficiency.
Intelligent power modules
AOS smart power modules (IPM3, IPM5, IPM7, and MEGA IPM7) are designed to provide application-specific energy supply, high energy efficiency, excellent thermal performance, low EMI, maximum layout flexibility, and increased system endurance. Its self-designed and developed latest Mega IPM7 package is thermally optimized on the basis of IPM7 all-plastic packaging, providing lower power consumption for home appliances such as air conditioners and dishwashers.
Halomicro希荻微
China's leading supplier of power management and signal chain chips - Xidi Micro (stock code: 688173. SH) brought a number of revolutionary server power management chip solutions to APEC.
At the exhibition site, Xidiwei demonstrated its cutting-edge technologies in the fields of mobile communications, camera driver management, servers and automotive electronics, attracting a large number of professional engineers and industry media to communicate, they not only expressed strong interest in Xidiwei's solutions, but also conducted in-depth discussions on related technical issues.
Xidiwei exhibited some products on site
Navitas
Navitas is an old friend, and at this year's show, Navitas Co-Founder and CTO/COO Dan Kinzer delivered a stunning keynote speech at APEC 2016, officially announcing the founding of Navitas and the launch of GaNFast power ICs™ to the world.
Driven by the mission of "Electrify our World™", Navitas invites visitors to explore the "Navitas Chipball" and learn how next-generation GaN (gallium nitride) and SiC (silicon carbide) technologies are providing the latest solutions for fully electrified homes, transportation and industry. Exhibits include TV power supplies, home appliance motors, compressors, EV charging, solar/microgrid installations, and data center power systems. Each exhibit highlights significant benefits for end users, such as increased portability, longer range, faster charging, and grid independence, and how low-carbon GaN and SiC technologies can reduce CO2 emissions by more than 6 billion tons per year by 2050.
At this exhibition, Navitas' main technologies include:
- GaNSafe™ – a safe, reliable, high-performance, high-power GaN flagship
- The fourth generation of GaNSense™ Halfbridge ICs - the most integrated GaN power devices
- 3rd Generation Fast SiC Power FETs - For high power applications
- Breakthrough bidirectional GaN switching technology – a game-changer for motor drive and energy storage applications
Transphorm
As a Silver Partner of APEC 2024, Transphorm is showcasing its expanding line of GaN devices and its latest technological advancements across the full power range.
Transphorm showcased a number of its products and solutions at APEC, demonstrating Transphorm's leadership in the full power stage of GaN power conversion, and once again demonstrating to the industry that Transphorm can help higher power system manufacturers take advantage of GaN's performance benefits.
During the show, Transphorm highlighted the company's key innovation milestones, including the industry's first simulation model of a 1200V sapphire-based GaN device and leading short-circuit robustness.
In addition, Transphorm's extensive SuperGaN® product line, including the recently announced TO-247-4L, TOLL, AND TOLT devices, is highlighted, providing a complete and flexible package option for high-power systems requiring different thermal architectures. In addition, Transphorm will be showcasing a number of breakthrough power system applications, including high-performance uninterruptible and bidirectional power supplies, innovative solar microinverters, and two- and three-wheeled electric vehicle power systems.
Compared to e-mode GaN, Silicon Carbide, Silicon-based solutions, Transphorm is able to provide customers with superior competitive solutions because Transphorm's future-proof SuperGaN platform leverages and leverages the fundamental physical advantages of GaN. Transphorm's SuperGaN is a normally closed d-mode GaN power device with a cascode architecture, a design configuration that enables the SuperGaN technology platform to reach its full potential, including 2D electronic gas channels for GaN HEMTs and SiO2/Si gate interfaces (Transphorm GaN HEMT-paired low-voltage MOSFETs). Transphorm recently published a technical white paper outlining these benefits, which can be found on Transphorm's WeChat account.
Innocians英诺赛科
Innoscience is a leading global 8-inch GaN IDM company that aims to create a low-carbon, energy-efficient energy ecosystem based on high-performance GaN-on-Si. At the International Power Electronics Application Exhibition (APEC), Innoscience will bring a full range of new products and advanced application solutions with the theme of "Fill the World with GaN" to demonstrate the charm of gallium nitride in multiple scenarios.
Based on the advanced 8-inch GaN-on-Si technology, Innoscience will complete the development and mass production of high-voltage gen 2.5, medium-voltage gen 2.0 industrial technology platforms, and low-voltage gen 2.0 automotive technology platforms in 2023. Efficient solutions in the four major fields of data center, new energy and automotive electronics.
Multiple series of new products exposed
- In the field of consumer electronics, 40V low-voltage GaN used in notebook computers;
- In the field of new energy, 100V/150V low-voltage GaN used in photovoltaics, high-power TOLL packaging products used in energy storage systems, and 100V VGaN used in BMS;
- In the field of data center, high-integration SilidGaN for DCDC conversion and high-power TOLL packaging products for server power supply;
- In the field of automotive electronics, 100V automotive-grade GaN used in lidar.
Demonstration of the full-link GaN solution
Consumer Electronics Zone
Innoscience will demonstrate InnoGaN-based 120W-240W fast charging/adapter solutions, 200W LED power supplies, 300W TV power supplies and 1KW motor drive solutions.
Photovoltaic and energy storage exhibition area
We will highlight Innoscience's 2KW microinverter module, which is approximately 20% smaller than traditional Si solutions, a BMS solution based on 100V VGaN, and a 3KW bidirectional portable energy storage design with AllGaN solution.
Data Center Exhibit Area
Innoscience will showcase 2KW PSU, 4KW PFC and 4.2KW PSU solutions from PSU power supply AC to DC, 420W/600W/1000W power modules from 48V to 12V, and full-link GaN solutions such as Oring and Vcore power supplies.
Automotive electronics exhibition area
It will focus on Innoscience's automotive-grade GaN based lidar solution, 2KW 400V-48V DC/DC solution with magnetic integration technology, as well as 65W PD car charger and 150W Buck-Boost car charger solution.
Industry Report
Dr. Pengju Kong was invited to attend the IS02.7 and IS11.1 industrial report venues, and will share the themes of "Application of GaN HEMT-based UHF (10MHz) Buck Converter in Mobile Phones" and "Using GaN Technology to Achieve Efficient and High Power Density Power Conversion".
Summary of the charging head network
At this APEC exhibition, well-known companies such as AOS, Cidimicro, Navitas, Transphorm and Innoscience have demonstrated their latest technological achievements, and a variety of new power device solutions have been unveiled. Looking back on this APEC exhibition, the results are fruitful. The major power device companies participating in the exhibition showed their strong technical strength and endless products to professional engineers and media around the world, which not only enhanced their brand influence in the international market, but also opened up a broader space for their cooperation with internationally renowned brand customers. Looking forward to the future, it is believed that these companies will continue to uphold the spirit of innovation and continue to develop more world-leading technologies and solutions, so as to provide internationally competitive solutions for global electronic solution providers and international brand customers.