Under the crazy involution, where is the way out for RF chips?

In 2023, in order to enhance the influence of domestic chip companies in the world, promote and record the technology and market application process of domestic chips, Master Core specially planned the "2023 Special Report on the Hard Core Core Industry". 

In the "2023 Hard Core Industry Special Report", Master Core conducted research on 12 types of chip product fields such as chip IP, EDA, MCU, smart chips, memory chips, RF chips, power devices, communication chips, power management chips, signal chain chips, processor chips, sensors, etc., and strived to show the development of the domestic semiconductor industry at this stage by analyzing the technical overview, market pattern, development trend, representative enterprises, representative product overview, and application direction of each chip field.

This article is a series of special reports "RF chips: domestic substitution space is large, domestic enterprises forge ahead", 2023 domestic RF chip industry report and product selection reference. The following is the full text of the report:

01

Overview of domestic RF chip products

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Product Definitions

RF chip refers to an electronic component that converts radio signal communication into a certain radio signal waveform and sends it out through antenna resonance. In the wireless system, it generally includes antennas, RF front-ends, RF transceivers, and baseband signal processors, broadly speaking, these components belong to the RF field, and in a narrow sense, RF only includes RF front-end and RF transceivers.

Source: Feixiang Technology Prospectus

Among them, the RF front-end is responsible for the processing of RF signal amplification, filtering, and frequency band selection between the antenna and the RF transceiver to meet the needs of the communication system for radio wave transmission and reception, which is the core component of the system and the most important part of semiconductor technology integration. The main business of domestic RF chip companies is also concentrated in the RF front-end.

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 RF front-end product classification

Follow the features

The RF front-end can be divided into transmit link (TX) and receive link (RX)

RF front-end simplified architecture (source: Weijie Chuangxin prospectus)

(1) Transmit link (TX)

In the transmission link, the digital signal is converted into a continuous analog signal that is easy to transmit through a modem (Modem), and then the transceiver modulates the analog signal into a radio frequency signal that is not easy to be interfered with, enters the RF front end for signal processing such as power amplification, filtering, and switching of the RF signal, and finally transmits the signal through the antenna.

(2) Receive link (RX)

The receiving link receives the RF signal transmitted in space by the antenna, selects the frequency and channel required by the user through the RF front-end, filters and amplifies the received RF signal, and finally inputs the transceiver and modem to obtain the digital signal.

According to the constituent devices,

The RF front-end includes power amplifier (PA), low-noise amplifier (LNA), filter (Filter), and RF switch (Switch).

The power amplifier is responsible for the RF signal amplification of the transmitting channel, the low-noise amplifier is responsible for the small signal amplification in the receiving channel, the filter is responsible for the filtering of the transmitted and received signals to remove the clutter signals of non-signal frequency, and the RF switch is responsible for transmitting and receiving and switching between different frequency channels.

(1) Power Amplifier (PA)

The power amplifier is the core component of the RF front-end, mainly used for the transmission link, by amplifying the weak RF signal of the transmission channel, the signal can successfully obtain high enough power, so as to achieve higher communication quality, stronger battery life, and longer communication distance. The performance of the PA can directly determine the stability and strength of the communication signal.

(2) Filters

The filter is the most important discrete device in the RF front-end, which enables the specific frequency components in the signal to pass through and greatly attenuate other frequency components, so as to improve the anti-interference and signal-to-noise ratio of the signal. At present, acoustic filtering technology is mainly used in the mobile phone RF market.

According to the different manufacturing processes, the acoustic filters on the market can be divided into two categories: SAW and BAW. Among them, the SAW filter is simple and cost-effective, and is mainly used in low-frequency filtering below GHz, while the BAW filter has low insertion loss and excellent performance, which can be applied to high-frequency filtering, but the process is complex and the price is high.

(3) Duplexer

A duplexer, also known as an antenna sharer, is a special filter that consists of two sets of band-stop filters of different frequencies. The frequency division function of high-pass, low-pass or band-pass filters is used to enable the same antenna or transmission line to use two signal paths, so that the same antenna can receive and transmit two signals of different frequencies.

(4) RF switch

The RF switch realizes the switching of different signal paths by connecting any one or several control logic in multiple RF signals, including the switching between reception and transmission, and the switching between different frequency bands, so as to achieve the purpose of sharing antennas and channels and saving the cost of terminal products. RF switches mainly include mobile communication conduction switches, WiFi switches, antenna tuning switches, etc.

(5)低噪声放大器(LNA)

The low noise amplifier is an amplifier with a small noise figure, the function is to amplify the weak RF signal received by the antenna, and minimize the introduction of noise, LNA can effectively improve the receiver's receiving sensitivity, and then improve the transmission distance of the transceiver. Therefore, whether the design of the low noise amplifier is good or not is related to the communication quality of the entire communication system.

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02

RF chip product application field

RF chips can realize the functions of sending, receiving, amplifying, filtering, and demodulating wireless signals, and can be widely used in mobile phones, TVs, routers, radar systems, and automobiles. According to the product category, the application field of RF chips can be basically divided into three categories: mobile intelligent terminal equipment, WiFi, automotive electronics and smart medical care.

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 In the field of mobile intelligent terminal equipment

Mobile smart terminals include smart phones, tablet computers, wearable devices, etc., which have complex communication application functions in the wireless environment, making them the main application market for RF front-end chips. In mobile end devices, RF chips are used to process and modulate wireless signals so that data can be transmitted in different frequency ranges. Such applications are mainly found in mobile phones, wireless networks and satellite communication systems. With the continuous iteration of communication technology, the technical requirements and quantity requirements for mobile phones to carry RF chips have increased to varying degrees.

According to Yole's forecast, the global mobile terminal RF front-end market will grow from $19.2 billion in 2022 to $26.9 billion in 2028, with an average annual compound growth rate of about 5.8%, which will maintain moderate growth driven by OEMs and mobile network operators. From 2020 to 2022, the combined global market share of the above brands is 45.0%, 44.0%, and 41.17%. In terms of communication base stations, the RF front-end market will grow from $3.2 billion in 2022 to $3.8 billion in 2028, with an average annual compound growth rate of about 3%.

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Wi-Fi field

As a wireless networking technology, Wi-Fi allows electronic devices to connect to a wireless LAN for interactive communication, and is widely adopted by smartphones, tablets, laptops, routers, etc. The Wi-Fi RF front-end module is designed according to the requirements of the Wi-Fi communication technology protocol, which cannot be applied to cellular mobile communication technology, and is an indispensable device for mobile terminal equipment to achieve wireless communication through Wi-Fi networking.

Wi-Fi RF front-end devices and modules benefit from the continuous growth and structural changes of the Wi-Fi market. The global Wi-Fi chip market exceeded $20 billion in 2021 and is expected to grow at a compound annual growth rate of 2.5% from 2022 to 2028. The domestic Wi-Fi chip market will achieve a compound growth rate of 10.2% from 2018 to 2025, and by 2025, the domestic Wi-Fi chip market will exceed US$4.38 billion, of which the market size of Wi-Fi 6/7 will exceed US$2.861 billion, accounting for 64% of the total Wi-Fi market, achieving a compound growth rate of 56.9%.

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Automotive electronics, medical health and other fields

Automobiles have long since changed from simple means of transportation to complex electronic systems, and many cars now achieve a degree of autonomous driving, network communication, and provide a variety of entertainment services. RF front-ends, which are expected to grow significantly in the automotive processing and linear advanced driver assistance systems RF front-end market, will grow at a CAGR of 17% between 2017 and 2022, according to StrategyAnalytics.

In the field of automotive electronics, domestic RF chip companies are facing competition from large foreign companies, such as Infineon and Renesas. However, with the continuous development of automotive electronic systems, domestic RF chip companies have also gained some opportunities, such as applications in automotive intelligent networking, automotive safety, etc.

In addition, with the advancement of science and technology, telemedicine has gradually become a reality, and the remote diagnosis, treatment and consultation of telemedicine need to be realized with the help of high-speed network connection, and the continuous development of telemedicine will strongly promote the development of RF front-end in the field of health care

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3

The market pattern of key products of RF chips

According to YoleDevelopment's statistics and forecasts, the module and RF front-end components market will be $19.2 billion in 2022 and is expected to reach $26.9 billion by 2028, with an average annual compound growth rate of 5.8% from 2022 to 2029. Among them, the market size of transmitter modules is expected to be 1.2 billion US dollars, receiver modules are expected to be 4.5 billion US dollars, discrete filters are expected to be 3 billion US dollars, discrete conduction switches are expected to be 900 million US dollars, antenna switches are expected to be 1.9 billion US dollars, and discrete low-noise amplifiers are expected to be 1.2 billion US dollars

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From the global perspective to China, although there are many domestic RF front-end manufacturers, they mainly provide low-value single discrete devices or low-integration module products. Relative to the global demand for products, the share of domestic manufacturers is low. In 2021, China Merchants Electronics counted that the localization rate of different devices from high to low were: switch, low noise amplifier LNA, power amplifier PA, SAW filter, and BAW filter. The chart is as follows:

Source: China Merchants Securities

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Among the companies listed in the figure above, the listed companies include Zhuosheng Micro, Weijie Chuangxin, Aiwei Electronics, Feixiang Technology, Huizhi Micro, Maijie Technology, Fuman Electronics, Weir Shares, San'an Optoelectronics, Xinwei Communication, Shunluo Electronics, except for Weir Shares, San'an Optoelectronics, Xinwei Communication, Shunluo Electronics RF chip business accounts for less of the main business, and other enterprise information is as follows:

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 PA (Power Amplifier)

The PA market is mainly dominated by foreign manufacturers. Similar to the overall market pattern of the RF front-end industry, RF power amplifiers, as the most important RF front-end chips, also show a pattern in which leading international companies occupy the majority of the market share. In 2021, domestic manufacturers accounted for about 10% of the PA market share.

In 2019, the market size of RF power amplifier modules was US$5.376 billion, making it the largest segment of the RF front-end market, and from 2019 to 2025, the market size of PA modules is expected to maintain an average annual compound growth rate of 11%, reaching US$8.931 billion in 2025, which is still the largest segment in the RF front-end market.

资料来源：YoleDevelopment

In the field of RF power amplifiers, most domestic enterprises adopt the Fabless model, although there are a large number, but the homogenization is more serious, and the profitability is poor. The major domestic players include Huizhiwei, Weijie Chuangxin, UNISOC Zhanrui, Feixiang Technology, Anrui Micro, etc.

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filter

From the perspective of the market share of RF front-end discrete devices, filters are the largest devices in the market. Due to the importance of filters, almost all RF module products will have filter devices. According to Qorvo's forecast, filters will account for 66% of the global RF front-end discrete device market in 2023, followed by PAs at around 20%.

Source: Qorvo

The filter industry is a technology-intensive industry, with high technical barriers and a concentrated industry pattern, which is currently monopolized by large manufacturers in the United States and Japan, and the demand for domestic substitution is broad. In the global supply of SAW filter products, the share of domestic manufacturers accounted for about 3% in 2021, and by 2022, the domestic market share will only account for about 10%, most of which are occupied by Japanese manufacturers such as Murata, TDK, and Taiyo Yuden.

Due to the later rise of BAW filters in the industry, and the mainland's semiconductor capabilities are still in the development stage, domestic manufacturers have fewer patent layouts for BAW filters, so that there are no companies that can supply large quantities in China, and the entire BAW market is mainly dominated by American manufacturers such as Broadcom and Qorvo to firmly occupy the mainstream supply position

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In the field of filters, there are domestic enterprises such as Hantianxia, Wuxi Haoda, Maijie Technology, North, Deqing Huaying, etc., which have certain product advantages.

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 switch

According to the QYRElectronics Research Center, the RF switch market will reach $2.29 billion in 2020. As the commercialization of 5G ushers in the growth peak, the growth rate will gradually slow down thereafter. RF switch manufacturers mainly include Skyworks (33%), Qorvo (20%), Murata (14%), Broadcom (10%), etc., and the market is occupied by overseas companies.

RF switches and LNAs are RF front-end devices with a high localization rate. In the field of RF switches and LNA, Zhuosheng Micro has formed the ability to compete with world-class enterprises by virtue of its early entry into brand customers and its own strength advantages, and maintains a leading position in the domestic market

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】。 In 2021, according to the statistics of brokerages, Zhuosheng Micro has occupied about 15% of the global market share of RF switches (including Switch and Tuner, switches in discrete and module), and domestic manufacturers such as Weijie Chuangxin, Feixiang Technology, Weir Co., Ltd., and Jiamei Xinxin also have switch production capacity, accounting for about 20% of the comprehensive domestic production.

Source: QYR

Source: QYR

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  LNA (Low Noise Amplifier)

In 2018, the global LNA market size was US$1.42 billion, and it is expected that with the continuous advancement of 5G commercialization, the market is expected to reach US$1.79 billion in 2023, with a relatively stable growth rate. At present, the global LNA market pattern is relatively fragmented, with the top five manufacturers Broadcom, ONSemiconductor, Infineon, TI, and NXP accounting for 52%, and the market competition is fierce. The degree of localization of LNA is relatively high, and among the domestic manufacturers, Zhuosheng Micro, Ziguang Zhanrui, Angrui Micro, Aiwei Electronics, Feixiang Technology, and Weijie Chuangxin all have LNA products. The domestic LNA market also accounts for a relatively high proportion, with the share of domestic manufacturers approaching 15%.

Source: QYR

Source: QYR

4

A review of the current situation of the RF chip market

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Global RF chip market

The development of wireless communication is inseparable from the evolution of the RF front-end, and the transformation of the RF front-end has always followed the evolution of wireless communication. With the development of cellular mobile communication technology from 2G to 5G, mobile networks are getting faster and faster, requiring the support of growing RF front-end chips. The continuous enrichment of mobile terminal devices from mobile phones to tablet computers and smart wearable products, the gradual development of emerging application fields such as mobile medical care and smart home, and the improvement of the value of stand-alone RF front-end chips of mobile terminal devices have comprehensively promoted the rapid growth of the global RF front-end market.

According to Yole's report, the full-year consumption data fell short of expectations in 2022 due to a lower-than-expected 5G penetration rate and a decline in the smartphone market due to the global macroeconomic downturn, and a market downturn due to geopolitical tensions. According to Yole, the smartphone market will maintain moderate growth until 2028, and the overall market size will increase from $19.2 billion in 2022 to $26.9 billion in 2028. Given the limited potential for 5G penetration, the RF front-end market is expected to grow at a CAGR of 5.8%

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In 2022, the world's top five vendors in the RF front-end market, Broadcom (19%), Qualcomm (17%), Qorvo (15%), Skyworks (15%), and Murata (14%) together accounted for more than 80% of the market share.

资料来源:YoleIntelligence

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 Domestic RF chip market

In terms of market size, according to statistics compiled by industry research institute XYZ-Research, as of the end of 2021, the market size of China's RF front-end chips reached about 11.1 billion US dollars, and by 2022, the market size of RF front-end chips will continue to show an upward trend, reaching about 12.5 billion US dollars, a year-on-year increase of 13%.

The overall development level of the integrated circuit industry in the mainland started late, and the RF front-end industry has various barriers such as high technology, experience, and capital, and there is still a certain gap between the overall development level of the current RF front-end in the mainland and the international advanced level. With the continuous growth of the demand for integrated circuits in mainland China and the increasing attention of the state to the integrated circuit industry, the RF front-end industry in mainland China has developed rapidly, and representative RF front-end enterprises have emerged.

The report compares the 2022 revenue of the seven domestic listed RF chip companies mentioned above with the international leading enterprises, which can show the product share of domestic manufacturers in the global market to a certain extent.

5

The development of the domestic RF chip industry

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The status quo of China's RF chip industry

1) China's RF chip industry has great potential for domestic substitution

The RF chip industry has shown a trend of rapid development in recent years. From the demand side, with the popularization of emerging technologies such as 5G, the application of RF chips in mobile communications, Internet of Things, automotive electronics, military industry and other fields continues to expand, and the market demand continues to grow. At the same time, with the continuous upgrading and upgrading of consumer electronic products, the demand for RF chips is also increasing. Together, these factors are driving the expansion of the RF chip market.

From the perspective of the supply side, the main manufacturers of the RF chip market are still dominated by traditional manufacturers such as Europe, America and Japan, but in recent years, domestic RF chip companies are also gradually rising, through independent research and development and technological innovation, gradually breaking the monopoly of foreign companies, becoming an important force in the RF chip market.

In general, the market scale will continue to expand, and the competitiveness of domestic RF chips is also improving, which is expected to occupy a larger share of the market in the future, and the domestic RF front-end industry has a large development space.

2) Domestic products are mostly concentrated in the middle and low end, with fierce competition and poor profitability

Although domestic RF chip companies have independent research and development and innovation, and are gradually breaking the foreign monopoly situation, it is undeniable that the high-end market of RF chips is still monopolized by foreign countries, and domestic RF chip companies generally focus on general-purpose chips, covering various industry applications, and their products are mostly concentrated in low-end fields.

On the whole, domestic RF chip companies have serious involution, a high degree of product homogeneity, and a lack of core competitiveness. The quality of some enterprises is low, and low prices disrupt the market, resulting in low gross profit of products, which in turn inhibits product innovation and forms a vicious circle. At present, due to the sharp decline in market demand, it is expected that a number of domestic RF chip manufacturers will be unable to sustain due to the lack of competitiveness of their products.

3) The industry is declining, and the investment and financing efforts of the RF chip industry are weakening

RF chips belong to the semiconductor field, which is consistent with the investment and financing pace of the domestic semiconductor market. In 2017, the domestic semiconductor investment circle was just starting, and it gradually grew from 2018 to 2019. In the past few years, the financing of semiconductors has been relatively easy, and the capital requirements for the industry are low. From 2020 to 2021, the global semiconductor industry chain was broken, product output plummeted, and the market was in short supply. Investment in semiconductors peaked.

Compared with other industries, the investment cycle of semiconductors is longer, often taking five to ten years. Domestic capital rarely has such patience. Therefore, from 2022 to 2023, due to the fact that the input-output cycle is less than expected, coupled with the oversupply of semiconductors in the epidemic era, the investment in the semiconductor industry has fallen off a cliff, and the entry of new capital is extremely cautious.

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 The development trend of China's RF chip industry

1) The transformation of communication technology drives the technological upgrading of the RF front-end industry

With the enrichment of communication technology and the Internet of Things, its technical requirements are getting higher and higher, not only the frequency bands and modes are becoming more and more abundant, in terms of working characteristics, higher speed, lower latency and higher stability are the basic requirements, but also need to take into account the reduction of power consumption to extend the battery life and service life of the device.

To meet these characteristics, multi-band and multi-mode support for RF chips will become more common to meet the requirements for better network coverage and faster data transmission. At the same time, the operating frequency of the chip will also come higher, closer and closer to the optical band, with higher frequency, high speed and high power and other performance, RF chips can provide higher data transmission rate and lower latency. In order to continuously meet the requirements of the market for more and more abundant and high-performance, RF front-end chips are constantly updated and iterated to upgrade industrial technology.

2) The development trend of RF front-end is highly integrated, which will raise the entry threshold for the mid-to-high-end market

In order to meet the needs of 5G communication, the number of RF front-end devices has increased significantly, and it is increasingly difficult to adopt discrete solutions in the limited space of smart phones. With the significant increase in the amount of RF front-end devices in 5G smart terminals, RF front-end chips will gradually move from discrete devices to integrated modules in order to meet the needs of mobile smart terminals for miniaturization, thinness, and diversification of functions

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The high degree of integration of RF front-end will further increase its design difficulty, and it is necessary to comprehensively consider the characteristics of PA, filter, RF switch, LNA and other devices, as well as the combination mode, interference and coexistence of different types of chips, etc., and the design difficulty will be exponentially increased, further increasing the entry threshold of the mid-to-high-end market of RF front-end enterprises

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3) Capital withdraws from the market, and RF chip companies gradually appear mergers and acquisitions

The golden age of semiconductor industry financing has passed, and there are many low-end chip companies with homogeneous products in the market, especially in the field of radio frequency chips, which are "small and scattered" as a whole, and the vicious competition in the low gross profit or even negative profit market has not improved.

The industry predicts that in 2024, there will be a situation of collective exit of capital, and to solve the problem of equity investment withdrawal, mergers and acquisitions and listing are the best ways. Nowadays, the threshold for companies to go public is constantly increasing, and investors will be more inclined to promote chip companies to merge or be acquired. Moreover, consolidation is more likely to occur in the field of RF chips, which are highly competitive and have a large number of RF chips.

4) The increasing complexity of 5G solutions promotes the application of new materials and processes

RF front-end chips are different from digital chips, which mainly rely on the process of continuously reducing the line width to achieve technological upgrades, while the technical upgrades of RF circuits mainly rely on the combination of new processes and new materials. For example, the first generation of RF materials used silicon (Si) as the main raw material, and the process was represented by RFCMOS, and by the third generation, the RF material process was represented by gallium nitride (GaN) and silicon carbide (SiC), which had a wider bandgap width, higher breakdown voltage, faster saturation electron rate, and could withstand higher operating temperatures.

In the 5G era, the modulation bandwidth required by the RF power amplifier of mobile phones has increased from 20MHz to 160MHz in the 4G era, and the requirements for linearity and efficiency have also increased accordingly, putting forward higher requirements for PA materials. Silicon-based power amplifiers are mainly used in low-end 2G mobile phones and communication modules, GaAs is mainly used in smartphones, routers and 5G small cells, and GaN is a relatively new technology that can achieve higher voltages, greatly simplify output synthesizers, and reduce losses, so that it can improve efficiency and reduce chip size, but due to the higher turn-on voltage and high cost, GaN is currently mainly used in 5G base stations. GaN, a next-generation material, has significant advantages in terms of operating frequency and output power, and is expected to gradually penetrate into the end market in the future with the reduction of production costs and the further improvement of low-voltage technology

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Domestic RF chip selection reference

Suzhou Hantianxia Electronics Co., Ltd

Suzhou Hantianxia Electronics Co., Ltd. focuses on the R&D, production and sales of RF front-end chips and modules, and is the first RF front-end chip and module company in China with bulk acoustic wave filters as the core and its own production lines. The company's core products are high-performance bulk acoustic wave filters, duplexers, multiplexers and RF front-end modules based on MEMS technology, which have entered the supply chain system of more than 100 intelligent end customers, directly serving many emerging industries such as mobile communications, Internet of Things, communication base stations, Internet of Vehicles, wearable devices, navigation and positioning, etc., covering the entire wireless communication industry chain.

HSQP1213

As a self-developed high-performance RF quadplexer, HSQP1213 supports carrier aggregation in the B1 and B3 frequency bands, and its typical insertion loss is about 1.5dB, regardless of whether it is B1/ The transmission and reception isolation between B3Tx and Rx, or the cross-isolation between B1 and B3 can be maintained at more than 60dB, so that there is no interference between the transmission and reception channels, and the receiving sensitivity and communication quality of the whole machine are improved, and the product indicators have reached an excellent level.

Hangzhou Zuolan Microelectronics Technology Co., Ltd

Hangzhou Zuolan Microelectronics Technology Co., Ltd. is a national high-tech enterprise focusing on the R&D and sales of high-performance RF filters, duplexers/multiplexers and RF front-end modules. The company has built an intellectual property moat, has more than 100 intellectual property rights, passed the testing and certification of well-known domestic manufacturers, and continues to obtain orders, realize batch delivery, and provide customers with professional, efficient and complete RF front-end solutions to meet the needs of 4G/5G communication.

PEBAW™ filter

The PEBAW™ filter uses a bonding process to obtain an air cavity and at the same time realizes the continuous deposition of the sandwich structure, which obtains a better C-axis orientation of the piezoelectric layer and higher crystal quality. In addition, PEBAW™ has a stronger withstand power than SAW and can be used in 5G and above frequency bands. In addition, as the frequency increases, the area of the PEBAW™ resonator decreases, which also increases the price competitiveness of PEBAW™.

Telink Microelectronics (Shanghai) Co., Ltd

Founded in June 2010, Telink Microelectronics (Shanghai) Co., Ltd. is a chip design company dedicated to the development of high-performance, low-power wireless IoT SoCs. Telink Microelectronics is the world's leading supplier of multi-mode IoT chips with high-level chip design capabilities and rich system implementation experience. Telink Microelectronics is committed to providing customers with high-performance and high-quality chips and related technologies, helping customers quickly launch new products and establish long-term, stable and mutually beneficial cooperative relationships.

TLSR8208

TLSR8208 is Bluetooth Low Energy 5.3 certified and supports 2.4G proprietary protocols and Bluetooth Low Energy protocols, making it Telink's latest cost-effective multi-protocol wireless connectivity SoC. The chip has streamlined peripheral components, can provide common peripheral interfaces and a variety of package options, supports Flash and OTP versions, and is mainly used in Bluetooth transparent transmission and Bluetooth control, which is ideal for the development of basic IoT devices and wireless transparent transmission modules.

Changzhou Qianmi Electronic Technology Co., Ltd

Changzhou Qianmi Electronic Technology Co., Ltd. was established in September 2015, gathered a number of senior engineers with rich R&D experience in the field of communication and integrated circuit design, after five years, successfully developed a new technology with disruptive innovation significance - LaKi ultra-low power real-time WAN technology, including MAC layer LaKiplus and perfectly matched PHY layer RF SoC chip LK2400 series and a variety of modules, creating a 5.9mA transmission current effective communication 1.5 km, Air interface rate of 1 Mbit/s. LaKi is currently the only wireless technology that can achieve wide coverage, low latency and low power consumption at the same time, and it is also the wireless technology that is most in line with the core technology of ubiquitous Internet of Things, maximizing the return on investment and realizing the sustainability of Internet of Things construction.

LK2400A

LK2400A is a highly integrated RF SoC chip, using SMIC's 55nm process, QFN package, 40pin, 5mm*5mm, integrated 32bit MCU, 2.4GHzRF, PMU, RTC, PA, AES128, Flash and other modules. The LaKi RF SoC chip has ultra-low power consumption, with an average power consumption of no more than 27mAh, and the effective communication distance is 1.5km@5dBm, which enhances data security. An innovative approach to easy two-way real-time communication with all the necessary attributes of the Smart Internet of Things.

Shanghai Furuikun Microelectronics Co., Ltd

Founded in 2014, Shanghai Furuikun Microelectronics Co., Ltd. is a high-tech enterprise dedicated to the design, research and development and product sales of RF integrated circuit chips. The company has a R&D team with high comprehensive quality, strong practical ability and rich practical experience, and most of the core employees are from Tsinghua University, Fudan University, Jiaotong University, Harbin Institute of Technology and other well-known universities, which can independently complete the overall solution from RF, analog, audio, protocol stack, application software to application product development.

 双模蓝牙MCU FR3036D

The dual-mode Bluetooth MCUFR3036D adopts the innovative technology of the Furuikun chip, integrates RF, baseband, 32-bit CPU core, rich on-chip resources and PMU into a single SOC chip, and provides complete SDK and guidance documents, which has competitive power consumption, Bluetooth multi-master and multi-slave functions and other excellent features. At the same time, the FR3036Dx built-in ROM realizes the controller function of Bluetooth, which can be implemented by other MCUs or host APs for the Bluetooth host protocol stack. Fully compatible with SIGV5.3 (BR/EDR/LE mode) protocol, users can also realize secondary development of various application solutions based on the chip-integrated MCU and the SDK provided.

Shenzhen Nuruixin Technology Co., Ltd

Shenzhen NewChip Technology Co., Ltd. is co-founded by returnee integrated circuit experts from world-class chip manufacturers, headquartered in Shenzhen Tian'an Yungu Industrial Park, with R&D centers in Beijing and Suzhou. The company focuses on the R&D and industrialization of the core technology of wireless communication system chips, providing core chips and system solutions for the smart phone, smart car, Internet of Things and industrial Internet markets, and has completed the tape-out verification of dozens of core key IP technology modules in multiple series, and more than 50 applications for invention patents and utility models. The company's self-developed ursamajor "Ursa Major" UWB positioning communication system chip has been mass-produced and entered the market, and its performance and function are ahead of international competitors.

NRT81633

NRT81633 is a UWB transceiver in a SiP system package as well as an AiP (the first on the market) antenna package, designed for high-precision ranging and secure data communication. It is primarily designed for IoT applications to achieve miniaturization and cost savings at the overall system level. Structurally, the antenna of the AiP package is close to the RF chip, which reduces the insertion loss, thereby improving the transmitter efficiency and receiver sensitivity. NRT81633 also integrated a 38.4MHz crystal (XO) into the SiP to minimize the number of external components. NRT81633 supports secure data communication at a wide range of data rates and offers a proprietary high-speed mode that extends its application potential to scenarios where ranging and high data rates are performed simultaneously.

Shenzhen Jiesheng Micro Semiconductor Co., Ltd

Shenzhen Jiesheng Micro Semiconductor Co., Ltd. is a high-tech company founded by a team of senior experts in the industry and a team of returnees who studied in Europe and the United States, and is one of the companies that can provide the most comprehensive products and solutions in the industry, with product categories covering more than 50 packaging forms and more than 10,000 models. The company has a complete independent R&D system and has learned a number of domestic leading key core technologies, and has developed various types of magnetic switch series chips, RF receiving, transmitting, reading and writing chips, magnetic speed and direction sensor chips, linear sensor chips and magnetic encoder chips and other products.

Swipe the chip MFRC522

The card chip MFRC522 has a wide range of applications, and has strong system application scalability in many aspects such as attendance sign-in, access control, public transportation, canteen dining, water and electricity recharge, portable handheld devices, and various membership systems. Reader mode supports ISO/IEC 14443A and ISO/IEC14443B standards, and features highly integrated demodulation and decoding analog circuitry that requires few external components to connect the output driver to the antenna. The host interfaces supported by the chip include I2C interface, UART interface, and SPI interface, with flexible interrupt mode, low-power hardware power-down mode, software power-down mode, and LPCD function.

National Technology Co., Ltd

National Technology Co., Ltd. (hereinafter referred to as National Technology) is a leading enterprise and national high-tech enterprise of general-purpose MCU and security chips, with four leading advantages in security, SOC, RF and power supply, and provides industrial-grade and automotive-grade chips and solutions for the general and security fields. Founded in 2000 from the national "909" integrated circuit special project, it was listed on the Growth Enterprise Market (stock code: 300077) in 2010, and is the vice chairman unit of the China Association of Listed Companies. Headquartered in Shenzhen, it has branches in Beijing, Shanghai, Wuhan, Xi'an, Chongqing, Hong Kong, Singapore, Los Angeles, Japan and other places.

N32WB031 series of Bluetooth Low Energy chips

The N32WB03x series Bluetooth chip is a new generation of high-performance, ultra-low-power Bluetooth 5.1 chip of national technology, using 32-bit Arm Cortex-M0®® core, with a maximum working frequency of 64MHz and integrated 48KBSRAM, 256/512KBFlash on the chip. The chip integrates an advanced BLE5.1 RF transceiver, which is compliant with the Bluetooth BLE5.1 specification and can be configured as standard 1Mbps BLE mode, 2Mbps enhanced BLE mode, 125Kbps BLE remote mode (S8), 500Kbps BLE remote mode (S2). Support AOA (Angle of Arrival) and AOD (Angle of Departure), support RSS I (Receiver Signal Strength Indicator), support master and slave angles, support multiple connections, support data packet length expansion, support KEYSCAN, IRC, 10-bit 1.33MspsADC (configurable to 16-bit 16Ksps), support analog MIC input, PGA amplification, support basic, general-purpose, Advanced peripherals such as TIMER, RTC, WWDG, IWDG, LPUART, USART, SPI, I2C, etc.

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div.autoTypeSetting24psection > p,div.autoTypeSetting24psection > section{margin-bottom: 24px;}