The charging head network got the B760I landing ship motherboard launched by Rainbow, this motherboard uses ITX board type, white PCB, with silver heat sink, suitable for white hosts. The motherboard has dual DDR5 slots and supports 7+1+1 phase digital power supply. It also has a built-in WiFi6 wireless network card and a 2.5G wired network port, which supports mainstream network connections.
For the M2 hard drive, which is essential for installation, this motherboard is also thoughtfully designed with a thermal guard to effectively reduce the temperature rise during operation. The motherboard has DP and HDMI ports, supports the use of CPU with built-in core graphics, and has four USB2.0 ports and two 5Gbps USB-A ports to meet the expansion of daily use. Let's bring a dismantling of the colorful motherboard, and let's take a look at the materials and design of the motherboard.
Colorful CVN B760I landing ship motherboard unboxing
The top of the box is designed in a gray and white style, and the product series, name and appearance are printed in hot stamping fonts, and there are three major selling points of the motherboard in the lower left corner.
In addition to the appearance of the motherboard printed on the bottom, a series of advantages of the motherboard are also attached on both sides, and there is a local close-up of the product and the corresponding description below.
The package includes the Colorful CVN B760I landing ship motherboard, SATA 6Gb/s data cable, Wi-Fi 6 high-gain antenna, fixing screws, and user manual.
There are two SATA 6Gb/s cables, and the cable body is a flat design.
A pair of Wi-Fi 6 high-gain antennas with a classic design of one thick and one thin at both ends.
Colorful CVN B760I FROZEN WIFI D5 V20 landing ship motherboard is a small board with a Mini-ITX board type, which continues the armor style design, with black and white contrasting colors as the mainstay, supplemented by silver and white to enhance the texture, bringing a strong visual impact.
In terms of details, part of the cooling armor on the left and lower side is treated with radium carved CVN frosted glass, while the classic "76" is also designed on the lower side of the left side. There are two DDR5 memory slots on the right, and the XMP boost mode gives high frequencies of up to 8000MT/s, while optimizing high bandwidth and low latency.
Colorful CVN B760I landing ship motherboard provides users with DP1.2 interface, HDMI 2.0 interface, 5G Type-C interface, four USB2.0 interfaces, two 5G USB interfaces, 5.1 channel audio interface, but also provides 2.5G wired network card and Wi-Fi6 wireless network card, and provides two previously mentioned WiFi enhanced antennas, rich functions to meet the expansion needs of the vast majority of users.
The PCIe 5.0*16 slot is reinforced with alloy to ensure long-term durability.
The motherboard adopts 7+1+1 phase digital power supply, and the core is 90A flagship-level Dr.Mos, which is more energy-saving and efficient.
There is also a second PCIe 4.0 M.2 solid-state slot on the back of the motherboard, which is designed to make efficient use of the space on the back of the motherboard, making it easier for users to expand large capacities.
The measured length of the motherboard of the Colorful CVN B760I landing ship is 173.48mm.
The width is 169.45mm.
The maximum thickness is 47.33mm.
In addition, the weight of the motherboard was measured to be about 591g.
Colorful CVN B760I landing ship motherboard disassembly
After having a basic understanding of the appearance of this motherboard, let's disassemble it and take a look at the internal materials.
First, unscrew the fixing screws on the back and remove the power supply heatsink, south bridge heatsink and M2 hard drive heatsink on the front of the motherboard.
There is also a cooling fan inside the power supply fin.
Close-up of motherboard bezel, south bridge heatsink, power heatsink and M2 hard drive heatsink.
The M2 hard drive heatsink is covered with a thermal pad.
There is a cooling fan inside the heat sink.
Close-up of the rubber pad used for support.
The cooling fan is fixed to the inside of the heat sink by screws.
Thermal pads are attached to the heatsink in place of the step-down inductor and MOS tube.
Close-up of the CPU power supply circuit, 7+1 phase in the picture.
The CPU power supply main control chip is from MPS Xinyuan Semiconductor, and the model is MP2960R.
The input filter capacitor is from PolyCap, which is a miniaturized solid-state capacitor of the RN series with a specification of 150μF 25V.
According to the dismantling of the charging head network, the products of Berry are widely used in chargers, car chargers, wireless charging, mobile power supplies, energy storage power supplies and other fields, and have been used by OPPO, vivo, Xiaomi, Honor, Samsung, Huawei, Lenovo, Zimi, Nubia, Bull, ANKER and other well-known brands, and the products have been highly recognized by the market.
7 Dr.Mos are used for core power step-down.
Dr.Mos is from MPS Xinyuan Semiconductor, model number MP87691.
Close-up of the buck inductor used to power the CPU cores.
The output filter capacitor is from PolyCap, which is an RL series solid capacitor with a specification of 560μF 6.3V.
A step-down control chip comes from MPS Xinyuan Semiconductor, model MP2940A.
Dr.Mos is from MPS Semiconductor, model number MP86941.
Close-up of buck inductor.
The other step-down chip also uses MP89641.
Close-up of another power-supply step-down inductor.
The three filter capacitors are 560μF and 6.3V.
Close-up of the step-down inductor powering memory.
The step-down chip that powers the memory is a synchronous step-down converter with a 23V input voltage and 8A output circuit from Jewalt, model number JW5068A, integrated switch on the chip, and programmable current limit.
Close-up of the LGA1700 socket with multiple MLCC filter capacitors soldered inside.
Multiple MLCC filter capacitors are also soldered on the back of the socket.
The south bridge chip is covered with a white thermal pad that touches the heat sink to dissipate heat, and plastic strips are pasted on both sides to support it.
Thermal pad removed, close-up of the South Bridge chip.
Close-up of the chip clock crystal oscillator.
32.768KHz时钟晶振特写。
The BIOS chip is from XMC Wuhan Xinxin, model XM25QH128CHIQ, and has a capacity of 16MB.
Close-up of the LED DEBUG indicator above the connector of the M2 SSD.
The motherboard BIOS battery is glued to the audio socket.
The batteries are connected via a connector for easy replacement.
The sound card chip is from Realtek Semiconductor, model ALC897.
The wired NIC chip is from Realtek Semiconductor and has a RTL8125BG model number.
Close-up of external 25MHz crystal oscillator.
Chip external TVS array for surge protection function.
Close-up of the M2 SSD slot.
THE MCU IS FROM HETAI, MODEL HT32F52352, WITH BUILT-IN M0+ CORE, BUILT-IN 128KB FLASH AND 16KB SRAM.
The IO chip is from Xintang, the model is NCT5585D, and it is used for motherboard temperature detection, fan speed control, keyboard interface, etc.
Close-up of the glue block used to support the M2 SSD.
The USB-C interface multiplexer switch is from asmedia, model ASM1543, and is used for the front Type-C port.
The other ASM1543 is used for the USB-C port on the rear of the motherboard.
The two overcurrent protection chips are from Jewalt.
There is a USB hub chip on the back of the motherboard, from Tang Ming, model FE1.1s, for USB2.0 interface expansion.
Close-up of a 12MHz chip crystal oscillator.
The Retimer chip for USB3.2 comes from asmedia and uses ASM1562 to enhance model integrity and compatibility.
Close-up of the power supply inductor on the chip.
Close-up of a 24MHz clock crystal oscillator.
Close-up of the M2 SSD connector on the back of the motherboard.
丝印0524PL的TVS阵列特写。
The two overcurrent protection chips are from Jewalt.
丝印C16KH的TVS阵列特写。
Close-up of two silk-screened 3324P TVS arrays.
Close-up of two silk-screened 0524P TVS arrays.
A list of all dismantling and a family photo.
Summary of the dismantling of the charging head network
The Colorful B760I motherboard is an ITX form factor and a white PCB, which is more compatible with the white host. The motherboard has two DDR5 slots and supports 96GB of RAM. There are M2 SSD slots on the front and back of the motherboard, and there are four SATA hard drive ports to meet most expansion needs. The motherboard adopts 5V ARGB interface, built-in WiFi6 wireless network card and 2.5G wired network port, and also has two Type-C interfaces, positioning high-end.
Through the dismantling of the charging head network, it was learned that this motherboard corresponds to the CPU power supply, and the South Bridge and M2 SSDs are equipped with heat sinks to reduce the temperature rise. The CPU power supply heatsink is an integrated design, and there is also a fan inside to enhance heat dissipation and improve power supply stability for the power supply circuit. The CPU power supply adopts the MPS solution, which uses the MPS multi-phase buck controller and Dr.MOS, which is 7+1+1 phase.
The memory power supply chip is from Jewalt, and the CPU power supply is filtered by solid-state capacitors, all of which come from Berry Kai. Each interface of the motherboard is equipped with TVS protection tube, and the USB interface is equipped with an overcurrent protection chip to protect against overload and electrostatic electricity. The PCIE socket adopts a metal shell to improve the anti-interference ability and enhance the mechanical strength.