Recently, a number of projects in the semiconductor industry have ushered in the latest progress, involving semiconductor materials, packaging, design, manufacturing, equipment, power semiconductors, third-generation semiconductors, etc.
With a total investment of 3 billion yuan, Tongxingda semiconductor packaging project signed a contract with Kunshan, Jiangsu
On June 7, the 2023 Kunshan (Shenzhen) Investment Promotion Conference was held, during which the Tongxingda semiconductor packaging project signed a contract to settle in Kunshan, Jiangsu.
According to the news of "Golden Thousand Deng", Shenzhen Tongxingda Technology Co., Ltd. plans to cooperate with ASE (Kunshan) Semiconductor Co., Ltd. in Qiandeng Town to invest in the construction of Gold Bump packaging and testing factory with advanced packaging technology, which is used in integrated circuit packaging technology and external connection of optoelectronic components, which is an important part of the integrated circuit industry.
The total investment of the project is expected to be 3 billion yuan, of which the total investment of the first phase is 980 million yuan, the output value is expected to be 3.2 billion yuan after production, of which the output value of the first phase is expected to be 900 million yuan, and the production scale of gold bumps will be in the leading position in the country.
The main structure of the 5.8 billion yuan Guangxin semiconductor packaging substrate project was capped
Recently, according to the news of Guda Building Materials, there is new progress in the Guangxin semiconductor packaging substrate project. At present, the main structure of the project plant and supporting facilities has been capped, and the construction of relevant ancillary supporting projects is being completed.
It is reported that the manufacturing project of Guangxin semiconductor packaging substrate products is invested and constructed by Guangzhou Guangxin Packaging Substrate Co., Ltd., with a total investment of about 5.8 billion yuan, a land area of about 140,000 square meters, and a total construction area of about 380,000 square meters. After the project is put into operation, it is expected to have an annual output of 1.5 million PNL semiconductor packaging substrates, 200 million semiconductor high-end flip-chip packaging substrates, and 1.5 million PNL semiconductor multi-chip stacked large-size packaging substrates, with an annual output value of 5.6 billion yuan.
Tianyan inspection shows that Guangzhou Guangxin Packaging Substrate Co., Ltd. was established on August 12, 2021, with a registered capital of 1500000 yuan, and its business scope includes: electronic special materials research and development, electronic special materials sales, electronic special materials manufacturing, electronic components manufacturing, electronic components and electromechanical components equipment sales, integrated circuit chips and product sales, etc.
The expansion project of CLP compound semiconductor may be put into operation in September
Recently, according to the news released by Ningbo Qianwan New Area, the CLP compound semiconductor expansion project is planned to complete the plant decoration and put into production in September this year.
According to public information, CLP Compound was established in November 2019 and is led by Huada Semiconductor Co., Ltd., a subsidiary of China Electronics Information Industry Group. According to the Ningbo Municipal People's Government, CLP Compound is the first third-generation semiconductor project in Zhejiang Province.
According to the official website of CLP, the company mainly focuses on the research and development, production and sales of large-size, high-performance silicon carbide materials and gallium nitride epitaxial materials, and has built a modern production workshop containing silicon carbide substrate, silicon carbide epitaxy and gallium nitride epitaxy in the digital economy industrial park of Ningbo Qianwan New Area, supplying commercial 4-6 inch SiC and GaN materials for domestic and foreign markets, and the products can be widely used in electric vehicles, photovoltaics, energy storage, flexible power grids, 5G base stations and other fields.
Qingdao Huaxin Jingyuan's third-generation semiconductor compound wafer substrate project was capped
According to China Construction Zhongxin news, recently, Qingdao Huaxin wafer third-generation semiconductor compound wafer substrate project was capped.
According to public information, the project is a key project in Qingdao, located north of Kehai Road, south of Keyun Road, east of Line 22 and west of Huaguan Road in Qingdao High-tech Zone, with a construction area of 62,000 square meters.
It is reported that the project started in February 2022 with a total investment of 700 million yuan, using silicon carbide, gallium nitride, gallium oxide and other third-generation semiconductor compound materials to process and produce related chip substrate products, which are widely used in optoelectronic devices and communication microwave RF devices (4G, 5G communication base stations). After the completion of the project, it will achieve an annual production line of 330,000 third-generation compound semiconductor substrate wafers.
Gaoxin Zhongke semiconductor headquarters project signed a contract with Suzhou Wujiang
According to the news of Wujiang Development Zone, on June 8, the 2023 Wujiang (Shanghai) Collaborative Development Investment Conference was held in Hongqiao, Shanghai. At the meeting, 53 projects were signed with a total investment of 20.86 billion yuan. The signed projects include the headquarters project of Gaoxin Zhongke Semiconductor.
According to enterprise investigation information, Suzhou Gaoxin Zhongke Semiconductor Co., Ltd., established on December 21, 2020, is a semiconductor component reuse technology service provider, covering 12-inch, 8-inch, 6-inch and other abnormal process wafer recycling, classification, film removal, grinding, cleaning and testing and other reuse technical services, as well as semiconductor and optoelectronic equipment precision parts cleaning and reuse technical services, high-grade clean consumables manufacturing business, etc.
Yuanxu Semiconductor Tianjin production base project started
According to the news released by Binhai, on June 8, the Tianjin production base project of Yuanxu Semiconductor officially started, and the project will create a model case of the vertically integrated manufacturing model of the third generation of semiconductor chips.
Yuanxu Semiconductor Tianjin production base project is equipped with a new third-generation semiconductor optoelectronic chip R&D center and production line, integrating wafer materials, chip design, chip manufacturing, chip packaging and testing and other important industrial chain links, will focus on the vertical integration of a new generation of Micro-LED semiconductor integrated display. After completion, it will achieve an annual output of 30,000 square meters of Mini/Micro-LED display module production scale, with an annual output value of 1 billion yuan.
According to the official website, Yuanxu Semiconductor Technology Co., Ltd. (hereinafter referred to as "Yuanxu Semiconductor") was established in 2014, is a scientific and technological enterprise engaged in the third generation of semiconductor chips, new display and vision solutions, and has 5 innovation research centers, 3 large-scale production bases and 6 regional operation centers in China.
The infrastructure project of electronic chip R&D platform in Binhai High-tech Zone has been fully capped
According to the news released by Binhai, a few days ago, the infrastructure project of the electronic chip research and development platform of Binhai High-tech Zone has achieved a comprehensive cap on the main structure. At present, the project construction has been transferred to the secondary structure and hydropower installation construction stage.
The Binhai High-tech Zone electronic chip R&D platform infrastructure project started in September 2022 and is expected to be completed by the end of 2023, the project is a key project in Tianjin, is one of the "new infrastructure" projects in the "Ten Major Projects" of the beautiful "Bincheng" construction, and will become another important incubation platform for chip R&D enterprises in Binhai High-tech Zone after completion.
ZTE's automotive-grade 5G module will be launched on GAC, and the first model is expected to be mass-produced next year
Recently, the Automotive Engineering Research Institute of Guangzhou Automobile Group Co., Ltd. (GAC Research Institute) announced that the 5G V-Box mass production development project will be the first to be equipped with ZTEC's automotive-grade 5G module, and the first equipped model is expected to be mass-produced in 2024.
ZTE news shows that the ZTE automotive-grade 5G R16 module ZM9300 series is a 5G domestic module product based on the full-stack self-developed chip platform. ZM9300 series products have reached the industry leading in terms of performance, bandwidth, delay, reliability, NR-V2X, AP high computing power, and high-precision positioning. In terms of quality, the module is designed in full compliance with IATF16949:2016 standard, which can provide safe and reliable in-vehicle networking solutions for automotive customers, and can be widely used in in-vehicle networking and other connected products (T-Box, OBU, RSU, cockpit, etc.).
It is reported that GAC R&D Center is one of the first car companies to independently develop T-Box and V-Box based on the R16 standard, ZTE will give full play to its advantages in information and communication technology on the terminal side and network side, match GAC's layout in the field of intelligent driving technology research and development, and work with GAC to realize from technical success to commercial success from user scenarios and user needs.
Recently, Liang Weiqiang, vice president of GAC Research Institute, introduced that GAC has created a new scenario-based functional experience such as intelligent cockpit, intelligent driving, 5G interconnection, and ecological services based on the Xingling architecture, with a high starting point and strong scalability, which will bring a higher ceiling to intelligent vehicles.
Guanli Technology Industrialization Base Project settled in Suzhou
Suzhou High-tech Zone released news that on June 7, the Guanli industrialization base project officially settled in Suzhou High-tech Zone. This time, Guanli Technology continues to increase capital and set up an industrialization base integrating R&D, production, sales and other functions, which will further enhance the R&D and production capacity of high-tech industry production process supply systems such as semiconductors and panels.
Founded in 2016, Suzhou Guanli Technology Co., Ltd. is a wholly-owned subsidiary of Pengyi Co., Ltd., a subsidiary of Shenghui of Taiwan, in Suzhou High-tech Zone, and has become a leading technology enterprise in the field of production process supply system. Tianyan inspection shows that the company's business scope includes the manufacture of special equipment for semiconductor devices; Special equipment manufacturing (excluding licensed professional equipment manufacturing); Manufacture of electronic special equipment; sales of special equipment for semiconductor devices; Sales of electronic special equipment, etc.
In addition, as a Suzhou High-tech Zone enterprise under Shenghui in Taiwan, China, Shenghui Integration has been successfully listed last year.
Laplace Semiconductor and photovoltaic high-end equipment East China regional headquarters project settled in Wuxi
According to Huijuxibei news, on June 7, the East China regional headquarters project of semiconductor and photovoltaic high-end equipment signed a contract to settle in Wuxi Xibei Town. The project is a R&D headquarters project invested by Laplace New Energy Technology Co., Ltd. (hereinafter referred to as "Laplace") in Xibei, which is mainly used for the construction of photovoltaic equipment R&D center and semiconductor pilot line.
According to public information, Laplace New Energy Technology Co., Ltd., founded in 2016, is an enterprise founded by a number of high-end talents in the field of semiconductor equipment at home and abroad, and is committed to becoming a leading domestic high-end equipment and solution provider in the semiconductor and photovoltaic fields.
It is reported that Laplace technical team has developed the first high-capacity horizontal plug-in low-pressure diffusion oxidation furnace and vertical horizontal plug-in plasma-enhanced chemical vapor deposition equipment in the field of photovoltaic manufacturing.
With an annual output of 300,000 silicon wafers for semiconductors, Jiangsu Dongxu Electronics Project started construction and laid the foundation
According to the news of "Qingjiangpu Today", on June 6, Jiangsu Dongxu Electronics Project started construction and laid the foundation.
Jiangsu Dongxu Electronics Project plans to invest 300 million yuan, land 30 acres, after completion and production, it can form an annual output of 4 million pieces of electronic-grade tape, 300,000 pieces of semiconductor silicon wafers, 100 sets of AOI inspection equipment production capacity, is expected to achieve an annual output value of 1 billion yuan.
According to the news, Shanghai Dongxu Electronic Technology Co., Ltd. (established in 2008 by Japan Dongxi Electronics Co., Ltd.), is a national high-tech enterprise, with a number of invention patents, and its fist product electronic grade tape is at the world's leading level.
With a total investment of 330 million yuan, the construction of the international automotive chip innovation headquarters will be started
According to Shanghai Jiading news, recently, Anting Town 22-10 plot project successfully won land, at the end of this year, the international automotive chip innovation headquarters will start construction in the plot. With a total investment of 330 million yuan, the project is expected to be completed in July 2025 and reach production in 2026.
The project is bounded by the base boundary in the east, Changji Road in the south, Moyu Road in the west, and the base boundary in the north, and is the location of the original "Yin'an Hotel" in Anting Town. The site covers an area of nearly 7,000 square meters and will build a new business building with an area of more than 30,000 square meters. After completion, it is planned to introduce more than 20 chip companies to settle in, and it is expected that the annual operating income will not be less than 440 million yuan after reaching production, and the annual tax payment will not be less than 44 million yuan.
The International Automotive Chip Innovation Headquarters is an important layout for Anting Town to build a new highland for the future automotive industry. According to the news, up to now, Anting Town has landed nearly 20 chip projects such as Saishou Technology and Tonqun Technology, hoping to quickly gather industry leading enterprises, unicorn enterprises and growing technology enterprises, as well as domestic and foreign automotive chip outstanding talents through the completion and production of the international automotive chip innovation headquarters, and build an automotive chip industry ecosystem with advanced concepts, leading technology, talent gathering, resource enrichment and distinctive characteristics.