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Breaking through the bottleneck, Huawei has fully entered the semiconductor field
Since Huawei's supply chain on the "chip" was cut off, it announced its full entry into the semiconductor field. Its subsidiary Hubble has invested in a number of domestic semiconductor industries, from raw materials such as photoresists to EDA software, to process technology, to equipment and so on. At present, there are 27 enterprises that have invested publicly.
In addition, Huawei also listed the HiSilicon department of the second-level department as a first-level department, and officially announced at the press conference that it will use 20% of the revenue for research and development funds every year thereafter, and has increased its efforts to promote self-developed chips.
Huawei's famous Kirin chip must have been heard by many people, and it is precisely with the Kirin chip that Huawei has become the only domestic mobile phone manufacturer that can compete with Apple. Huawei once occupied the top spot in the market sales list with 240 million shipments, surpassing Apple.
Kirin chip as Huawei's independent research and development of chips, but the FOUNDG has always been handed over to TSMC, since TSMC was restricted from shipping to Huawei, Kirin chips have become a "no song". To this end, Huawei had to temporarily use Qualcomm's 4G chip as a transition, and then found a way to solve it.
In order to solve the problem of chip bottlenecks, Huawei not only increased investment in the semiconductor field, but also said that it would use the method of exchanging area for performance, and use the stacking chip process to improve the performance of chips. Today, Huawei has mastered a number of stacked chip related technology patents.
Kung Fu pays off, and after entering 2022, the news that Huawei continues to break the ice in the chip field has come one after another.
For example, regarding self-developed chips, Huawei's Kirin 9000L chip has been officially listed with the Mate 40E Pro smart phone, in addition, Huawei has also launched a TV chip independently developed based on the open source architecture risc-v, as well as screen driver chips and automotive chips. These chips have been officially delivered for commercial use.
Huawei raised 21 billion yuan
Since the beginning of 2019, Huawei has accelerated the pace of financing, especially this year, and the amount of financing is more than twice that of last year.
According to the subscription instructions for the fourth phase of the 2022 medium-term notes announced by Huawei, the maturity date of the current debt financing instrument is three years, and the issuance scale is 4 billion yuan. Huawei has issued three tranches of medium-term notes and two tranches of ultra-short-term financing bonds this year, raising a total of 17 billion yuan.
Coupled with the 4 billion yuan this time, Huawei's raised funds have reached 21 billion yuan. For the use of these funds, Huawei said it will use them to supplement the working capital of the company and its subsidiaries. It is reported that these funds are mainly used for investment in the domestic semiconductor industry chain.
Judging from Hubble's public investment in 27 semiconductor-related industries, Huawei still focuses on semiconductors, and chips are the top priority.
Huawei has a showdown
The news released by Huawei is equivalent to a showdown, on the chip issue, Huawei has never given up, and has a multi-faceted layout.
First of all, in the chip process, TSMC will be restricted from shipping is nothing more than a technical problem, Huawei first solved this problem. Huawei has publicly stated that it will use stacked chips to enhance chip performance, and has published multiple patents for stacked chips.
Even without advanced manufacturing processes, chips will still have powerful performance and good power performance.
Stacked chips are expected to be officially launched at the end of this year or early next year.
In addition, in addition to the traditional logic chip, Huawei has begun to lay out optical chips more than 10 years ago, and also intends to build a global research and development center near Cambridge at a cost of one billion pounds.
Optoelectronic chips are considered by the industry to be the most likely to replace traditional silicon-based chips, and Germany and the Netherlands are already developing optoelectronic chips. In this field, Huawei entered the game much earlier than Lao Mei, which is more advantageous, and through this technology, it can completely bypass the technical restrictions of Lao Mei.
Secondly, Huawei has not taken it lightly in terms of chip architecture. In addition to increasing the research and development of the open source architecture risc-v architecture, Huawei has also developed its own architecture, such as the Da Vinci architecture, like Huawei's automotive chips are based on the self-developed Da Vinci architecture.
Finally, Huawei is actually an excellent chip design manufacturer, after all, Huawei's HiSilicon Kirin chip is independently designed. Therefore, Huawei also attaches great importance to the front-end design of the chip, Huawei has repeatedly recruited relevant talents in EDA software, and has also invested in a number of EDA software companies in China.
Write at the end
From the above point of view, it is true that Huawei's layout in the semiconductor industry has been very comprehensive, especially in terms of chips, and the layout has been very thorough.
Ren Zhengfei has said that in the next three to five years, there will be a chip industry chain of non-American technology. Judging from the fact that various regions are gradually reducing their dependence on American technology, I believe that this time is not far away.
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