Today, Xiaobian wants to share with friends the relevant introduction of electronic processing technology. The manufacture of electronic products can be divided into three levels: the top layer is the manufacture of complete machine products directly facing the end user, such as computers, communication equipment, and various types of audio and video products. The intermediate level is a wide variety of electronic basic products that form electronic terminal products, including semiconductor integrated circuits, electric vacuum and optoelectronic display devices, electronic components and electromechanical components. Electronic whole machine products are assembled and integrated by electronic basic products. The lowest level is the special equipment, electronic measuring instruments and electronic special materials that support the assembly of electronic terminal products and the production of electronic basic products, which are the foundation and support of the entire electronic information industry.
SMT chip processing technology greatly promotes the efficiency of electronic assembly, and its process includes: printing solder paste on PCB, mounting components, reflow soldering, etc. The key equipment of the SMT process is the placement machine, the placement accuracy, the placement speed, the adaptation range of the placement machine determine the technical ability of the placement machine, and the placement machine also determines the efficiency of the SMT placement processing production line. According to the composition of electronic products and the manufacturing process, electronic manufacturing technology is mainly divided into the following four categories.
Micro-machining technology: Micro-nano machining, micro-machining, and some precision machining techniques used in electronics manufacturing are collectively referred to as micro-machining. Micro-nano machining in micromachining technology basically belongs to the method of plane integration. The basic idea of planar integration is to construct micro-nano structures on a planar substrate material by means of layer-by-layer stacking. In addition, the use of photon beams, electron beams and ion beams for cutting, welding, 3D printing, etching, sputtering and other processing methods are also classified as micro-processing.
Interconnection, encapsulation technology: the interconnection between the chip and the outgoing line on the substrate, such as inverted bonding, lead bonding, silicon through hole (TSV) and other technologies, the encapsulation technology after the chip and the substrate are interconnected, etc., these technologies are commonly referred to as chip packaging technology, passive component manufacturing technology. Manufacturing technology for passive components such as capacitors, resistors, inductors, transformers, filters, and antennas. At the same time, it is also the most used technology in Guangzhou SMT patch processing plant.
Optoelectronic packaging technology: Optoelectronic packaging is a system integration of optoelectronic devices, electronic components and functional application materials. In optical communication systems, optoelectronic packaging can be divided into chip IC-level packaging, device packaging, and mold microelectromechanical system manufacturing technology. A miniature system that integrates sensors, actuators, and processing control circuits on a single silicon chip using microfabrication technology.
Electronic assembly technology: Electronic assembly technology is commonly referred to as board-level packaging technology, electronic assembly technology to surface assembly and through hole insertion technology. Electronic materials technology. Electronic materials refer to materials used in electronic and microelectronic technologies, including dielectric materials, semiconductor materials, piezoelectric and ferroelectric materials, conductive metals and their alloy materials, magnetic materials, optoelectronic materials, electromagnetic wave shielding materials and other related materials. The preparation and application technology of electronic materials is the basis of electronic manufacturing technology.
Electronic processing technology
Jiangxi Intree Electronic Technology Co., Ltd. was established in May 2016, is located in the hometown of talents - Linchuan District, Fuzhou City, Jiangxi Province, Jiangxi Intree Electronic Technology Co., Ltd. has an existing plant area of 30,000 square meters, 24 SMT production lines, 8 plug-in lines, 4 wave soldering lines, 8 assembly lines, 4 packaging lines, a total investment of 1 billion yuan, equipped with advanced and perfect digital management system, is committed to building an Industry 4.0 smart factory. Has a perfect industry 4.0 solution, PCBA processing services, SMT patch processing services, OEM electronic processing services, ODM foundry services.