Recently, ToF semiconductor manufacturer pmdtechnologies (pmd) released the second generation of 3D ToF depth sensor development kit flexx2 for prototyping, research and development and mass production, the product has begun to pre-order, is expected to ship in February. It is reported that flexx2 can achieve accurate 3D measurements in the range of 10 cm to 4 meters, and the operating frequency is as high as 60fps, which will effectively improve the effect of fast capture functions such as gesture tracking.
Depending on the application scenario, flexx2 is available in two versions: 1) package and certification development kits for prototyping and development, and 2) non-packaged OEM modules that support mass production.
According to Qingting.com, flexx2 was developed by pmd in cooperation with Emcraft Systems, an integrated application hardware and software solution provider, and is an upgrade based on the discontinued PicoFlexx, which is characterized by better depth sensing performance, with a 56° x 44° scanning range, in addition to its size of only 72.1 mm x 19.2 mm x 10.2 mm, equivalent to the size of a pack of chewing gum.
In terms of details, the VCSEL emitter wavelength of the flexx2 is improved from the previous version of 850 nanometers to 940 nanometers, which has the advantage of improving the performance of operation in daylight and outdoor scenes. The previous USB-A port was also upgraded to USB 3.0 Type-C.
In addition, flexx2 is compatible with the previous PicoFlexx code and supports pmd's Royale SDK. In fact, PicoFlexx was developed by Infineon in collaboration with PMD, and the new flexx2 will also support Infineon's IRS2381C REAL3 time-of-flight image sensor, as well as high-quality depth data from the PMD SDK.