Optical module heat dissipation, EMI scheme

With the development of optical communication products, optical modules are required to have higher and higher speed (from 10GHz to 100GHz) and smaller and smaller volume. This puts forward more demanding requirements for heat dissipation of optical modules, that is, to achieve good heat dissipation characteristics under the conditions of small package and high power.In order to ensure the heat dissipation of the optical module, in addition to the overall design process, the selection of heat conducting materials is also an extremely important factor. For the heat dissipation requirements above the optical module, thermal conductivity gap filler materials with good compliance (i.e., 60% compression deformation rate at 50psi pressure, 1-17w/mk thermal conductivity range, thickness ranging from 0.1mm to 5.08mm) reduce the pressure on the device, providing a high and reliable guarantee for thermal conductivity requirements of product design.

For more details about heat sinks, please visit our website at https://www.lorithermal.com.