Huatian Technology announced on the evening of November 4, and the National Integrated Circuit Industry Investment Fund Phase II Co., Ltd. was allocated 1.13 billion yuan.
According to the subscription situation of investors, the issue price is 10.98 yuan per share, the number of shares issued is 464,480,874 shares, and the total amount of funds raised is 5.1 billion yuan, and the subscription status of each offering target is as follows:
The announcement said that the project of the non-public offering to raise funds for investment is the company's main business, so this issuance is conducive to further enhancing the company's financial strength, improving the company's core competitiveness, expanding the scale of revenue, and improving the company's sustainable profitability.
On the disk, Huatian Technology closed at 13.17 yuan today, up 0.92%.
According to the third quarterly report, Huatian Technology achieved operating income of 3.249 billion yuan in the third quarter, an increase of 47.49% year-on-year; net profit attributable to the mother of 415 million yuan, an increase of 130.22% year-on-year; deduction of non-net profit of 341 million yuan, an increase of 107.09% year-on-year.
In the first three quarters of 2021, Huatian Technology achieved operating income of 8.867 billion yuan, an increase of 49.85% year-on-year; net profit attributable to the mother of 1.028 billion yuan, an increase of 129.78% year-on-year; deduction of non-net profit of 819 million yuan, an increase of 118.64% year-on-year.
According to public information, Huatian Technology's main business is integrated circuit packaging and testing, etc., and its products are mainly used in computers, network communications, consumer electronics and intelligent mobile terminals, Internet of Things, industrial automation control, automotive electronics and other electronic machines and intelligent fields. The company is a leading integrated circuit packaging and testing enterprise in China, and its industrial scale ranks among the top ten in the global integrated circuit packaging and testing industry.