Electronic enthusiast network report (text / Liang Haobin) On November 3, Chen Gang, chairman and general manager of BYD Semiconductor, shared a set of data in today's speech: "Last year, the sales of domestic new energy vehicles were 1.3 million, and this year's forecast for new energy vehicles is about 2 million. However, the data from January to September has shown that the number of new energy vehicles in China has reached 2.1 million, and the production and sales of new energy vehicles in China exceeded 350,000 in May. At this rate, this year's sales of new energy vehicles will reach 3.2 million. ”
"We include upstream and downstream speculation that next year's domestic sales of new energy vehicles are likely to be between 5 million and 6 million."
Chen Gang said that compared with fuel vehicles, the most basic semiconductor in new energy vehicles is the large-scale use of power devices, such as igbt, some devices in the battery protection management system. In terms of power devices alone, the amount of semiconductors used in new energy vehicles has at least doubled. In addition, in new energy vehicles, intelligent control and sensors have increased significantly, and with the development of adas, the use of image sensors and control computing chips will also increase significantly.
Chen Gang believes that one of the reasons why new energy vehicles are currently facing a lack of cores is that the traditional wafer manufacturing industry, such as automotive semiconductors, account for less than 4% of the world's largest fabs, but the proportion of automotive semiconductors in the entire semiconductor industry is 20%, and this proportion will continue to increase in the future. 4% wafer manufacturing capacity, to support 20% of the application side, the gap can be imagined.
He said that he sincerely hopes that all of China's semiconductor industry will expand from the consumer category to new industrial strategies, such as new energy vehicles. "In this regard, I think China can grow rapidly, in addition to the rapid growth of advanced processes in consumer electronics, the high intelligence, high integration, high efficiency of automotive electronics, etc., is also where we need to break through."
The lack of cores, from the perspective of the design, process, manufacturing, packaging and other industries in the semiconductor industry, lies in whether a wafer can support more cars. Chen Gang said: "Taking igbt as an example, the original use of a 6-inch wafer can only meet the needs of one car, and a 6-inch or 8-inch wafer in the future may be able to achieve 1.5 vehicles, 2 vehicles or even 3 vehicles, so that in the case of global wafers can not quickly increase production capacity, we can make the limited wafer support more demand from the design and innovation." ”
Chen Gang also revealed that this year BYD will push 6.0 generations of igbt products, the future will launch 7.0 generations, and the purpose of iteration is to do higher density under the same current, make the chip area smaller, and make the loss lower.
It is understood that from the perspective of packaging, in fact, for power devices, the heat dissipation demand is very high. In terms of packaging of vehicle specification products, vacuum welding, ultrasonic welding, composite materials, nano-silver applications in packaging, double-sided heat dissipation and other new generation technologies are widely used in automotive semiconductors. Chen Gang believes that these technologies, which integrate heat dissipation, materials, processes and other aspects, are not something that a company can do, but need to gather all the upstream and downstream forces in China to empower new energy vehicles.
"After the past two years, the development of automobiles to electric vehicles, especially the lack of cores, has made us more and more aware of the dilemma of information chain transmission. Now many automotive terminal manufacturers have begun to deeply integrate with the upstream and downstream of semiconductors. ”
The traditional vertical collaboration model is that the main engine factory communicates with tier1, tier1 communicates with the module factory, the module factory communicates with the chip manufacturer, and the chip manufacturer also communicates with the fab.
For the future collaboration model, Chen Gang believes that it is necessary for automakers and tier1, module manufacturers, chip manufacturers, and fabs to develop together. "BYD now regularly discusses with fabs, because from fabs, we can get new technologies and new industrial information, which can make all fabs and chip design companies more determined about the development of new energy vehicles in the short term."
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