In this era of rapid development of science and technology, the breakthrough and progress of chip technology is undoubtedly the core engine of the development of the entire electronic information industry. The level of nanoscale chip manufacturing process has become an important indicator to measure a country's scientific and technological strength. However, the road to research and development of advanced process technology is not smooth, and expensive equipment investment and technical difficulties emerge one after another, which make it daunting for those who want to catch up. At this time, a news from TSMC brought a glimmer of hope for China's chip research and development advanced technology.
Traditional perceptions are broken, and old equipment creates new miracles
In May 2024, TSMC announced that they would use the existing first-generation EUV lithography machine to achieve the 1.6nm A16 process process, and mass production is expected to be achieved in 2026. This news has attracted a lot of attention in the industry, because it is customary to further reduce the process process and require the use of new, more advanced and more expensive lithography machines. For example, the current state-of-the-art 2nm EUV lithography machine costs as much as $380 million per unit, making it a huge financial and technical challenge for emerging chipmakers such as China to acquire such equipment.
However, TSMC's approach has broken this conventional wisdom. In the past, they have successfully developed a 7nm process using the first generation of DUV lithography machines. This move not only greatly saves capital investment, but also proves that technological innovation is far more important than simple capital investment and equipment upgrades. TSMC's insistence on using existing equipment to develop a new generation of advanced processes reflects their deep accumulation and extraordinary strength in technology research and development.
The dawn is emerging, and China's chip research and development is ushering in new hope
TSMC's approach to process technology innovation has undoubtedly given great encouragement and inspiration to China's advanced chip research and development technology. According to industry expectations, Chinese chipmakers have probably relied on existing DUV lithography machines to achieve a level close to 7nm process. For example, the 5G chip of a well-known domestic mobile phone company is considered to be close to the 7nm process. If we follow TSMC's technical route and make innovative breakthroughs, it is entirely promising to use existing DUV lithography machines to develop 5nm or even more advanced processes.
In fact, it is reported that domestic chip companies have developed quadruple exposure technology, which can further tap the potential of DUV lithography machines and lay the foundation for the development of 5nm processes. In this regard, Lin Benjian, the former technical leader of TSMC, also gave a positive evaluation, believing that DUV lithography machines still have great potential to be tapped, but compared with the EUV process, the cost of developing 5nm with DUV will be relatively high.
In addition, TSMC's former technology boss Liang Mengsong is now serving as co-CEO of SMIC, and such a relationship will undoubtedly bring valuable experience to China's chip development more advanced technology. Therefore, we have every reason to expect that Chinese chips will achieve 5nm or even more advanced technology in the near future.
The continuation and breakthrough of innovative ideas is the key to achieving technological leapfrogging
Looking back on TSMC's achievements on the road of chip process innovation, its core concept is undoubtedly to continuously tap the potential of existing equipment and break through the traditional technical framework with innovation. The formation of this concept is inseparable from TSMC's own unique development process.
As a late-rising chip foundry, TSMC encountered many difficulties when it started. Due to the lack of advanced process technology, TSMC was once regarded as a backward "automobile workshop". But it is in this passive squeeze environment that TSMC germinates an innovative concept of self-reliance and self-reliance and tapping potential.
They know that it is not wise to buy expensive advanced equipment to gain a foothold in the capital- and technology-intensive industry of chip manufacturing. Instead, a more feasible path is to leverage ingenuity to exploit the full potential of existing equipment and achieve innovative breakthroughs with limited resources.
After unremitting efforts, TSMC has finally succeeded in the breakthrough of the 7nm process, which marks the correctness of their innovative concept has been tested. Later, in the research and development of the 1.6nm process, TSMC once again chose the route of using existing equipment, and its innovative courage and persistence are worthy of admiration.
This innovative concept is also instructive for the development path of China's chips. Just like TSMC, China's chip industry is still in the catch-up stage, and the lack of funds and advanced equipment is undoubtedly the biggest shortcoming. But we must not be bothered by the shortcomings in front of us, let alone completely crushed by the technological blockade of foreign countries. On the contrary, we must give full play to the wisdom of innovation like TSMC, make full use of existing resources, and overtake through technological innovation with less capital and equipment investment.
Of course, to achieve this is not achieved overnight, and it is necessary to work together from the government to enterprises, from scientific research institutions to universities, to form a strong synergy to promote innovation and development. The government should increase investment to create a good environment for innovation in the chip industry; Enterprises should be bold in trying and exploring cutting-edge technologies; Scientific research institutions and universities should cultivate high-end chip talents and continuously promote technological progress.
Ren Zhengfei once said: "We must pursue excellence in a poor environment." For the current Chinese chip industry, this is undoubtedly the most appropriate call. We should draw wisdom from TSMC's successful innovation experience, carry forward the spirit of self-reliance, break through the shackles of capital and equipment with wisdom and innovation, achieve continuous breakthroughs in the field of chip manufacturing process, and inject new impetus into China's scientific and technological development.
Although the road is difficult, as long as we maintain the courage and tenacity to innovate, China's chip industry will be able to catch up steadily and continue to write more dazzling glory. TSMC's practice of developing advanced processes with old equipment has lit up the light of hope for us and made us firmly stride forward on the road of innovation!