After all, it is destined to come. TSMC once monopolized the high ground of the semiconductor market, but now, a change is quietly happening, and TSMC's supremacy may be threatened.
In the past, it was widely believed that TSMC ranked first and Samsung ranked second. However, with the world's first 3nm chip about to go into mass production, this pattern may be broken.
TSMC did not expect that the world's first 3nm chip would be produced by another company, and this chip also uses a new 3GAE process technology. This could mark a major watershed moment for the semiconductor industry.
Recently, Samsung announced that it is expected to achieve mass production of 3nm chips in the coming weeks, and will become the first company in the world to achieve mass production of high-process chips, which is a milestone achievement.
For TSMC, what is even more worrying is that their recently produced 4nm Dimensity 9000 chip has been exposed to high power consumption and heating problems. This is mainly because the FinFET structure they use has some problems when facing high process technology.
For example, as the size of the chip decreases, the channel length of the FinFET structure also narrows, resulting in a decrease in the gate's ability to control the channel, resulting in leakage, resulting in increased power consumption and heat generation.
However, the GAA transistor structure adopted by Samsung has a natural advantage in this regard. In GAA transistors, the channels are horizontal and surrounded by gates. In addition, GAA channels are formed through epitaxial and selective materials, and developers can adjust the width of the channels to precisely control the state of the channels.
In general, wider channels can significantly improve performance, while narrower channels help reduce power consumption. This means that developers can control the width of the channel more flexibly according to actual needs to find a better balance between performance and power consumption.
GAA transistors are a completely new structure that can solve leakage problems that may have occurred in the past from the basis of chip design, thereby improving performance and reducing power consumption, with a double superposition advantage.
Some insiders believe that the GAA-structured transistor may reduce the chip size by about 25% again, achieving a new breakthrough.
In sharp contrast, TSMC is still stuck in the predicament of the FinFET structure, unable to extricate itself. In order to cope with the disadvantages of FinFET structure, TSMC can only use the 3nm process of 5nm enhanced N4P to provide Apple with the next generation of processors.
TSMC once believed that having technology is equivalent to having market share, and high process technology will be unfavorable. But now, the global semiconductor industry has ushered in a change.
In addition to Samsung's GAA new process technology, Intel has also begun to increase semiconductor technology research, according to rumors, Intel plans to regain the global semiconductor process leadership by 2024.
In addition, Intel has received priority supply rights for ASML's next-generation lithography machines, which will provide them with strong support. The new generation of EUV lithography machines will use high numerical aperture values, from 0.33 to 0.55.
The NA value is an important parameter for evaluating the advanced degree of a lithography machine, and a higher NA value means that higher circuit diagram resolution can be achieved on the same size wafer, while also accommodating more transistors.
As TSMC has adopted different supply strategies in different regions, new semiconductor development plans have been launched in various regions, including Europe, the United States, Japan and South Korea.
TSMC thought that with the technology, customers and ASML support, it could firmly hold the top of the semiconductor industry. However, these advantages are gradually being lost.
Nowadays, semiconductor companies have sprung up, and various new technologies and concepts are constantly emerging. With the emergence of new materials and new processes, TSMC's past technical system is also at risk of being eliminated.
TSMC's technical system is not perfect, low chip yield, high equipment cost, large energy consumption, these problems are gradually limiting their development.
TSMC must recognize that it was not they who shaped the era, but the era that shaped them. Samsung's 3-nanometer chip is about to come out, and new semiconductor forces are also rising. Including our own chip technology is constantly improving, the semiconductor industry is coming
Go through a huge shuffle. Although Samsung's GAA process faces some problems, such as low yields, at least they have taken the first steps towards a new process. For TSMC, it will usher in a huge challenge.
The changes in the chip industry are coming, and the winners and losers in the future are still undecided, so let's wait and see.
However, TSMC is not helpless. They still have strong technical prowess and a global customer network. To meet this challenge, they need to accelerate the pace of innovation, continuously improve existing technology systems, reduce costs, and increase yield to remain competitive.
At the same time, TSMC can also actively seek partners, strengthen R&D cooperation, and jointly promote the progress of semiconductor technology. Building a closer relationship with your customers and listening to their needs and feedback will help meet the constant changes in the market.
In addition, TSMC can also consider diversified development, not only relying on process technology, but also entering a wider range of fields, such as packaging and packaging and testing. This will help reduce over-reliance on process technology and spread risk.
In conclusion, while TSMC faces stiff competition from Samsung, Intel, and other emerging competitors, they still have the opportunity to continue to play a leadership role in the semiconductor industry. The key is to respond to challenges, innovate and remain flexible to adapt to changing market demands. Only in this way will they be able to succeed in this era of opportunities and challenges.