In recent years, with the continuous advancement of science and technology and the rapid development of the semiconductor industry, packaging and testing companies are also rising. Among them, Chinese mainland the first company that can package and test 4nm mobile phone chips, Changjian Technology Co., Ltd. has attracted much attention.
It is reported that Changjian Technology was founded in 1996 and is one of the world's leading large-scale integrated circuit packaging and testing service providers. Headquartered in Wuxi, Jiangsu Province, the company has an extensive global customer network, and its products cover automotive electronics, smart phones and other fields.
As a leading semiconductor packaging and testing enterprise in China, JCET has been constantly exploring new technologies and business innovations.
Recently, Changjian Technology announced that it has successfully packaged and tested 4nm mobile phone chips. This means that JCET has the ability to independently develop packaging and testing tools and test procedures, and can provide customers with challenging test processes from 28nm to 4nm. This is an important milestone for Changjian Technology, and also marks that the technical level of the Chinese mainland packaging and testing industry has reached one of the world's advanced levels.
In fact, the packaging and testing of the 4nm process is also a very challenging and high-risk field internationally. Changjian Technology can successfully develop the corresponding technology, in addition to a large amount of R&D investment, it is inseparable from its years of deep cultivation in the IC packaging and testing industry and timely grasp of the market. According to data, with the rise of emerging industries such as 5G communication, Internet of Things, and artificial intelligence, the global semiconductor market has exceeded $500 billion, and the Chinese market is still one of the fastest growing markets in the world. This also means that JCET Technology will usher in greater market opportunities and development space.
It can be said that the breakthrough of Changjian Technology in R&D and packaging and testing technology will not only help enhance the company's market competitiveness, but also promote the development of China's packaging and testing industry. At the same time, in the reshuffle and adjustment of the global semiconductor market, China's chip industry is also accelerating its transformation to independent and controllable direction. To implement independent and controllable work, it is necessary to have the core technology and production capacity of key components. Therefore, the development of JCET has become a positive signal of China's independent controllability, and also provides a new opportunity for the future development of China's chip industry.
Of course, in the market competition and technical challenges faced by JCET, there are also certain difficulties and risks. The technical level of the packaging and testing industry and the needs of customers are constantly changing, which requires enterprises to have strong adaptability and innovation capabilities. At the same time, in the international market, especially when competing with enterprises in Taiwan, Chinese enterprises also need to learn and master relevant technologies and experiences more comprehensively, systematically and deeply.
In short, the success of Changjian Technology's 4nm mobile phone chip packaging and testing is not only a display of technological innovation and achievements in the Chinese mainland packaging and testing industry, but also symbolizes the continuous acceleration of China's independent scientific and technological innovation. Driven by emerging industries such as 5G communication, Internet of Things, and artificial intelligence, China's semiconductor industry will usher in historic opportunities and challenges. The success of Changjian Technology provides a strong guarantee for the future development of China's packaging and testing industry, and also provides a solid foundation for China's chip industry to build stronger core competitiveness in the global market.
Since May 20, 2020, when the U.S. government announced the inclusion of Chinese semiconductor giant Huawei on the Entity List, the complexities of the global semiconductor industry have begun to emerge. In this context, the development of the Chinese mainland semiconductor industry is facing many challenges and pressures, especially in the field of chip manufacturing. However, driven by government support, independent innovation and technological progress, China's chip manufacturing enterprises are still achieving a counterattack, among which Changjian Technology has made significant progress in the field of packaging and testing. Recently, Changjian Technology said that it has the ability to evaluate 4nm mobile phone chips, becoming the first company in Chinese mainland to be able to package and test 4nm mobile phone chips.
Part 2: Changjian Technology Emerges
Changjian Technology was founded in 1971 and is headquartered in Hsinchu Science Park, Taiwan. The company is a world-leading semiconductor integrated circuit packaging and testing service provider, and its customers include Intel, Samsung, AMD, ARM and other world-renowned enterprises. Changjian Technology has top technology and equipment in the field of packaging and testing, and is one of the world's largest OSAT (Outsourced Semiconductor Assembly and Test) companies, with business all over the world.
JCET also has extensive business in the Chinese mainland market, and currently has branches in Shenzhen, Shanghai, Suzhou and other places. The company's R & D and manufacturing capabilities in the field of chip packaging are deeply trusted and recognized by customers at home and abroad, and its products are mainly used in computers, communications, consumer electronics, automotive and other industries.
Part 3: Evaluate the capabilities of 4nm mobile phone chips
Changjian Technology recently said that it has the ability to evaluate 4nm mobile phone chips, and the technology has been applied to some customers' products. The successful realization of this technology not only reflects the technical strength and innovation ability of JCET, but also affirms the development and independent innovation ability of China's semiconductor industry.
It is reported that 4nm is currently one of the most advanced chip production processes in the world, which can achieve higher integration and lower power consumption. This technological breakthrough of JCET is of great significance in the chip manufacturing industry. In addition, this also provides a significant improvement in the position of China's semiconductor industry in the world.
Part IV: Government support and technical input
This breakthrough of Changjian Technology is inseparable from the support of the government and independent innovation of enterprises. In recent years, the Chinese government has attached great importance to the development of the semiconductor industry and adopted a series of support measures and policies, including tax exemptions, financial subsidies, talent introduction, etc., to stimulate the enthusiasm of enterprise investment upgrading and independent innovation.
At the same time, Changjian Technology has also made a lot of investment in technology. Up to now, the company has formed a complete packaging and testing technology chain and process flow, and has made major breakthroughs in the field of advanced packaging. In addition, the company also strengthens cooperation with other enterprises and scientific research institutions to jointly promote the development of semiconductor manufacturing technology and achieve technology iteration and upgrading.
Part V: Looking to the Future
With the rapid development and transformation of the global semiconductor industry, the breakthroughs and achievements made by JCET in the field of packaging and testing will provide important support and promotion for the development of China's semiconductor industry. In the future, JCET will continue to increase investment in technology and equipment, maintain a leading position in technology, and carry out in-depth cooperation with more customers and partners to provide more and better products and services.
At the same time, the Chinese government will continue to increase support for the semiconductor industry, encourage enterprises to strengthen independent innovation and international cooperation, and enhance technical level and market competitiveness. It is believed that with the strong support of the government and the independent innovation of enterprises, China's semiconductor industry will usher in a better future.