In fact, this article is still inheriting the content of the previous article of the old high:
There is a widespread "phobia of insufficient performance" in the domestic market, and manufacturers are following this trend
Many people (not just Xiaobai) come to buy laptops with more or less the following two mentalities:
- Buy a good heat dissipation, and strong performance can be used for a few more years
- I can't use high performance for the time being, but I leave a little rich, what if I learn PS, PR, and modeling in the future?
In addition to that, there is also psychology
- Even if the perception of mixed materials is not strong, why am I poor
- The machine with poor heat dissipation cannot hold down the XX hardware, and the flatness is less than my performance
When consumers have demand, manufacturers who respond quickly will quickly change, launch products, and occupy the market
For example, in 18 years, the small new Air series is still based on the light and thin workmanship as the selling point, and in 20 years, it has completely changed to sacrificing thickness and part of the workmanship, in exchange for a high configuration-price ratio and the corresponding performance release.
According to the different focus of consumer groups, timely changes show that manufacturers seriously investigate the market, listen to consumer opinions, and make changes that are more in line with the needs of the public, which is a good thing.
Similarly, too late, just like the former Xiaobai only recognizes the I7 alone, the manufacturer will do 4-core I7 + MX110 electronic waste harvest leeks, change the demand for flavor, bring deformed configuration, and become a completely bad thing
So, is it going in the wrong direction?
I think that if it is within the standard of light and thin, moderate pursuit of heat dissipation is obviously a good thing,
Under the premise of ensuring portability, the mold has a stronger ultimate heat dissipation ability to give users more choices, with the adjustment of multi-gear performance modes
I can use the silent mode to ensure that the performance of the mold is still higher than the heat dissipation difference in the case of silent low temperature;
You can also turn on rage mode when you need performance, giving up some of the performance of the experience to burst out of the standard pressure level.
Representative products are Huawei MateBook 14 2020 Ryzen™ Edition and Lenovo Xiaoxin Pro13
They are about 16mm thickness and 1.5kg/1.3kg weight
It is slightly heavier than the traditional 13-inch thin and light 15mm, 1.3kg fuselage
However, under the premise that the portability gap is not large, it has brought enough CPU performance to drop many game books in seconds, and I believe that many people are not bad at this thickness and weight, and they may not be able to use such strong performance several times. (These computers are not advertising Ha, the old high is to do thermal conductive materials, there is a need for thermal grease, gel, potting adhesive, gaskets and other products to come to me again)
But in the pursuit of "cost-effective" at a lower price, performance is indeed a very important point, the market has also proved that this kind of machine is more popular
The biggest contradiction of this kind of book is whether manufacturers can set different performance modes and other means, so that consumers can flexibly switch between silent, low temperature, and high performance.
The competition for heat dissipation in the wrong direction is to run farther and farther on the road of heat dissipation.
For example, Lenovo Xiaoxin's fuselage of about 15 and 20mm has left the category of thin and light books, reaching the level of thin and light game books and creative design notebooks
With the advantages of high performance, large screen and large battery, Xiaoxin 15 can still bring considerable sales
However, in my eyes, he has gradually rushed in another direction- the road of the standard pressure alone light book, give him a single display, and you can fight with the Lingyue 7590/7591 bayonet
Lingyue 7590: 21mm, 1.72kg,
Lingyue 7591: 21mm, 1.82kg,
Xiaoxin 15: 20mm, 1.76kg
In the end, I can set my conclusions
Thickness weight does not increase significantly, excellent tuning, can easily switch in performance, low temperature, silent high limit heat dissipation ability thin and light, is a correct direction.
If you sacrifice too much portability for heat dissipation, and lose the original intention of the thin and light book, this becomes another thing, he can be an all-round book (half-hanging performance book), can be a creative design notebook, but not a thin and light book.
I am a kryptonian era elderly man, a post-90s engineering man, engaged in the thermal interface material industry for 7 years.
Our long-term tracking includes and is not limited to: intelligent manufacturing, semiconductors, 5G, digital technology, electronic components and other fields, in the new round of technological revolution and capital flows, we aspire to be the team that understands the thermal interface material technology best.
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