Asus Lingyao ProAX11000 dismantling machine 1.Heat dissipation method is three heat sinks sandwiched between two layers of motherboard 2.CPU: Broadcom BCM49122.0GHz quad core 64
author：Brother Xiaochun who knows electricity
Asus Lingyao Pro AX11000 dismantling machine
1. The heat dissipation method is that three heat sinks are sandwiched between the two layers of the motherboard
2. CPU: Broadcom BCM4912 2.0GHz quad core 64-bit
3. Memory: K4A4G16 1GB
Flash: MX30LF2G28AD-TI 256MB
5. Switch chip: BCM50991
6. 5G_1 wireless chip: Broadcom BCM6715
7. 5G_1 power amplifier chip: SKY85843-21
8. 5G_2 wireless chip: Broadcom BCM6715
9. 5G_2 power amplifier chip: SKY85843-21
10. 2.4G wireless chip: Broadcom BCM6715
11. 2.4G power amplifier chip: SKY85331-21
Antenna part, a total of 8 antennas, 4 2.4G and 5G_1
Four independent antennas for 5G_2 Chips are considered to be the current top-to-top Broadcom solution
As for the actual performance, the previous dynamic has been slightly spoiled
For more information, please follow the detailed review video released tomorrow
Asus Lingyao ProAX11000 dismantling machine 1.Heat dissipation method is three heat sinks sandwiched between two layers of motherboard 2.CPU: Broadcom BCM49122.0GHz quad core 64
Asus Lingyao ProAX11000 dismantling machine 1.Heat dissipation method is three heat sinks sandwiched between two layers of motherboard 2.CPU: Broadcom BCM49122.0GHz quad core 64
Asus Lingyao ProAX11000 dismantling machine 1.Heat dissipation method is three heat sinks sandwiched between two layers of motherboard 2.CPU: Broadcom BCM49122.0GHz quad core 64
Asus Lingyao ProAX11000 dismantling machine 1.Heat dissipation method is three heat sinks sandwiched between two layers of motherboard 2.CPU: Broadcom BCM49122.0GHz quad core 64
Asus Lingyao ProAX11000 dismantling machine 1.Heat dissipation method is three heat sinks sandwiched between two layers of motherboard 2.CPU: Broadcom BCM49122.0GHz quad core 64
Asus Lingyao ProAX11000 dismantling machine 1.Heat dissipation method is three heat sinks sandwiched between two layers of motherboard 2.CPU: Broadcom BCM49122.0GHz quad core 64
Asus Lingyao ProAX11000 dismantling machine 1.Heat dissipation method is three heat sinks sandwiched between two layers of motherboard 2.CPU: Broadcom BCM49122.0GHz quad core 64
Asus Lingyao ProAX11000 dismantling machine 1.Heat dissipation method is three heat sinks sandwiched between two layers of motherboard 2.CPU: Broadcom BCM49122.0GHz quad core 64
Asus Lingyao ProAX11000 dismantling machine 1.Heat dissipation method is three heat sinks sandwiched between two layers of motherboard 2.CPU: Broadcom BCM49122.0GHz quad core 64
