At the special event to unveil the new iPad Pro, Apple introduced the heat dissipation improvements of the new iPad Pro, including the addition of copper to the back logo.
I didn't know what it meant, but I didn't know it after reading the dismantling, and it turned out to be a wonderful use.
Recently, the Phone Repair Guru channel released a teardown video of the iPad Pro 13-inch. From the teardown video, you can see the M4 chip, which is located in the middle of the motherboard and the body, as shown in the figure:
As Apple said, after grinding off the surface coating, I saw the copper inside the LOGO, as shown in the picture:
Coincidentally, the M4 chip and the logo on the back are right next to each other. In other words, the addition of copper LOGO just dissipates heat to the M4 chip, which is equivalent to a heat sink.
In this way, the heat generated by the M4 chip can be partially carried out by the LOGO, and the heat dissipation efficiency will naturally be improved.
△ Peel off the motherboard's cooling sticker
In addition, this will be a huge benefit to active cooling tools, such as etc. With this "face-to-face" thermal conductivity relationship, the efficiency of active heat dissipation tools will be greatly improved.
That's it, enough for the iPhone 15 Pro series with a "dangling" motherboard to learn for a year.
In addition, as you can see from the teardown video, the new iPad Pro is thinner, even thinner than the new iPad Air, but it is also more "crispy", please see the following two GIFs:
It's just half a butt to sit on.