IT House news on May 30, according to foreign technology media WikiChip, the SRAM density of TSMC's N3 process node and N5 process node are basically the same.
TSMC recently held the 2023 Technical Symposium to show more information about the N3 node lineup. The slides at the workshop show that although the N3 process has improved logic density, the SRAM density is basically the same.
From the perspective of chip miniaturization in recent years, SRAM density is significantly slower than chip logic density, which will inevitably bring greater challenges to the progress of more advanced chip processes in the future.
TSMC initially claimed that N3B SRAM density was 20% higher than the N5 process, while the latest information shows that SRAM density is only 5% higher.
SRAM is the bulk of the cost of processor transistors, etc., and in the absence of density improvements, it will undoubtedly drive up the manufacturing cost of N3B.